The semiconductor industry stands at one of its most pivotal moments. As AI drives explosive demand for computing power, chip manufacturing grows exponentially - die sizes are scaling, tolerances are tightening, and the margin for error has nearly vanished."Explaining the complexity isn't easy," says Ahmad Khan, President of Semiconductor Products and Customers at KLA. "Picture a six-lane highway. A decade ago, you could cruise down the middle, drift left or right - no problem. Today? Same highway, but cars are doing 200 miles per hour with gaps the width of a human hair between them. One wrong move causes catastrophe." This isn't traditional manufacturing anymore, he notes. "It's artisanal work. Exceptionally difficult work."KLA's philosophy in this environment is fundamental yet profoundly important: the company doesn't change the wafer - it observes it. That distinction defines KLA's entire approach. While other equipment modifies, deposits or etches, KLA provides the visibility and insights that allow customers to more tightly manage the complexity of semiconductor manufacturing. In this era where advanced wafers cost $15,000 to over $30,000 each and fabs produce 100,000 monthly, the ability to "see" every nanometer with absolute precision is essential.This capability is important for almost all semiconductor manufacturers, and particularly in Taiwan, which is home to nearly 90% of the world's advanced semiconductor production. The gravity of this ecosystem is one of the key reasons KLA recently opened its new Hsinchu headquarters and its largest Learning and Knowledge Services (LKS) Training Center - a combined US$15.5 million (NT$465 million) investment that underscores the company's commitment to staying close to customers.35 Years Strong: A $15.5 Million Vote of ConfidenceKLA's new Taiwan headquarters in Hsinchu's Tai Yuen Hi-Tech Industrial Park, with WELL certification. Credit:KLAThe investment breaks down to US$10.5 million (NT$315 million) for the new office and US$5 million (NT$150 million) for the training center. Located in Tai Yuen Hi-Tech Industrial Park Phase IX, the headquarters spans 10,000 square meters across two floors, accommodating up to 1,000 employees. The facility earned WELL certification - reflecting KLA's focus on employee wellbeing.KLA first set up shop in Taiwan in 1990. Khan himself has been coming here since those early days. "Back in the '90s, downtown Hsinchu had one hotel. One," he recalls. "The semiconductor sector was just getting started." What he found were engineers trickling back from Motorola, Texas Instruments, and Intel - talented people who returned when Morris Chang and other pioneers decided Taiwan was ready to build fabs."The transformation has been remarkable," Khan says, attributing the growth to what he calls "the Taiwan spirit" - relentless work ethic, intense collaboration, and a willingness to challenge conventions and push for excellence. "This industry is incredibly challenging," Khan acknowledges. "There's nothing harder. You can work yourself to the bone, pour in capital, and still fail completely. But so many of the players in Taiwan have figured it out and continue finding success. We’re honored to be a part of it."Today, KLA Taiwan employs roughly 1,800 people spread across Hsinchu, Kaohsiung, Tainan, Taoyuan, Linkou, and Taichung, with plans to surpass 2,000 by year-end 2026 as customer demand surges.KLA's Largest Training Center: Where Innovation Meets EducationThe LKS Training Center covers 2,950 square meters, including 825 square meters of Class 100 cleanroom, and features 14 classrooms, an AR/VR immersive learning center, four engineering labs, and a chemical analysis lab.With millions of configuration modes, KLA's systems can't simply be switched on. Customers often need PhD- and master's-level engineers who can dial in exact settings for their specific needs. That's one of KLA’s primary motivations for investing in training infrastructure close to customers.The new training center combines classroom instruction, hands-on practice, and immersive simulations to accelerate learning. Beyond training KLA's own people, it is also designed to help customers' fab teams sharpen skills and get to yield faster on new technologies.Building Talent for the Long HaulWhile the larger semiconductor industry continues to face a talent crunch, KLA emphasizes steady hiring and long-term career growth. The company runs disciplined forecasts to determine staffing needs, avoiding boom-and-bust waves.KLA Taiwan values talent development and their long-term career growth, building a young and dynamic team. Credit:KLAKLA's talent strategy rests on three pillars:Extensive Campus Recruiting: KLA hires substantial numbers of fresh graduates and promotes from within, building loyalty and institutional knowledge over time.80-90% Internal Promotion: The company thinks long-term when hiring, creating clear career paths from customer support teams to application teams and engineering teams . People can climb technical ladders or switch to management based on their strengths.University Partnerships: KLA engineers give tech talks and teach courses at leading local universities. The company sees it as paying forward, training the next generation who'll work across the industry.The company seeks candidates with physics, mechanics, math, and computer science backgrounds. "We're mainly physics folks because we deal in optics, photons, electrons," Khan explains. With the new facilities, KLA Taiwan is actively recruiting positions across application engineering, field service, R&D, customer support, and sales and marketing.Why Process Control Became Make-or-BreakAs die sizes grow and devices get more complex, process