Generative AI is fueling accelerated growth in worldwide computing power requirements, yet the industry encounters significant challenges. Although the product cycle for GPUs and AI servers has been condensed to approximately 18 months, the conventional data center construction process remains at two to three years, resulting in a structural gap where the deployment of computing capacity lags behind technology advancements.Supermicro, Easy Field Corporation (EFC), and Chicony Power have jointly introduced the world's first DCBBS containerized data center solution. This solution is designed to expedite engineering delivery timelines and offers an alternative approach to the construction of AI infrastructure.In this DCBBS solution, Taiwan's Institute for Information Industry (III) acts as a coordinator for industry integration, connecting resources from IT, infrastructure, engineering consulting, and manufacturing to ensure that all stakeholders comply with a unified delivery timeline.Wang Rui-min (transliterated from Chinese), Senior Strategy Director of the Market Intelligence & Consulting Institute (MIC) at III, explained that AI computing power initiatives involve various components and parts, such as servers, networking devices, power supplies, cooling infrastructure, structural engineering, testing procedures, and international certifications. Historically, inadequate coordination methods often led to asynchronous delivery within these categories.Simon Hsu, COO of Taiwan's National Applied Research Laboratories (NARLabs), observed that traditional data center construction methodologies are inadequate in accommodating the progress of AI technology. Computing power has become a crucial resource for scientific research and industrial development, with the speed of deployment significantly impacting the evolution of both research and applications. In this context, modular and rapidly replicable computing power supply models are garnering attention.The DCBBS solution, collaboratively developed by Supermicro and several Taiwanese manufacturers, utilizes a methodical design approach. It first develops the overall data center architecture, then deconstructs tasks such as power supply, cooling, networking, fire safety, and administration into modular components.Huang Shih-chin (transliterated from Chinese), Product Manager for Supermicro's Rack Solutions, stated that this solution explicitly demonstrates computing power density in its technical specifications, addressing the requirements of various GPU generations, and introduces the notion of "Container Scale," enabling the expansion of computing power on a container-by-container basis. The engineering design prioritizes uninterrupted water, electricity, and network connectivity.The generator, transformer, chiller, and UPS are arranged in a containerized configuration, equipped with wireless environmental control and remote monitoring systems, facilitating mobility and rapid deployment of the computing units. The container is designed according to weight, stress absorption, external circumstances, and transportation certification standards, rather than conventional container specifications. The test line construction and burn-in verification have been completed, and the DCBBS system has entered the final acceptance and shipment phase.In the DCBBS project, EFC used an engineering methodology to complete system integration tasks for computing resource deployments. Chairman Paul Luo stated that, while AI servers are expensive, the primary elements determining computing power competitiveness are deployment timeframes and engineering dependability; delays or system failures result in expenditures that much surpass hardware expenses. Thus, EFC used a modular approach to organize the structural design, vibration mitigation, transportation, and certification requirements for the outdoor installation of large, high-density equipment in atypical environments, before transferring these components to the factory for assembly and verification. Luo indicated that, moving forward, computing containers will primarily be deployed in areas rich in energy resources.Consequently, what is truly finite is not electricity itself, but the ability to swiftly replicate and maintain the level of engineering execution. EFC, possessing extensive expertise in the production of large-scale structures and high-reliability systems, ensures that its computer cabinets are thoroughly prepared for acceptance and delivery before shipment. They are considered the fundamental framework and structure of the entire computing center, enabling future expansion within a managed and foreseeable technical timeline.In terms of work division, Supermicro is in charge of coordinating the full rapid delivery process, drawing on its significant experience with high-density computing clients. In recent years, the company has obtained AI processing power contracts, including those from Tesla, gaining engineering experience in high-density configurations and fast delivery, which has become a critical basis for minimizing deployment delays. Chicony Power oversees the wireless environmental control system, employing sensors, digital twins, and remote-control technology to mitigate the effects of conventional extensive cabling on deployment efficiency, hence facilitating expedited scheduling and replication of computing cabinets.EFC monitors the structural engineering design and, using its expertise in ship door manufacture, has ensured the structural integrity, vibration mitigation, and marine certification compliance for large, high-density equipment employed in outdoor settings. The modular power interface unit (PIU) designed for the Taiwan Busway (TBC) project allows for flexible power configuration extension. Sinotech Engineering Consultants assisted with the full planning of JBL's trillion-dollar computing center in Indonesia. DCBBS has started the practical project implementation phase.Hsieh Chieh-shou (transliterated from Chinese), a director on Viscor Computing's board, stated that the DCBBS project is not intended as a conceptual demonstration but as an engineering solution based on the principles of deliverability and replicability.Unlike other teams that are still engaged in architectural