HQ Pack is a global leader in high-tech packaging solutions. The company is expert at designing, producing, (precision) cleaning, and making packaging solutions reusable again after use, as well as manage the packaging logistics of high-quality industrial products. They do so for clients in the semiconductor and other high-tech industries.The process procedures and packaging solutions ensure the parts, modules or components of highly sophisticated equipment are fully protected during transportation and logistical arrangements. And at the same time, the system will meet the customer demand for protection of valuable products during transit while adhering to environmental, social, and governance (ESG) principles. The packaging design incorporates features like sustainable materials, waste reduction strategies, and carbon footprint minimization, alongside ensuring the integrity of high-value goods through robust physical protection.The company provides complete packaging solutions, starting with the development and sourcing of customized packaging materials. HQ Pack's regional Service Centers ensure that reusable packaging materials are ready to use again by cleaning and repairing them to like-new condition. They can also support reuse of parts by harvesting them before scrapping for new build packaging. If there is material destined for waste management, HQ Pack supports this at the same time. Because most of its high-tech clients operate on a global scale, HQ Pack operates not only at its headquarters in Eindhoven, the Netherlands, but also in Johor and Penang in Malaysia, Taiwan, Singapore, Germany, and in the United States (locations in Brookfield (CT), Newark (CA), and San Diego (CA)) providing the same quality and service at each location. With their Service Centers they support both their customers' sustainability goals as well as their own.Their slogan "We Create to Protect" is exactly what they do. The high-quality packaging solutions ensure that valuable and fragile products, modules, components and/or parts can be safely transported worldwide. With over 40 years of experience and global presence, no compromission on quality, flexibility at the heart of our organization, they are a full-service provider with fast, reliable and sustainable packaging solutions.

Trymax Semiconductor B.V. provides plasma-based etching, stripping, and curing process equipment for advanced semiconductor packaging, targeting applications in dry descum, ashing, surface preparation, light etching and processing, as well as UV photoresist curing and charge erase. It also manufactures UV curing equipment, focusing on equipment used in compound semiconductor processes. These equipment are used in the production of wide-bandgap semiconductor power devices such as silicon carbide (SiC) and gallium nitride (GaN), as well as other important processes such as communication power amplifiers (PAs).Trymax has been established for over 25 years and has a considerable customer base and brand recognition in the Taiwanese market. At Semicon Taiwan 2025, the company primarily serves to promote its products and connect with key clients. With a product portfolio ranging from 100mm to 300mm wafer size, Trymax's clients are on both sides of the Taiwan Strait becoming major suppliers to the manufacturers of power amplifiers and RF components. In the global presence, Trymax has significant market shares at foundries, IDMs and wafer level packaging houses for end applications in Power semiconductor, automotive, MEMS, LED and CMOS.Trymax's NEO series plasma dry descum systems are suitable for cleaning and activation processes in the semiconductor industry, offering high efficiency, uniformity, and repeatability. These systems utilize RF/microwave power to generate high-energy, disordered plasma under vacuum conditions. They can process a wide range of substrate sizes and offer a variety of processing technologies for flexible customer selection, meeting the needs of diverse semiconductor process technologies.Trymax continuously innovates to support its customers’ needs. In addition to the compound semiconductor processes, it is also widely used in application fields such as MEMS microelectromechanical systems, microfluidic devices, SOI substrate manufacturing, advanced packaging and optoelectronic displays. Among them, the global installed capacity of NEO system equipment has exceeded 300 sets.

Xinyx IC Design B.V. is a 100% Filipino owned IC Design house and has been in operations since 2009, with more than a decade of experience in the field of integrated circuit design, giving its clients scalability and access to highly qualified Filipino engineers. Xinyx provides end-to-end semiconductor design solutions, spanning front-end architecture, circuit realization, and physical implementation for analog, digital, and mixed-signal domains.Xinyx offers comprehensive IC design services customized to meet each customer's unique requirements. The company's capabilities span digital, analog, and mixed-signal design and layout, enabling it to support projects across a wide range of applications and technologies. Xinyx provides flexible engagement models, from full turnkey solutions to project-based and specialized design services, allowing clients to leverage its expertise at any stage of the design process to achieve faster turnaround times and optimized results. With over 16 years of experience, Xinyx has grown from a 15-person team into a 400-strong engineering and service organization, operating across five sites in the Philippines and one in Eindhoven, the Netherlands. Built on the strength of its large pool of talented young Filipino engineers, the company helps customers bring innovative silicon solutions to market. As Xinyx continues to expand its global footprint, it is optimistic about the booming Taiwanese semiconductor industry and is eager to collaborate with Taiwanese IC design firms to broaden its reach and explore mutually beneficial opportunities.As part of its commitment to developing the IC design ecosystem, Xinyx actively drives its flagship Campus Connect Program, which focuses on nurturing IC design talent at the university level. The program bridges industry and academia by providing a pathway for Filipino students to enter the IC design field through collaborative learning opportunities, internships, and training programs. In line with this vision, Xinyx continues to explore strategic partnerships with universities abroad, including recent engagements with Chung Yuan Christian University in Zhongli District, Taoyuan City, Taiwan.