control has gone from important to mission critical. Each new node brings tighter design rules, smaller features, and narrower process windows. Customers are printing tinier features, and yield becomes inversely proportional to the smallest printable feature.The stakes are incredibly high, both technologically and financially. When something goes wrong, thousands of wafers stack up behind the problem, with each carrying enormous economic weight.The AI chip challenge compounds the problem: mobile chips packed 20 billion transistors, but today's AI chips contain hundreds of billions of transistors. Die sizes have exploded. The math is brutal - if you have 10 dies per wafer and one fails, you still have nine. But if you only get two giant dies per wafer and one fails, you've lost 50%. All AI chips use massive dies, creating brutal complexity for customers.KLA's comprehensive portfolio - from BBP optical inspection to e-beam platforms to overlay metrology - monitors thousands of parameters across more than 1,000 process steps. If one step fails, yield can very quickly drop to zero.The industry shift is clear: customers are buying significantly more process-control tools because they need yield faster. Khan describes it through a straightforward lens - As semiconductor manufacturing becomes harder, KLA's capabilities become more critical, especially when a single excursion can cost hundreds of millions of dollars.AI Integration and What's NextKhan frames AI not as a trend or fashion, but as an inevitable evolution. After millions of years of biological evolution produced human neural networks - networks that gave humanity its competitive edge - the next step was always going to be artificial neural networks. This wasn't any individual's invention; it was the natural progression of how intelligence develops and scales. The universe, he suggests, essentially selects for the species with the most connected neurons. Now that same principle is extending to how we use machines to amplify our own neural connections.KLA is integrating AI directly into its tools to sharpen defect classification and speed root-cause analysis. The technology also transforms service support: every engineer now essentially walks around with an expert in their pocket. When an engineer encounters a problem, the AI network can instantly surface solutions from decades of collective troubleshooting experience. Ultimately, AI is enabling faster solutions, more productive engineers and more satisfied customers.This matters because KLA's systems use AI, customers build AI chips, and AI is reshaping every part of the manufacturing chain. It's a fundamental transformation, not a passing phase.Looking ahead, KLA is developing panel-based inspection systems (volume production expected around 2028) and high-NA EUV systems. Khan, who's spent about 30 years in the industry, maintains the semiconductor industry hasn't peaked. His reasoning is straightforward: computing demand will always trend upward, not downward. Until the walls aren't made of silicon, there's room to grow.Join the TeamKhan sums up KLA's hiring philosophy simply: maintain a stable plan, partner with universities, train people well, and grow them over time. They become advocates, which brings company success—and through that success, customers succeed.For engineering graduates and professionals interested in joining KLA Taiwan's 1,800-plus team, opportunities span application engineering, R&D, customer support, and sales and marketing. To explore opportunities, you may visit our KLA Careers or follow KLA Taiwan Facebook Fan page.

Trymax Semiconductor B.V. provides plasma-based etching, stripping, and curing process equipment for advanced semiconductor packaging, targeting applications in dry descum, ashing, surface preparation, light etching and processing, as well as UV photoresist curing and charge erase. It also manufactures UV curing equipment, focusing on equipment used in compound semiconductor processes. These equipment are used in the production of wide-bandgap semiconductor power devices such as silicon carbide (SiC) and gallium nitride (GaN), as well as other important processes such as communication power amplifiers (PAs). Trymax has been established for over 25 years and has a considerable customer base and brand recognition in the Taiwanese market. At Semicon Taiwan 2025, the company primarily serves to promote its products and connect with key clients. With a product portfolio ranging from 100mm to 300mm wafer size, Trymax's clients are on both sides of the Taiwan Strait becoming major suppliers to the manufacturers of power amplifiers and RF components. In the global presence, Trymax has significant market shares at foundries, IDMs and wafer level packaging houses for end applications in Power semiconductor, automotive, MEMS, LED and CMOS. Trymax's NEO series plasma dry descum systems are suitable for cleaning and activation processes in the semiconductor industry, offering high efficiency, uniformity, and repeatability. These systems utilize RF/microwave power to generate high-energy, disordered plasma under vacuum conditions. They can process a wide range of substrate sizes and offer a variety of processing technologies for flexible customer selection, meeting the needs of diverse semiconductor process technologies. Trymax continuously innovates to support its customers' needs. In addition to the compound semiconductor processes, it is also widely used in application fields such as MEMS microelectromechanical systems, microfluidic devices, SOI substrate manufacturing, advanced packaging and optoelectronic displays. Among them, the global installed capacity of NEO system equipment has exceeded 300 sets.