design and strategic planning, the DCBBS project, led by Supermicro, EFC, and Chicony Power, has completed the setup of operational test lines, which include physical equipment integration, power configuration, and burn-in verification, and is ready to advance to the replication and delivery phase. As this model evolves, the team has been emulating the collaborative strategy of "national second-tier teams," thereby broadening the participation of Taiwanese firms possessing engineering and manufacturing expertise. This enables the metal and electromechanical sectors, which have faced challenges due to shifts in the global industrial landscape in recent years, to venture into computing infrastructure and pursue an additional transformation opportunity.Wang noted that the delivery approach of the DCBBS project offers significant advantages for implementing enterprises in both financial and engineering aspects. In engineering, factory modularization and pre-integration—including wiring, labeling, performance verification, and burn-in testing—conducted prior to shipment can substantially diminish the uncertainty and risk associated with repeated modifications during onsite construction abroad. Financially, acceptance and payment can come quickly after testing, shortening the project payback period and reducing foreign deployment and travel costs. He stated that this design allows computing power efforts to evolve into a business model with predictable delivery and cash flow patterns, rather than long-term investment ventures with low returns.DCBBS has shifted from a monolithic computing cabinet to a sustainably scalable modular system architecture. The team will subsequently release modules pertaining to generators, transformers, UPS, chiller units, control rooms, and coatings, while including a new 800V DC power architecture and cooling-in-rack design to improve the overall system's integrity and adaptability. Essential technical tasks, such wiring, labeling, integration, and testing, are consistently performed in Taiwan, thereby mitigating the unpredictability of international construction and expediting acceptance and payment processes. Wang emphasized that DCBBS's fundamental value is enhancing engineering and financial efficiency while maintaining the majority of high-value-added integration and verification operations in Taiwan, thereby establishing a sustainable platform for industrial competitiveness in the AI era.Credit: Easy Field Corporation

EDOM Technology (TWSE: 3048), Asia’s best solutions provider, today announces the introduction of NVIDIA Jetson T4000 edge AI module, addressing the growing demand from system integrators, equipment manufacturers, and enterprise customers for balanced performance, power efficiency, and deployment flexibility. With powerful inference capability and a lightweight design, NVIDIA Jetson T4000 enables faster implementation of practical physical AI applications.Powered by NVIDIA Blackwell architecture, NVIDIA Jetson T4000 supports Transformer Engine and Multi-Instance GPU (MIG) technologies. The module integrates a 12-core Arm Neoverse-V3AE CPU, three 25GbE network interfaces, and a wide range of I/O options, making it well suited for low-latency, multi-sensor, and real-time computing requirements. In addition, Jetson T4000 features a third-generation programmable vision accelerator (PVA), dual encoders and decoders, and an optical flow accelerator. These dedicated hardware engines allow stable AI inference even under constrained compute and power budgets, making the platform particularly suitable for mid-range models and real-time edge applications.For system integrators (SIs), the modular architecture of Jetson T4000, combined with NVIDIA's mature software ecosystem, enables rapid integration of vision, sensing, and control systems. This significantly shortens development and validation cycles while improving project delivery efficiency especially for multi-site and scalable edge AI deployments.For equipment manufacturers, Jetson T4000's compact form factor and low-power design allow flexible integration into a wide range of end devices, including advanced robotics, industrial equipment, smart terminals, machine vision systems, and edge controllers. These capabilities help manufacturers bring stable AI inference into products with limited space and power budgets, accelerating intelligent product upgrades.Enterprise users can deploy Jetson T4000 across diverse scenarios such as smart factories, smart retail, security, and edge sensor data processing. By performing inference and data pre-processing at the edge, organizations can reduce system latency, lower cloud workloads, and improve overall operational efficiency - while maintaining system stability and deployment flexibility.In robotics and automation applications, Jetson T4000 features low power consumption, high speed I/O and compact footprint make it an ideal platform for small mobile robots, educational robots, and autonomous inspection systems, delivering efficient and reliable AI computing for a wide range of automation use cases.NVIDIA Jetson product lineup spans from lightweight to high-performance modules, including Jetson T4000 and T5000, addressing diverse requirements ranging from compact edge devices and industrial control systems to higher-performance inference applications. With NVIDIA's comprehensive AI development tools and SDKs, developers can rapidly port models, optimize inference performance, and seamlessly integrate AI capabilities into existing system architectures.Beyond supplying Jetson T4000 modules, EDOM Technology leverages its extensive ecosystem of partners across chips, modules, system integration, and application development. Based on the specific development stages and requirements of system integrators, equipment manufacturers, and enterprise customers, EDOM provides end-to-end support - from early-stage planning and technical consulting to ecosystem enablement. By sharing ecosystem expertise and practical experience, EDOM helps both existing customers and new entrants to the edge AI domain quickly build application capabilities and deploy edge AI solutions tailored to real-world scenarios.For more information on NVIDIA Jetson T4000, please visit website.