Fastmicro B.V. is a manufacturer of surface particle defect detection systems and equipment established over 15 years ago. The main product lines include sample surface particle defect scanning, particle deposition measurement instruments, and particle defect detection systems for applications such as compound semiconductor wafers, glass wafers, masks, and EUV/DUV mask pellicles.The ranging product offerings of Fastmicro include analytics software to cover a wide variety of applications and processes, in-line defect inspection systems, transportable scanners and scanning module for system integration. The company's technology can detect particles down to 100 nanometers in size. It offers various operation modes, with inspection speeds up to 400 wafers per hour, and can provide inspection reports in ISO standards or PDF format.Fastmicro was initially established through a collaboration with the Netherlands Organization for Applied Scientific Research (TNO) to develop and research surface particle detection technology. Because the cleanliness level within semiconductor front-end processing plants and cleanrooms is crucial to the stability and yield of advanced semiconductor manufacturing, detecting tiny particles significantly impacts their operational needs. Today, tiny particles have a wide variety of composition, Fastmicro equipment plays a proactive role.Because the company's equipment has the advantage of fast detection speed, it usually only takes about ten seconds to complete surface particle defect detection, which has been well recognized by customers. The standard equipment is roughly the size of a household microwave oven. The operative procedures start to use swab or sampling tool to collect a sample from the surface of an object, which is then placed into the detector to read the particle count. Fastmicro adheres to NIST standards and uses PSL (Polystyrene latex) material for calibration and particle measurement. They also provide an OEM design model, providing flexible integration scanning modules to precision semiconductor equipment customers, covering wide-area scanning and diverse testing needs.The company began expanding its international business in 2022. At Semicon Taiwan 2025, in addition to engaging with Taiwan major foundry clients, the company is also entering the semiconductor equipment manufacturing supply chains. During equipment assembly, it is necessary to first confirm that the parts and components meet the product cleanliness level requirements before entering assembly. Each manufacturing link of supply chain requires confirmation that particle defect detection meets standard requirements, so Fastmicro equipment present strong business opportunities. This is currently the company's main market opportunity for expansion in Taiwan.