AGI Technology, the innovative Taiwanese memory brand, has successfully concluded its showcase at CES 2026. Located at Bellini 2001B in The Venetian Resort, Las Vegas, AGI presented its next-generation high-speed and mobile storage solutions under the theme "Powering What's Next with AGI Innovation", attracting interest from global brand partners, system integrators, and professional creators.With the rapid proliferation of AI in PCs and mobile devices, the demand for high-resolution media, real-time content generation, and edge AI applications has been surging. AGI emphasizes that storage is no longer just about capacity; it has become a critical factor determining system performance, bandwidth, mobility, and reliability.The AGI President, Miranda Lee, stated, "High-speed and high-capacity storage are now a market baseline. The differentiator lies in aligning solutions with real-world usage scenarios and maintaining consistent supply and quality. In the fast-changing AI era, AGI continuously adapts its product strategy and brand positioning to meet market expectations for practical usability."CES 2026 Product Highlights: Empowering High-Performance ComputingTo support the demands of AI and high-performance applications, AGI showcased its complete next-generation storage lineup, focusing on high-performance platforms and mobile usage:1.PCIe Gen5 SSD (Project S10): Designed for intensive workloads, delivering top-tier performance while managing power consumption and heat dissipation for sustained stability.2.DDR5 Overclocking Memory (Project K10): Engineered for AI-driven platforms and high-end gaming, offering extreme bandwidth to handle complex, high-speed data processing, ensuring stability.3.Portable SSD Series: Tailored for mobile content creation and outdoor professionals, the PSSD series emphasizes durability and high-speed transfer to ensure creative work and memories are quickly and securely preserved.A User-Centric Approach for Global MarketsThe AGI President Miranda Lee further noted that AI not only accelerates the capacity demands but also reshapes how data is accessed and transferred, making portable storage essential to modern creative workflows. Rather than competing solely on technical specifications, AGI focuses on user scenarios, integrating long-term value and stability into the product design. During CES, AGI engaged in in-depth technical and market discussions with global partners, strengthening its international distribution network through its precise product roadmaps.  Looking Forward: Stability and Practicality at the Core of the BrandCES 2026 served as a pivotal milestone for AGI's expansion. Moving forward, AGI will continue investing in high-speed interfaces and performance optimization, ensuring its products deliver outstanding stability in real-world scenarios, staying true to the brand promise: Preserve Your Uniqueness.AGI is a leading provider of high-performance storage solutions, dedicated to delivering innovative products that cater to the evolving needs of its customers. With a commitment to offering cutting-edge storage capacity and superior performance, AGI empowers users with reliable solutions for an enhanced digital experience.AGI GR0NNLUX 10K showcased DDR5 Overclocking RGB Memory Module. Credit: AGITechnologyAGI's booth saw a steady stream of visitors, highlighting strong market interest. Credit: AGI TechnologyAGI's booth saw a steady stream of visitors, highlighting strong market interest. Credit: AGI Technology

HQ Pack is a global leader in high-tech packaging solutions. The company is expert at designing, producing, (precision) cleaning, and making packaging solutions reusable again after use, as well as manage the packaging logistics of high-quality industrial products. They do so for clients in the semiconductor and other high-tech industries. The process procedures and packaging solutions ensure the parts, modules or components of highly sophisticated equipment are fully protected during transportation and logistical arrangements. And at the same time, the system will meet the customer demand for protection of valuable products during transit while adhering to environmental, social, and governance (ESG) principles. The packaging design incorporates features like sustainable materials, waste reduction strategies, and carbon footprint minimization, alongside ensuring the integrity of high-value goods through robust physical protection. The company provides complete packaging solutions, starting with the development and sourcing of customized packaging materials. HQ Pack's regional Service Centers ensure that reusable packaging materials are ready to use again by cleaning and repairing them to like-new condition. They can also support reuse of parts by harvesting them before scrapping for new build packaging. If there is material destined for waste management, HQ Pack supports this at the same time.Because most of its high-tech clients operate on a global scale, HQ Pack operates not only at its headquarters in Eindhoven, the Netherlands, but also in Johor and Penang in Malaysia, Taiwan, Singapore, Germany, and in the United States (locations in Brookfield (CT), Newark (CA), and San Diego (CA)) providing the same quality and service at each location. With their Service Centers they support both their customers' sustainability goals as well as their own. Their slogan "We Create to Protect" is exactly what they do. The high-quality packaging solutions ensure that valuable and fragile products, modules, components and/or parts can be safely transported worldwide. With over 40 years of experience and global presence, no compromission on quality, flexibility at the heart of our organization, they are a full-service provider with fast, reliable and sustainable packaging solutions.