Seoul, January 6, 2026 – SK hynix Inc. (or "the company", www.skhynix.com) announced today that it will open a customer exhibition booth at Venetian Expo and showcase its next generation AI memory solution at CES 2026, in Las Vegas from January 6 to 9 (local time).The company said that, "Under the theme 'Innovative AI, Sustainable tomorrow' we plans to showcase a wide range of next generation memory solutions optimized for AI and will work closely with customers to create new value in the AI era."SK hynix has previously operated both a SK Group joint exhibition and a customer exhibition booth at CES. This year, the company will focus on the customer exhibition booth to expand touchpoint with key customers to discuss potential collaboration.The company showcases 16-layer HBM4 product with 48GB, next generation HBM product, for the first time during the exhibition. The product is the next generation product of 12-layer HBM4 product with 36GB, which demonstrated industry's fastest speed of 11.7Gbps, and is under development aligned with customers' schedules.12-layer HBM3E product with 36GB which will drive the market this year will also be presented. In particular, the company will jointly exhibit GPU modules that have adopted HBM3E for AI servers with customer and demonstrate its role within AI systems.In addition to HBM, the company plans to showcase SOCAMM2, a low-power memory module specialized for AI servers, to demonstrate the competitiveness of its diverse product portfolio in response to the rapidly growing demand for AI servers.Also, SK hynix will exhibit its lineup of conventional memory products optimized for AI, demonstrating its technological leadership across the market. The company will present its LPDDR6, optimized for on-device AI, offering significantly improved data processing speed and power efficiency compared to previous generations.In NAND flash, the company will present its 321-layer 2Tb QLC product, optimized for ultra-high capacity eSSDs, as demand surges from rapid expansion of AI data centers. With best-in-industry integration, this product significantly improves power efficiency and performance compared to previous generation QLC products, making it particularly advantageous in AI data center environments where lower power consumption is needed.The company will set up an 'AI System Demo Zone' where visitors can experience how its AI system memory solution that is being prepared for the future, interconnect to form AI ecosystem.In this zone, the company will present customized cHBM optimized for specific AI chip or system, PIM based AiMX, CuD which conducts computing in memory, CMM-Ax that integrated computing capabilities into CXL memory, and Data-aware CSD.For cHBM(Custom HBM), due to specific interest from customers, a large-scale mock-up has been prepared to allow visitors to visually sight its innovative structure. As the competition of the AI market shifts from mere performance to inference efficiency and cost optimization, this visualizes a new design approach that integrates part of computation and control functions into HBM which was handled by conventional GPU or ASIC in the past."As innovation triggered by AI accelerates further, customers' technical requirements are evolving rapidly," Justin Kim, President & Head of AI Infra at SK hynix, said. "We will meet customer needs with differentiated memory solutions. With close cooperation with customers, the company will create new value to contribute to the advancement of the AI ecosystem."SK hynix's next-generation AI memory products on display at CES 2026. Credit: SK hynix

Portwell, Inc., a leading provider of industrial and embedded computing solutions and a subsidiary of Posiflex Technology Inc., today announced its strategic investment in Wincomm Corporation, acquiring a 41% ownership stake and becoming its major shareholder.Wincomm Corporation, headquartered in Hsinchu, Taiwan, is a well-established innovator in the touchscreen computer market, with a strong foothold in medical equipment, smart healthcare and industrial automation sectors. Its diverse Human-Machine Interface (HMI) computer and display portfolio includes medical-grade panel PCs, embedded touch displays, and peripherals, as well as rugged industrial-grade solutions such as wide-temperature and high-brightness panel PCs, waterproof stainless-steel displays, and IECEx, ATEX, C1D2/C2D2-certified explosion-proof panel PCs."This investment marks a significant milestone in Portwell's growth direction," said Ken Guan, President of Portwell, Inc. "By joining forces with Wincomm, we are not only reinforcing our presence in the medical computing space but also expanding our capabilities across factory automation, petrochemical, and military applications. The synergy between our product lines and business models will enhance our overall competitiveness and customer satisfaction, while driving innovation in Edge AI and embedded computing."