Empowered by the Startup Terrace Kaohsiung AWS Joint Innovation Center (JIC), eNeural is redefining the landscape of edge AI with two flagship innovations - AI-Craft, an automated AI development platform, and an edge AI self-learning solution. These breakthroughs aim to make AI truly self-learning and self-evolving, helping industries overcome long-standing barriers in deploying AI at the edge.As AI applications rapidly expand across industries, enterprises have realized that beyond computing power, the biggest barriers to AI implementation lie in the high cost and lengthy cycle of model training. For system integrators, success increasingly depends on the ability to integrate optimized AI models into lightweight edge devices to deliver reliable inference services in real time.A spin-off startup from National Yang Ming Chiao Tung University (NYCU), eNeural combines strong academic research foundations with practical AI R&D experience. The company has already forged partnerships with major electronics manufacturers including Quanta, Compal, and Lite-On, and is collaborating with a North American e-commerce logistics fleet on developing an AI-based collision warning system.According to eNeural CEO Eric Huang, edge devices are typically designed to be small, lightweight, and energy-efficient, which makes AI model optimization particularly challenging. "Our AI-Craft platform provides a one-stop, modular, and standardized AI development workflow," said Huang. "It allows developers to automatically generate optimized models as efficiently as products rolling off an intelligent production line."Edge AI self-learning accelerates model optimization and reduces costsFounded in 2022, eNeural focuses on proprietary AI technology R&D, with AI-Craft serving as the backbone of its innovation. The platform integrates four key technology modules - automated annotation, model pruning, model quantization, and generative AI data augmentation - to make AI development faster, more scalable, and more energy-efficient.Using pre-trained AI models and advanced image analysis algorithms, AI-Craft boosts data labeling efficiency by 10 to 100 times, significantly shortening AI project launch time. Model pruning removes redundant parameters to enhance computational efficiency by up to 90% without compromising accuracy, while reducing the memory and processor load.Model quantization converts floating-point operations into 8-bit, 4-bit, or even 2-bit precision, dramatically lowering power consumption and enabling smooth deployment of AI models on compact edge devices. Meanwhile, generative AI data augmentation automatically creates training data for rare yet critical conditions - such as night, rain, snow, or backlight - improving AI model robustness and generalization.Traditionally, AI models deployed on edge devices must send large amounts of data back to the cloud for retraining - a process that consumes time and resources. eNeural's Edge AI Self-Learning technology allows models to learn and recalibrate autonomously in real time, reducing the need for cloud data transfer."For example," Huang explained, "when fleet vehicles operate under different weather, lighting, or road conditions, the AI model can automatically adjust its decision logic to maintain accuracy. With federated learning, training results are securely shared across thousands of vehicles." This innovation reduces retraining cycles from months to weeks and significantly lowers AI operation and maintenance costs.AWS JIC Accelerates cloud transformation and strategic collaborationSince joining the AWS JIC in 2025, eNeural has leveraged the expertise of AWS specialists to upgrade its AI-Craft platform using Amazon SageMaker, a fully managed machine learning (ML) service, and Amazon Elastic Compute Cloud (Amazon EC2) GPU computing power. This transformation has turned AI-Craft into a cloud-based development solution, enabling developers to perform automated annotation, model pruning, and quantization in the cloud. With dynamic AWS resource allocation, eNeural can efficiently run multiple AI projects in parallel with greater scalability and cost efficiency.Participation in the AWS JIC program has also opened doors for new business collaborations. Huang shared that while earlier partnership talks with Advantech did not progress, joining the AWS JIC program led to the successful signing of a Memorandum of Understanding (MOU) between the two companies in 2025. Under this collaboration, eNeural will feature its two flagship AI solutions on Advantech's Marketplace, paving the way for deeper engagement with system integrators worldwide.Beyond Taiwan, eNeural is actively expanding into the U.S., Japan, and India. Leveraging AWS's global cloud infrastructure and innovation ecosystem, the company is pursuing a "software-driven core + hardware collaboration" strategy, collaborating with global players to unlock new opportunities in the rapidly growing edge AI market.

SCIL Nanoimprint Solutions is a provider of nanoscale imprinting equipment for patterning wafers leveraging its unique technology of Substrate Conformal Imprint Lithography (SCIL). The company is targeting the creation of optical structures on wafers for emerging applications in silicon photonics modules and smart glasses.Active in the market since 2015, SCIL Nanoimprint Solutions, originally a business unit of Philips, utilizes patented stamp transfer technology to create process equipment and processes for creating specialized optical structures on wafers. For example, it can create lightguide structures on wafers to enable direct chip-to-fiber connections, driving the fabrication of high-speed optical communication structures.Following the internal installation and testing of the first AutoSCIL tool in 2016, the company officially began mass production and delivered equipment to customers from 2017 onwards. In 2023, with investment from venture capital funds and other investors, the company was officially spun out from Philips to become an independent operating company. The company is targeting applications in optical communication semiconductors, including high-speed optical communication chips for data centers, advanced packaging silicon photonics systems, and ultra-compact optical elements for smart glasses and augmented reality devices. The product portfolio spans advanced imprint equipment, tailored optical materials, and optimized processes. As these are all key areas of focus for the next phase of AI-related applications, the company is attracting significant industry attention.These nanostructures and precision structures utilize processes such as imprinting precise patterns onto wafers using glass materials, serving as light-guiding structures for fiber-optic communication systems. Furthermore, some are manufactured as lens modules, imprinting optical components onto wafers. The existing equipment can achieve optical structures with critical dimensions down to 10 nanometersand sub-nanometer surface roughness.The company's process equipment is differentiated by wafer size, supporting 4-inch, 6-inch, 8-inch, and 12-inch sizes. The process includes resist deposition, overlay alignment, nano-imprinting, , and curing to complete the 2D or 3D patterning process. Targeting two key and highly anticipated applications, smart glasses and CPO (co-packaged optics), Taiwan is a high potential market for SCIL Nanoimprint Solutions, with the Taiwanese semiconductor industry focused on optoelectronic chips, high-speed communications, and advanced heterogeneous packaging technologies.

XIVER, 120 employees, located in High Tech Center of the Netherlands, a carve out from Philips Research started its business on January 2025.XIVER is unique in that they combine the strength of a pure-play foundry with more than 20 years of MEMS process development knowledge and experience in high tech micro systems solutions. A state-of-the art cleanroom of 2600m2 (28,000 sqf), independent positioning in the market and European ownership.XIVERs increasing share of wallet of its top-tier customers in medical, semiconductor equipment and defense are driving its initial growth and success. Secured by high barriers of entry and scarce availability of available manufacturing, make XIVER a first option for innovations in high tech market segments like data centers/AI and IR applications.  Further strategic investments in Photonics and Transducers will provide longevity and will be driving accelerated growth in mid to long term.