Generative AI is fueling accelerated growth in worldwide computing power requirements, yet the industry encounters significant challenges. Although the product cycle for GPUs and AI servers has been condensed to approximately 18 months, the conventional data center construction process remains at two to three years, resulting in a structural gap where the deployment of computing capacity lags behind technology advancements.Supermicro, in collaboration with Easy Field Corporation (EFC) and Chicony Power, has unveiled the world’s first containerized compute solution built on Data Center Building Block Solutions (DCBBS). This solution is designed to expedite engineering delivery timelines and offers an alternative approach to the construction of AI infrastructure. Originally developed by Supermicro, DCBBS is a comprehensive, modular data center architecture aimed at accelerating large-scale compute deployments.In this DCBBS solution, Taiwan's Institute for Information Industry (III) acts as a coordinator for industry integration, connecting resources from IT, infrastructure, engineering consulting, and manufacturing to ensure that all stakeholders comply with a unified delivery timeline.Wang Rui-min (transliterated from Chinese), Senior Strategy Director of the Market Intelligence & Consulting Institute (MIC) at III, explained that AI computing power initiatives involve various components and parts, such as servers, networking devices, power supplies, cooling infrastructure, structural engineering, testing procedures, and international certifications. Historically, inadequate coordination methods often led to asynchronous delivery within these categories.Simon Hsu, COO of Taiwan's National Applied Research Laboratories (NARLabs), observed that traditional data center construction methodologies are inadequate in accommodating the progress of AI technology. Computing power has become a crucial resource for scientific research and industrial development, with the speed of deployment significantly impacting the evolution of both research and applications. In this context, modular and rapidly replicable computing power supply models are garnering attention.The DCBBS solution, collaboratively developed by Supermicro and several Taiwanese manufacturers, utilizes a methodical design approach. It first develops the overall data center architecture, then deconstructs tasks such as power supply, cooling, networking, fire safety, and administration into modular components.Huang Shih-chin (transliterated from Chinese), Product Manager for Supermicro's Rack Solutions, stated that this solution explicitly demonstrates computing power density in its technical specifications, addressing the requirements of various GPU generations, and introduces the notion of "Container Scale," enabling the expansion of computing power on a container-by-container basis. The engineering design prioritizes uninterrupted water, electricity, and network connectivity.The generator, transformer, chiller, and UPS are arranged in a containerized configuration, equipped with wireless environmental control and remote monitoring systems, facilitating mobility and rapid deployment of the computing units. The container is designed according to weight, stress absorption, external circumstances, and transportation certification standards, rather than conventional container specifications. The test line construction and burn-in verification have been completed, and the DCBBS system has entered the final acceptance and shipment phase.In the DCBBS project, EFC used an engineering methodology to complete system integration tasks for computing resource deployments. Chairman Paul Luo stated that, while AI servers are expensive, the primary elements determining computing power competitiveness are deployment timeframes and engineering dependability; delays or system failures result in expenditures that much surpass hardware expenses. Thus, EFC used a modular approach to organize the structural design, vibration mitigation, transportation, and certification requirements for the outdoor installation of large, high-density equipment in atypical environments, before transferring these components to the factory for assembly and verification. Luo indicated that, moving forward, computing containers will primarily be deployed in areas rich in energy resources.Consequently, what is truly finite is not electricity itself, but the ability to swiftly replicate and maintain the level of engineering execution. EFC, possessing extensive expertise in the production of large-scale structures and high-reliability systems, ensures that its computer cabinets are thoroughly prepared for acceptance and delivery before shipment. They are considered the fundamental framework and structure of the entire computing center, enabling future expansion within a managed and foreseeable technical timeline.In terms of work division, Supermicro is in charge of coordinating the full rapid delivery process, drawing on its significant experience with high-density computing clients. In recent years, the company has obtained AI processing power contracts, including those from Tesla, gaining engineering experience in high-density configurations and fast delivery, which has become a critical basis for minimizing deployment delays. Chicony Power oversees the wireless environmental control system, employing sensors, digital twins, and remote-control technology to mitigate the effects of conventional extensive cabling on deployment efficiency, hence facilitating expedited scheduling and replication of computing cabinets.EFC monitors the structural engineering design and, using its expertise in ship door manufacture, has ensured the structural integrity, vibration mitigation, and marine certification compliance for large, high-density equipment employed in outdoor settings. On the power infrastructure side, a modular Power Interface Unit (PIU) developed under the Taiwan Busway (TBC) project enables flexible and scalable power configuration. Sinotech Engineering Consultants also contributed to the end-to-end planning of JBL’s large-scale computing center in Indonesia. Overall, the DCBBS-based initiative has now entered the active implementation phase.Hsieh Chieh-shou (transliterated from Chinese), a director on Viscor Computing's board, stated that the DCBBS project is not intended as a conceptual demonstration but as an engineering solution based on the principles of deliverability and