As AI applications rapidly expand across PCs, mobile devices, and content creation workflows, there is a parallel surge in demand for high-resolution video, real-time generative content, and on-device inference. This transition is redefining storage within system architectures: it is no longer just a matter of capacity planning, but a critical determinant of performance, bandwidth, and reliability.To address this, AGI Technology has sharpened its strategy and will debut next-generation storage solutions at CES 2026, targeting the high-speed and usability demands of the AI era. PresidentMiranda Lee pointed out that while high specs are now "table stakes" across the market, the real differentiator going forward will be how well products adapt to real-world scenarios - and whether brands can sustain stable delivery and consistent quality.Miranda emphasized that AI is doing more than just driving capacity growth; it is fundamentally changing how data is utilized.First, edge computing and multi-task content creation are becoming the norm. This increases the frequency of data access and the need for mobility, transforming storage devices from auxiliary components into critical links in modern production workflows. Second, pricing dynamics are reshaping consumer behavior. As the cost of high-end storage and memory rises, the market is witnessing more "buy-down" purchasing and phased expansion: users tend to select mid-range configurations initially, supplementing capacity with external devices later. Third, high speed and capacity are increasingly becoming entry requirements rather than differentiators. With interfaces such as PCIe Gen4/Gen5 and USB4 continuing to advance, adhering to these specifications has become a baseline standard that all brands must meet.Consequently, AGI Technology is moving beyond differentiation through specifications alone. The company is transitioning its brand identity from a component manufacturer defined by performance metrics to a solutions provider centered on usage scenarios. This strategic realignment ensures that while AGI continues to advance speed and capacity benchmarks, it also integrates robust reliability and environmental durability into its core design philosophy. Miranda emphasizes that while performance is a baseline requirement, enhancing stability and durability addresses the practical demands of mobile and outdoor workflows. This comprehensive approach creates tangible added value for users requiring consistent performance under pressure.AGI Technology will center its CES presence around a scenario-driven strategy that prioritizes reliability and practical application. According to Miranda, CES has long served as a vital stage for showcasing AGI's technological prowess. However, the company's recent strategy emphasizes private, high-level briefings over traditional exhibit formats. By moving toward a semi-exclusive engagement model, AGI can more effectively align its product roadmap with customer needs, ultimately strengthening brand loyalty and enhancing the performance of its international channels.At CES 2026, AGI is set to translate its strategic vision into a powerhouse lineup of tangible innovations, headlined by next-generation storage solutions tailored for the AI era. Leading the charge is a 6nm PCIe Gen5 SSD capable of blistering speeds up to 11,000 MB/s. By leveraging an advanced 6nm process, AGI has significantly reduced power consumption and thermal overhead, making flagship-tier performance more accessible for real-world deployment. Complementing this is AGI’s 10,000 MT/s low-latency DDR5 RGB memory, built for the rigorous demands of AI-native platforms. Furthermore, AGI is expanding its portable portfolio with three specialized external SSDs catering to content creators, outdoor adventurers, and power users, reinforcing the brand's focus on versatile, high-speed data management.Miranda emphasized that for AGI Technology, 2026 marks more than just another hardware iteration; it represents a strategic pivot in both brand identity and operational philosophy. The company is steadily evolving from a component supplier into a user-centric storage solutions brand. While continuing to push the boundaries of PCIe and USB performance, AGI is doubling down on real-world utility - tailoring products to excel in mobility, professional content creation, and long-term data archiving.She emphasized that in an era of ubiquitous AI and high-performance computing, true value transcends raw benchmarks; it is defined by unwavering reliability when it matters most. Whether capturing a split-second extreme sports feat, a creator's unrepeatable live recording, or years of cherished family milestones, storage devices house more than just data - they safeguard irreplaceable moments. Through a commitment to durable, high-performance design, AGI Technology aims to earn user trust across every scenario, transforming their brand promise, 'Preserve Your Uniqueness,' from a slogan into a lifelong digital legacy.Project K10 DDR5 - 10,000 MT/s Overclocking Flagship.Credit: AGI TechnologyProject S10 PCIe Gen5 SSD - 11,000 MB/s Performance with TSMDC 6nm Controller.Credit: AGI TechnologyNew Series of Portable SSD – Combination of High-Speed, Durability and Capacity.Credit: AGI Technology

As the world faces urgent climate challenges, governments worldwide are pledging to reach net-zero emissions by 2050, positioning clean energy at the core of energy transitions. Solar photovoltaic (PV) systems, known for their renewable and low-pollution attributes, have emerged as a crucial pillar in global net-zero strategies. However, as the solar market expands rapidly, a wave of PV module decommissioning is emerging. Recycling has become an increasingly pressing environmental issue. According to estimates from the International Renewable Energy Agency (IRENA), the cumulative volume of end-of-life solar panels awaiting recycling will reach 730 million tons by 2050, creating an urgent and massive processing demand.In response, TSGC has introduced its innovative PV Circulator solution, featuring a unique physical, chemical-free, and heat-free dismantling technology rarely found globally. The solution enables complete separation of aluminum frames, glass, junction boxes, solar cells, back sheets and EVA layers - achieving a 99.3% material recovery rate. In recent years, TSGC has partnered with multiple recycled-materials companies to establish a circular materials ecosystem. The company will also showcase a breakthrough hydrogen-production technology - using recovered crystalline-silicon solar cells - at CES 2026, signaling its ambition to capture emerging opportunities in the global sustainable economy.TSGC Co-Founder and Distinguished Professor at the Department of Greenergy, National University of Tainan, Dr. Yao-Hsiang Fu, noted that current industry recycling technologies remain limited. Most recyclers remove only aluminum frames and wiring, while other components - difficult to separate at high purity - are typically incinerated in brick kilns and repurposed as tile materials. This results in the loss of high-value materials such as silver and silicon. "A single solar module contains approximately 0.6 kg of silicon and 4.8 grams of silver, representing far greater economic value than most people imagine," Fu emphasized. TSGC has already helped its partners obtain Taiwan's first license for PV module recycling and repurposing, marking a significant milestone for Taiwan's solar recycling industry.Rising ESG demands fuel the global sustainable economyTraditional PV recycling methods heavily rely on high-temperature thermal processing or chemical dissolution, which require significant energy consumption and may generate toxic gases and wastewater. Furthermore, these methods struggle to recover high-purity silicon wafers, silver, and copper in forms suitable for reuse. As a result, California has explicitly banned the disposal of solar panels through incineration or landfilling, accelerating the search for more environmentally friendly and economically viable recycling pathways.In 2024, TSGC received approval from the California Department of Toxic Substances Control (DTSC), becoming the seventh company in California certified for solar panel recycling - and the only company capable of fully dismantling and recovering all materials. TSGC is currently in discussions with the six existing recyclers in the state. By transferring collected PV modules to TSGC for processing, these companies will gain significantly higher material-recovery revenue than through conventional methods.Fu emphasized that as global sustainability awareness continues to rise, carbon-related regulations are rapidly evolving. For example, the EU's Carbon Border Adjustment Mechanism (CBAM) already requires imported products to demonstrate low - or negative-carbon footprints. Products without transparent material sourcing and emissions data will struggle to enter international markets. Therefore, PV recycling is no longer merely an environmental solution - it is becoming a strategic driver of circular-economy development and international trade competitiveness. Identifying this pivotal moment, TSGC is positioned to lead the industry with a complete system for material recovery, reuse, and hydrogen production.High mobility represents TSGC's key advantage in entering the US marketTSGC has partnered with Taiwan Tech Arena (TTA) to strengthen its global footprint through participation in major international exhibitions and increased media exposure. The company has received recognition at events such as CES in the United States and VivaTech in France, boosting its global visibility and indirectly contributing to the approval of its solar panel recycling license issued by the California Department of Toxic Substances Control (DTSC).Fu noted that the United States hosts numerous utility-scale solar farms, many of which are approaching their 20-year operational lifespan - making solar panel recycling an imminent challenge. The TSGC PV Circulator offers exceptional mobility, allowing for on-site disassembly and material separation directly at the project location, significantly reducing transportation costs and providing a major competitive edge in the U.S. market.Looking ahead, TSGC will continue leveraging Taiwan's green energy R&D capabilities and global collaboration opportunities to further expand the applications of recycled solar materials across the energy, chemical, and green manufacturing sectors, strengthening the company's strategic role in the global sustainable economy.Credit: TSGC

Driven by the worldwide push for net-zero emissions and the rise of the circular economy, sustainability has become a central priority across the technology sector. The introduction of a dedicated sustainability zone at recent CES events further underscores how green materials and environmental innovation technologies have emerged as focal points at global tech exhibitions. Renouvo, a company with more than two decades of experience in biomaterials, is among the key players gaining increased attention in this industry shift.At CES 2026, Renouvo will unveil its new Low-Carbon Materials Platform, which integrates its proprietary negative-carbon technology with AI. The platform is designed to help global brands make measurable progress toward carbon-neutrality commitments, while expanding Renouvo's reach into the US consumer electronics supply chain.Founder and CEO Chris Huang noted that the company is honored to have been selected by TTA to participate in CES. He observed that major US consumer electronics brands are accelerating their ESG initiatives, actively seeking new materials with negative-carbon or low-carbon attributes - whether for device enclosures or protective packaging components. In recent years, several international brands have approached Renouvo for