replicability.Unlike other teams that are still engaged in architectural design and strategic planning, the DCBBS project, led by Supermicro, EFC, and Chicony Power, has completed the setup of operational test lines, which include physical equipment integration, power configuration, and burn-in verification, and is ready to advance to the replication and delivery phase. As this model evolves, the team has been emulating the collaborative strategy of "national second-tier teams," thereby broadening the participation of Taiwanese firms possessing engineering and manufacturing expertise. This enables the metal and electromechanical sectors, which have faced challenges due to shifts in the global industrial landscape in recent years, to venture into computing infrastructure and pursue an additional transformation opportunity.Wang noted that the delivery approach of the DCBBS project offers significant advantages for implementing enterprises in both financial and engineering aspects. In engineering, factory modularization and pre-integration—including wiring, labeling, performance verification, and burn-in testing—conducted prior to shipment can substantially diminish the uncertainty and risk associated with repeated modifications during onsite construction abroad. Financially, acceptance and payment can come quickly after testing, shortening the project payback period and reducing foreign deployment and travel costs. He stated that this design allows computing power efforts to evolve into a business model with predictable delivery and cash flow patterns, rather than long-term investment ventures with low returns.Building on this foundation, the DCBBS project has evolved from a single compute cabinet into a sustainably scalable, modular system architecture. The team will subsequently release modules pertaining to generators, transformers, UPS, chiller units, control rooms, and coatings, while including a new 800V DC power architecture and cooling-in-rack design to improve the overall system's integrity and adaptability. Essential technical tasks, such wiring, labeling, integration, and testing, are consistently performed in Taiwan, thereby mitigating the unpredictability of international construction and expediting acceptance and payment processes. Wang emphasized that the core value of the DCBBS initiative lies not only in improving engineering and financial efficiency, but also in retaining the majority of high value-added integration and verification work in Taiwan, laying a sustainable foundation for long-term industrial competitiveness in the AI era.Taiwan-built DCBBS delivers deployable, scalable compute architecture. Credit: Easy Field Corporation

EDOM Technology (TWSE: 3048), Asia’s best solutions provider, today announces the introduction of NVIDIA Jetson T4000 edge AI module, addressing the growing demand from system integrators, equipment manufacturers, and enterprise customers for balanced performance, power efficiency, and deployment flexibility. With powerful inference capability and a lightweight design, NVIDIA Jetson T4000 enables faster implementation of practical physical AI applications.Powered by NVIDIA Blackwell architecture, NVIDIA Jetson T4000 supports Transformer Engine and Multi-Instance GPU (MIG) technologies. The module integrates a 12-core Arm Neoverse-V3AE CPU, three 25GbE network interfaces, and a wide range of I/O options, making it well suited for low-latency, multi-sensor, and real-time computing requirements. In addition, Jetson T4000 features a third-generation programmable vision accelerator (PVA), dual encoders and decoders, and an optical flow accelerator. These dedicated hardware engines allow stable AI inference even under constrained compute and power budgets, making the platform particularly suitable for mid-range models and real-time edge applications.For system integrators (SIs), the modular architecture of Jetson T4000, combined with NVIDIA's mature software ecosystem, enables rapid integration of vision, sensing, and control systems. This significantly shortens development and validation cycles while improving project delivery efficiency especially for multi-site and scalable edge AI deployments.For equipment manufacturers, Jetson T4000's compact form factor and low-power design allow flexible integration into a wide range of end devices, including advanced robotics, industrial equipment, smart terminals, machine vision systems, and edge controllers. These capabilities help manufacturers bring stable AI inference into products with limited space and power budgets, accelerating intelligent product upgrades.Enterprise users can deploy Jetson T4000 across diverse scenarios such as smart factories, smart retail, security, and edge sensor data processing. By performing inference and data pre-processing at the edge, organizations can reduce system latency, lower cloud workloads, and improve overall operational efficiency - while maintaining system stability and deployment flexibility.In robotics and automation applications, Jetson T4000 features low power consumption, high speed I/O and compact footprint make it an ideal platform for small mobile robots, educational robots, and autonomous inspection systems, delivering efficient and reliable AI computing for a wide range of automation use cases.NVIDIA Jetson product lineup spans from lightweight to high-performance modules, including Jetson T4000 and T5000, addressing diverse requirements ranging from compact edge devices and industrial control systems to higher-performance inference applications. With NVIDIA's comprehensive AI development tools and SDKs, developers can rapidly port models, optimize inference performance, and seamlessly integrate AI capabilities into existing system architectures.Beyond supplying Jetson T4000 modules, EDOM Technology leverages its extensive ecosystem of partners across chips, modules, system integration, and application development. Based on the specific development stages and requirements of system integrators, equipment manufacturers, and enterprise customers, EDOM provides end-to-end support - from early-stage planning and technical consulting to ecosystem enablement. By sharing ecosystem expertise and practical experience, EDOM helps both existing customers and new entrants to the edge AI domain quickly build application capabilities and deploy edge AI solutions tailored to real-world scenarios.For more information on NVIDIA Jetson T4000, please visit website.