collaboration, aiming to reduce carbon emissions at the material source and achieve verifiable sustainability outcomes.Unique hydrogen-bonding patent and third-party verification strengthen material reliabilityRenouvo has long focused on plant-based materials, with a core mission of converting agricultural residues and biomass waste into market-ready low-carbon materials and plastic-free solutions. Beyond its own line of eco-friendly tableware, the company develops low-carbon and carbon-neutral materials for brand partners in the EU, Australia, and other regions, facilitating real-world adoption of circular-economy practices.According to Huang, although the number of companies offering recycled or "eco-friendly" materials has grown rapidly, truly durable, safe, and internationally deployable low-carbon materials remain scarce. Renouvo distinguishes itself by using agricultural waste - such as bagasse and spent coffee grounds - as primary feedstock, enhanced by its proprietary hydrogen-bonding technology. This innovation addresses the common limitations of plant-based materials, including softening and insufficient durability, while simultaneously delivering carbon-capture and carbon-sequestration benefits that reduce emissions at the source.To strengthen material credibility, Renouvo partners extensively with third-party verification bodies to establish comprehensive carbon footprint (CFP) reports, quantifying emissions across the entire product life cycle - from raw materials to manufacturing and final shipment. These transparent, verifiable datasets enable Renouvo's materials to be adopted in international supply chains and serve as a reliable foundation for brands evaluating ESG performance. Huang emphasized that the ability to provide clear, measurable carbon-reduction data is one of Renouvo’s most significant differentiators in the global materials marketplace.Negative-carbon materials integrated with AI strengthen adoption efficiency, with a focus on the US marketA major highlight of Renouvo's return to CES in 2026 is the debut of a new platform that integrates its carbon-negative material technology with AI. The platform analyzes key parameters - including material composition, process-level carbon emissions, durability, and cost structure - providing brands with comprehensive evaluation data prior to adoption. This significantly shortens material verification cycles and accelerates the transition from testing to mass production.Renouvo has participated in the TTA competition for two consecutive years and continues to seek CES exhibition opportunities, driven by the US market's increasingly stringent sustainability requirements for materials. Major US brands now demand verifiable evidence of carbon-neutral commitments and transparent supply-chain metrics. By leveraging visibility from CES and TTA, Renouvo aims to expand collaboration with leading US technology and consumer electronics companies, accelerate global adoption of negative-carbon materials, and position itself as a key partner in supporting multinational brands' sustainability strategies.Looking ahead, Renouvo plans to continue enhancing its AI-enabled materials platform, expand its carbon-footprint database, and strengthen customized service capabilities. The company's objective is to become a strategic partner for North America's top green-materials supply chains within the next three years. Huang emphasized that sustainability cannot remain at the level of slogans or declarations - it must be verifiable and quantifiable. Only when brands can clearly track and measure carbon-reduction outcomes will sustainable materials become mainstream, which is the core message Renouvo aims to deliver worldwide.Renouvo's diverse product portfolio. Credit: Renouvo

Cancer is no longer considered untreatable, yet improving the accuracy and timeliness of diagnostics and treatment remains one of the most pressing challenges in clinical practice. Traditional cancer detection methods carry inherent limitations: tissue biopsies are highly invasive, causing discomfort and risk for patients, while blood-based biochemical tumor markers often lack specificity and fail to clearly differentiate between pathological signals and normal physiological fluctuations. As a result, liquid biopsy - valued for its safety, convenience, and ability to complement traditional pathology - has rapidly emerged as a global trend in cancer diagnostics.Developed by CytoAurora and distributed and supported by HUA TEC International, the Nano CAST AI semiconductor liquid tumor imaging system integrates semiconductor processes, AI imaging analysis, optical engineering, molecular pathology, and precision mechanics. The next-generation cancer cell detection platform will officially make its public debut at CES 2026, drawing significant attention from both medical and semiconductor communities.Chung-Er Huang, Chairman of HUA TEC International, noted that CytoAurora has long focused on single-cell biotechnology and device development, offering highly accurate solutions for genomic and protein-level analysis. To support the specialized needs of medical equipment deployment - installation, training, and maintenance - HUA TEC was established to lead Nano CAST's commercialization and technical support, helping hospitals and health examination centers rapidly adopt the system. The platform is already in clinical use at institutions such as Tzu Chi Hospital and Taipei Tzu Chi Hospital.According to Chien-Hsiang Tang, Vice President of HUA TEC International, Nano CAST utilizes semiconductor wafer-level surface modification to efficiently capture target cells circulating in the bloodstream. The system integrates precision mechanics and optical modules to automate cell capture, staining, and imaging. AI-driven image analysis then identifies and differentiates cancer cells from other cell types, enabling clinicians to execute targeted cell isolation, image