Seoul, January 6, 2026 – SK hynix Inc. (or "the company", www.skhynix.com) announced today that it will open a customer exhibition booth at Venetian Expo and showcase its next generation AI memory solution at CES 2026, in Las Vegas from January 6 to 9 (local time).The company said that, "Under the theme 'Innovative AI, Sustainable tomorrow' we plans to showcase a wide range of next generation memory solutions optimized for AI and will work closely with customers to create new value in the AI era."SK hynix has previously operated both a SK Group joint exhibition and a customer exhibition booth at CES. This year, the company will focus on the customer exhibition booth to expand touchpoint with key customers to discuss potential collaboration.The company showcases 16-layer HBM4 product with 48GB, next generation HBM product, for the first time during the exhibition. The product is the next generation product of 12-layer HBM4 product with 36GB, which demonstrated industry's fastest speed of 11.7Gbps, and is under development aligned with customers' schedules.12-layer HBM3E product with 36GB which will drive the market this year will also be presented. In particular, the company will jointly exhibit GPU modules that have adopted HBM3E for AI servers with customer and demonstrate its role within AI systems.In addition to HBM, the company plans to showcase SOCAMM2, a low-power memory module specialized for AI servers, to demonstrate the competitiveness of its diverse product portfolio in response to the rapidly growing demand for AI servers.Also, SK hynix will exhibit its lineup of conventional memory products optimized for AI, demonstrating its technological leadership across the market. The company will present its LPDDR6, optimized for on-device AI, offering significantly improved data processing speed and power efficiency compared to previous generations.In NAND flash, the company will present its 321-layer 2Tb QLC product, optimized for ultra-high capacity eSSDs, as demand surges from rapid expansion of AI data centers. With best-in-industry integration, this product significantly improves power efficiency and performance compared to previous generation QLC products, making it particularly advantageous in AI data center environments where lower power consumption is needed.The company will set up an 'AI System Demo Zone' where visitors can experience how its AI system memory solution that is being prepared for the future, interconnect to form AI ecosystem.In this zone, the company will present customized cHBM optimized for specific AI chip or system, PIM based AiMX, CuD which conducts computing in memory, CMM-Ax that integrated computing capabilities into CXL memory, and Data-aware CSD.For cHBM(Custom HBM), due to specific interest from customers, a large-scale mock-up has been prepared to allow visitors to visually sight its innovative structure. As the competition of the AI market shifts from mere performance to inference efficiency and cost optimization, this visualizes a new design approach that integrates part of computation and control functions into HBM which was handled by conventional GPU or ASIC in the past."As innovation triggered by AI accelerates further, customers' technical requirements are evolving rapidly," Justin Kim, President & Head of AI Infra at SK hynix, said. "We will meet customer needs with differentiated memory solutions. With close cooperation with customers, the company will create new value to contribute to the advancement of the AI ecosystem."SK hynix's next-generation AI memory products on display at CES 2026. Credit: SK hynix

Portwell, Inc., a leading provider of industrial and embedded computing solutions and a subsidiary of Posiflex Technology Inc., today announced its strategic investment in Wincomm Corporation, acquiring a 41% ownership stake and becoming its major shareholder.Wincomm Corporation, headquartered in Hsinchu, Taiwan, is a well-established innovator in the touchscreen computer market, with a strong foothold in medical equipment, smart healthcare and industrial automation sectors. Its diverse Human-Machine Interface (HMI) computer and display portfolio includes medical-grade panel PCs, embedded touch displays, and peripherals, as well as rugged industrial-grade solutions such as wide-temperature and high-brightness panel PCs, waterproof stainless-steel displays, and IECEx, ATEX, C1D2/C2D2-certified explosion-proof panel PCs."This investment marks a significant milestone in Portwell's growth direction," said Ken Guan, President of Portwell, Inc. "By joining forces with Wincomm, we are not only reinforcing our presence in the medical computing space but also expanding our capabilities across factory automation, petrochemical, and military applications. The synergy between our product lines and business models will enhance our overall competitiveness and customer satisfaction, while driving innovation in Edge AI and embedded computing."