interpretation, and downstream diagnostic analysis directly from blood samples.Nano CAST Supports the Full Cancer Care CycleAs semiconductor processes continue to advance, complex biochemical analyses that once required large laboratory setups can now be executed through highly integrated semiconductor biochips - making real-time testing more accessible and scalable. While genomic sequencing remains the most common application of such semiconductor-enabled medical technologies, HUA TEC is one of the few Taiwanese companies to extend semiconductor-based diagnostics into protein and biomarker analysis, particularly demonstrating strong breakthroughs in the field of liquid biopsy for oncology.Huang explained that Nano CAST is built upon two core components: the Cell Reveal Series and the CMS 200. The Cell Reveal Series uses semiconductor biochip technology to isolate specific or abnormal cells, forming nanoscale structures through plasma treatment, etching, and chemical modification that significantly enhance cell capture efficiency. The CMS 200 serves as the AI-driven imaging system that rapidly and objectively interprets captured cell and tissue images.Together, the system covers the complete clinical pathway of cancer care - from early detection of rare circulating tumor cells in blood, to monitoring treatment response, to identifying minimal residual disease (MRD) after therapy. By providing clinicians with earlier, more precise, and more actionable insights into disease progression, Nano CAST strengthens decision-making across the continuum of cancer management.TTA's High-Impact Global Pavilion Strategy Helps Drive Expansion into Central Asia, Europe, and the USAfter achieving notable milestones in Taiwan and obtaining BSI ISO 13485:2016 certification for medical device quality management, HUA TEC has accelerated its international expansion in recent years, establishing a presence in Thailand, Singapore, Japan, and Hong Kong. The company plans to further extend its footprint into Central Asia in 2026 as part of its broader global medical collaboration strategy.Huang emphasized that HUA TEC's consecutive participation in CES is driven by the strong curatorial and matchmaking capabilities of Taiwan Tech Arena (TTA). TTA's expertise in pavilion design, international outreach, and cross-border business facilitation significantly elevates the global visibility of Taiwanese startups. This enables companies such as HUA TEC to directly engage with major medical distributors, technology corporations, and investment groups across Europe and the United States, accelerating their path to market adoption.He stressed that Nano CAST demonstrates proven clinical performance, verifiable technical foundations, and scalability for commercial manufacturing - making CES the most important launchpad for HUA TEC's entry into the US and European markets. Through CES, the company aims to pursue strategic partnerships, initiate local clinical validations, and expand cross-border commercial activities, ultimately establishing a solid international presence. HUA TEC seeks to ensure that Taiwan's advanced semiconductor-enabled liquid biopsy technologies gain broader adoption across global clinical settings.The Nano CAST Cancer Solution for cancer cell detection. Credit: HUA TEC

In recent years, digital twin technology has quickly gained traction across industries. With the rapid maturation of AI and big data analytics, enterprises can now build highly accurate, real-time synchronized virtual models, enabling predictive maintenance, process optimization, and other benefits that were once difficult to realize. MetAI, invited by Taiwan Tech Arena (TTA) to join CES 2026, will showcase its proprietary AI - and 3D-driven MetGen digital twin platform, formally signaling its intent to capture opportunities in the US smart warehousing sector.MetAI co-founder and CEO Daniel  Yu noted that the US is home to some of the world's largest warehousing market, driven by digitalization efforts from major retailers such as Amazon, Walmart, and Costco. As such, the US has become MetAI's primary target for overseas expansion. "We are honored to receive TTA's invitation to exhibit at CES 2026," Yu said, expressing appreciation for TTA's comprehensive support - from pre-show preparation and customer matchmaking to presentation guidance - which has strengthened the company's confidence in entering the US market.AI fused with 3D technology : Digital twins generated in minutesFounded in 2023, MetAI focuses on developing MetGen, the first AI-native, domain-specific generative platform designed for real-to-sim and sim-to-real integration. By leveraging its proprietary AI and 3D synthesis architecture, MetGen automatically converts traditional CAD and 2D design files into SimReady (simulation-ready) 3D digital twin environments. The platform also incorporates AI, 3D simulation, physics modeling, and automation control logic, enabling users in warehousing, advanced manufacturing, semiconductors, and automation equipment to design, validate, and simulate workflows in a virtual environment before real-world deployment.MetAI further supports the creation of large-scale, high-fidelity synthetic datasets within the digital twin environment, giving AI models access to virtually unlimited training material. This capability accelerates production-line design and product development, while enabling enterprises to derive optimized strategies in simulation before applying them in real operations.By integrating NVIDIA Omniverse with MetAI's proprietary generative models, complex digital twin environments that once required months or even years to build can now be automatically generated in minutes, effectively resolving one of the industry's most persistent adoption barriers: excessively long deployment timelines. The company currently focuses on three key application areas - smart warehousing, semiconductors, and data centers - and completed a US$4 million seed round in 2025, backed by leading investors including Kenmec Mechanical and NVIDIA, making it one of the few Taiwan startups to receive a direct strategic investment from NVIDIA.According to Yu, traditional digital twin development relies heavily on manual data processing, resulting in implementation cycles that may stretch across several months or even longer than a year. Even with newer solutions emerging, model inaccuracies often lead to costly revisions. "MetAI combines AI with 3D generation to directly interpret 2D blueprints such as CAD or BIM files and automatically construct complete 3D twin environments," Yu explained.This approach reduces the typical modeling workload - from hundreds or thousands of hours - to just a few minutes, while delivering high consistency and zero structural error. It enables companies to rapidly plan production lines, build virtual sandboxes for robot training or logistics flow optimization, and significantly boost deployment efficiency.Establishing a US headquarters to capture smart warehousing and advanced manufacturing opportunitiesDespite being a relatively young company, MetAI has quickly secured partnerships with several high-profile enterprises, thanks to the uniqueness and technical depth of its solutions. In addition to working with TSMC, MetAI is collaborating with Kenmec to fully reconstruct the Chief Global Logistics's smart logistics center  into a virtual environment, creating a highly realistic digital twin featuring physics-accurate modeling, executable control logic, and AI-driven optimization capabilities.According to Yu, the rise of AI has prompted Taiwanese startups to shift their mindset - no longer focusing solely on the domestic market but aiming directly at the world's largest and most innovation-driven arenas. "The US has exceptionally strong demand for smart warehousing solutions. We are actively preparing to establish our US team and headquarters, which will include a local team, customer support, and a technical service center. This will place us closer to key customers and significantly enhance our ability to execute in the North American market," Yu said.Yu added that MetAI will continue to strengthen its real-to-sim and sim-to-real capabilities, while expanding integration with a broader ecosystem of automation hardware. The company aims to build an end-to-end twin platform that spans design, simulation, and deployment. Ultimately, MetAI seeks to enable enterprises to advance smart warehousing and smart factory transformations at minimal cost and with maximum speed.MetAI partners with Kenmec to build a high-fidelity virtual smart logistics center. Credit: MetAI

SEOUL, South Korea—December 24, 2025—BOS Semiconductors, a fabless semiconductor company specializing in automotive and physical AI semiconductors, today announced that it will participate in CES 2026, the world's largest technology exhibition, taking place in Las Vegas, USA from January 6–9, 2026. At the event, BOS will unveil an AI Box demo designed for next-generation mobility.At CES 2026, BOS will highlight its strategy aligned with major industry trends, including the advancement of autonomous driving, the shift toward Software Defined Vehicles (SDVs), and the expansion of Physical AI. Through the demonstrations, BOS will present how to anticipate emerging needs in mobility AI environments - such as: Support for a wide range of AI models based on CNN and Transformer architectures, Flexible scalability and integration with existing automotive electronic systems, Real-time perception and decision-making enabled by physical AI.To support these capabilities, BOS will showcase AI model demos powered by its AI Box integrating the high-performance AI accelerator Eagle-N. The AI Box is an external AI computing module that allows automakers (OEMs) to add an "AI brain" to vehicles without replacing existing in-vehicle infotainment (IVI) systems, enabling fast AI expansion with minimal platform change.With the AI Box, OEMs can minimize changes to their existing systems while extending high-performance AI functionality independently. This approach accelerates adoption of advanced AI capabilities not only in new vehicles but also in facelift models - updated versions of existing vehicles with enhanced design and features - reducing development cost and time while improving long-term product competitiveness.The AI Box is based on an on-device AI architecture, delivering several advantages. Sensitive data such as voice and video can be processed directly inside the vehicle rather than being transmitted to the cloud, strengthening privacy protection and data security. It also ensures stable AI operation regardless of network connectivity, improving overall reliability. Over the long term, the AI Box can reduce total cost of ownership (TCO) by lowering cloud traffic, inference, and storage costs. In addition, it offers strong scalability without requiring server expansion as the number of users increases.BOS' AI Box is designed to integrate flexibly with existing vehicle systems through multiple interfaces, enabling an efficient AI vehicle architecture based on clear role separation: AI-intensive functions are handled by the AI Box, while existing systems continue performing their original roles. At the booth (Venetian Expo, Hall A, Booth #50017), BOS will demonstrate on-device AI models that combine Vision-Language Models (VLMs) and Large Language Models (LLMs) based on the AI Box architecture. The demo will also be showcased at the Tenstorrent Demo Room as well."Through our AI Box demo with Eagle-N at CES 2026, we will present a practical approach for effectively scaling AI capabilities even on existing mobility system," said Jason (Jeongseok) Chae, Vice President and Head of Strategic Marketing & Sales at BOS. "We aim to evolve beyond automotive semiconductors and become a core semiconductor company leading the era of Physical AI."