As AI applications rapidly expand across PCs, mobile devices, and content creation workflows, there is a parallel surge in demand for high-resolution video, real-time generative content, and on-device inference. This transition is redefining storage within system architectures: it is no longer just a matter of capacity planning, but a critical determinant of performance, bandwidth, and reliability.To address this, AGI Technology has sharpened its strategy and will debut next-generation storage solutions at CES 2026, targeting the high-speed and usability demands of the AI era. PresidentMiranda Lee pointed out that while high specs are now "table stakes" across the market, the real differentiator going forward will be how well products adapt to real-world scenarios - and whether brands can sustain stable delivery and consistent quality.Miranda emphasized that AI is doing more than just driving capacity growth; it is fundamentally changing how data is utilized.First, edge computing and multi-task content creation are becoming the norm. This increases the frequency of data access and the need for mobility, transforming storage devices from auxiliary components into critical links in modern production workflows. Second, pricing dynamics are reshaping consumer behavior. As the cost of high-end storage and memory rises, the market is witnessing more "buy-down" purchasing and phased expansion: users tend to select mid-range configurations initially, supplementing capacity with external devices later. Third, high speed and capacity are increasingly becoming entry requirements rather than differentiators. With interfaces such as PCIe Gen4/Gen5 and USB4 continuing to advance, adhering to these specifications has become a baseline standard that all brands must meet.Consequently, AGI Technology is moving beyond differentiation through specifications alone. The company is transitioning its brand identity from a component manufacturer defined by performance metrics to a solutions provider centered on usage scenarios. This strategic realignment ensures that while AGI continues to advance speed and capacity benchmarks, it also integrates robust reliability and environmental durability into its core design philosophy. Miranda emphasizes that while performance is a baseline requirement, enhancing stability and durability addresses the practical demands of mobile and outdoor workflows. This comprehensive approach creates tangible added value for users requiring consistent performance under pressure.AGI Technology will center its CES presence around a scenario-driven strategy that prioritizes reliability and practical application. According to Miranda, CES has long served as a vital stage for showcasing AGI's technological prowess. However, the company's recent strategy emphasizes private, high-level briefings over traditional exhibit formats. By moving toward a semi-exclusive engagement model, AGI can more effectively align its product roadmap with customer needs, ultimately strengthening brand loyalty and enhancing the performance of its international channels.At CES 2026, AGI is set to translate its strategic vision into a powerhouse lineup of tangible innovations, headlined by next-generation storage solutions tailored for the AI era. Leading the charge is a 6nm PCIe Gen5 SSD capable of blistering speeds up to 11,000 MB/s. By leveraging an advanced 6nm process, AGI has significantly reduced power consumption and thermal overhead, making flagship-tier performance more accessible for real-world deployment. Complementing this is AGI’s 10,000 MT/s low-latency DDR5 RGB memory, built for the rigorous demands of AI-native platforms. Furthermore, AGI is expanding its portable portfolio with three specialized external SSDs catering to content creators, outdoor adventurers, and power users, reinforcing the brand's focus on versatile, high-speed data management.Miranda emphasized that for AGI Technology, 2026 marks more than just another hardware iteration; it represents a strategic pivot in both brand identity and operational philosophy. The company is steadily evolving from a component supplier into a user-centric storage solutions brand. While continuing to push the boundaries of PCIe and USB performance, AGI is doubling down on real-world utility - tailoring products to excel in mobility, professional content creation, and long-term data archiving.She emphasized that in an era of ubiquitous AI and high-performance computing, true value transcends raw benchmarks; it is defined by unwavering reliability when it matters most. Whether capturing a split-second extreme sports feat, a creator's unrepeatable live recording, or years of cherished family milestones, storage devices house more than just data - they safeguard irreplaceable moments. Through a commitment to durable, high-performance design, AGI Technology aims to earn user trust across every scenario, transforming their brand promise, 'Preserve Your Uniqueness,' from a slogan into a lifelong digital legacy.Project K10 DDR5 - 10,000 MT/s Overclocking Flagship.Credit: AGI TechnologyProject S10 PCIe Gen5 SSD - 11,000 MB/s Performance with TSMDC 6nm Controller.Credit: AGI TechnologyNew Series of Portable SSD – Combination of High-Speed, Durability and Capacity.Credit: AGI Technology

As the world faces urgent climate challenges, governments worldwide are pledging to reach net-zero emissions by 2050, positioning clean energy at the core of energy transitions. Solar photovoltaic (PV) systems, known for their renewable and low-pollution attributes, have emerged as a crucial pillar in global net-zero strategies. However, as the solar market expands rapidly, a wave of PV module decommissioning is emerging. Recycling has become an increasingly pressing environmental issue. According to estimates from the International Renewable Energy Agency (IRENA), the cumulative volume of end-of-life solar panels awaiting recycling will reach 730 million tons by 2050, creating an urgent and massive processing demand.In response, TSGC has introduced its innovative PV Circulator solution, featuring a unique physical, chemical-free, and heat-free dismantling technology rarely found globally. The solution enables complete separation of aluminum frames, glass, junction boxes, solar cells, back sheets and EVA layers - achieving a 99.3% material recovery rate. In recent years, TSGC has partnered with multiple recycled-materials companies to establish a circular materials ecosystem. The company will also showcase a breakthrough hydrogen-production technology - using recovered crystalline-silicon solar cells - at CES 2026, signaling its ambition to capture emerging opportunities in the global sustainable economy.TSGC Co-Founder and Distinguished Professor at the Department of Greenergy, National University of Tainan, Dr. Yao-Hsiang Fu, noted that current industry recycling technologies remain limited. Most recyclers remove only aluminum frames and wiring, while other components - difficult to separate at high purity - are typically incinerated in brick kilns and repurposed as tile materials. This results in the loss of high-value materials such as silver and silicon. "A single solar module contains approximately 0.6 kg of silicon and 4.8 grams of silver, representing far greater economic value than most people imagine," Fu emphasized. TSGC has already helped its partners obtain Taiwan's first license for PV module recycling and repurposing, marking a significant milestone for Taiwan's solar recycling industry.Rising ESG demands fuel the global sustainable economyTraditional PV recycling methods heavily rely on high-temperature thermal processing or chemical dissolution, which require significant energy consumption and may generate toxic gases and wastewater. Furthermore, these methods struggle to recover high-purity silicon wafers, silver, and copper in forms suitable for reuse. As a result, California has explicitly banned the disposal of solar panels through incineration or landfilling, accelerating the search for more environmentally friendly and economically viable recycling pathways.In 2024, TSGC received approval from the California Department of Toxic Substances Control (DTSC), becoming the seventh company in California certified for solar panel recycling - and the only company capable of fully dismantling and recovering all materials. TSGC is currently in discussions with the six existing recyclers in the state. By transferring collected PV modules to TSGC for processing, these companies will gain significantly higher material-recovery revenue than through conventional methods.Fu emphasized that as global sustainability awareness continues to rise, carbon-related regulations are rapidly evolving. For example, the EU's Carbon Border Adjustment Mechanism (CBAM) already requires imported products to demonstrate low - or negative-carbon footprints. Products without transparent material sourcing and emissions data will struggle to enter international markets. Therefore, PV recycling is no longer merely an environmental solution - it is becoming a strategic driver of circular-economy development and international trade competitiveness. Identifying this pivotal moment, TSGC is positioned to lead the industry with a complete system for material recovery, reuse, and hydrogen production.High mobility represents TSGC's key advantage in entering the US marketTSGC has partnered with Taiwan Tech Arena (TTA) to strengthen its global footprint through participation in major international exhibitions and increased media exposure. The company has received recognition at events such as CES in the United States and VivaTech in France, boosting its global visibility and indirectly contributing to the approval of its solar panel recycling license issued by the California Department of Toxic Substances Control (DTSC).Fu noted that the United States hosts numerous utility-scale solar farms, many of which are approaching their 20-year operational lifespan - making solar panel recycling an imminent challenge. The TSGC PV Circulator offers exceptional mobility, allowing for on-site disassembly and material separation directly at the project location, significantly reducing transportation costs and providing a major competitive edge in the U.S. market.Looking ahead, TSGC will continue leveraging Taiwan's green energy R&D capabilities and global collaboration opportunities to further expand the applications of recycled solar materials across the energy, chemical, and green manufacturing sectors, strengthening the company's strategic role in the global sustainable economy.Credit: TSGC