Founded in 1987, Boschman Technologies B.V. is a manufacturer of sintering equipment and transfer molding technology for advanced packaging of automotive and industrial power modules, MEMS sensors. In addition to its headquarters in the Netherlands, the company has operations in Singapore and China Suzhou. The key technologies of Boschman are silver sintering and Film Assisted Molding (FAM). Boschman uses a pressurized silver sintering process in module packaging to address the stringent challenges and difficulties of power module interconnect technology.The power module market is experiencing substantial growth in Europe and China, driven by the accelerating adoption of electric vehicles (EVs), expansion of renewable energy systems, and increased demand for energy-efficient industrial and consumer electronics. The power modules require sophisticated packaging for high-temperature, high-power, and high-reliability connections. The FAM technologies for protection against harsh environments like high humidity and vibration, as well as to manage thermal and electrical stress. On the other hand, silver sintering offers superior thermal and electrical conductivity compared to traditional soldering process, while FAM with its vacuum-assisted films prevents voids during molding, leading to more reliable and high-performing power modules with better thermal management.Boschman began its journey by developing and manufacturing module packaging molds, then expanded into the research and development of silver sintering packaging equipment. And the company continues to invest in and develop advanced packaging technologies. Boschman specializes in serving the global electronics assembly and semiconductor back-end packaging industries, providing advanced sintering equipment using advanced high-pressure sintering technology. Specifically tailored to the needs of customers of varying sizes and production scales, Boschman's sintering equipment offers a variety of solutions suitable for R&D doing small batches, small- to medium-volume pilot production, and large volume manufacturing environments.Boschman has many years of experience in cooperation with Taiwanese industries, especially in power electronics and components manufacturing service vendors that provide power management, power electronics, and thermal solutions. Among the new business opportunities, OSAT (Outsourced Semiconductor Assembly and Test) companies serve a broad range of semiconductor clients, is one of the key types of customers in Taiwan for Boschman. OSAT customers are providing back-end packaging services such as Tire Pressure Monitor Sensors (TPMS) and other automotive sensors for customers, which has enabled Boschman to gain the benefits.Talking about the business model, Boschman provides customers with packaging design and development, as well as silver sintering process equipment to meet the needs of the automotive supply chains and power system industries. It also provides design proofing and small-batch assembly production services to customers. One more thing, Boschman and Powertrim Technologies, another Dutch company exhibiting at the Netherlands Pavilion, have a collaborative upstream and downstream relationship. These two companies collaborate in the manufacturing of automotive and power module systems in Europe, jointly serving leading Auto and industrial customers.

Brainport Industries Campus (BIC) is a development project for an industrial park in Eindhoven, the Netherlands. Phase one (BIC 1) has been completed, encompassing 105,000 square meters of existing buildings, surrounding public space, and parking. The site is home to several high-tech manufacturing companies and educational institutions. Expansion plans are currently underway, with the newly expanded BIC 2 campus expected to double the size of BIC 1, reaching 300,000 square meters. More than 40 pioneering companies are already established on the campus. BIC is the largest campus expansion in the Netherlands for years to come.Notably, ASML, the Dutch EUV lithography equipment giant, is considering expanding to the northern part of the BIC 2 campus. In 2024, ASML announced plans to establish a subsidiary in the BIC Industrial Park by 2030, accommodating thousands of employees. The Brainport Industries Campus development company stated that it aims to provide startup facilities, co-innovation spaces and built to suit manufacturing space for high-tech companies.In partnership with Invest Holland and the Brabant Development Agency (BOM), the park will offer Taiwanese companies the option of establishing regional business units or research centers in the Netherlands through support services provided by the industrial park.The campus aims to attract leading companies in cutting-edge technology fields, including semiconductor related technologies, photonics, quantum and additive manufacturing. BIC and Invest Holland jointly unveiled this plan at Semicon Taiwan 2025, offering the access to advanced facilities, a strong open innovation ecosystems and encouraging Taiwan's high-tech industries participating in this collaboration opportunity.

Founded in 1993, Prodrive Technologies designs and manufactures mission-critical products that combine advanced engineering, innovative manufacturing, and global expertise. The company empowers semiconductor equipment manufacturers and customers across multiple industries to accelerate innovation and achieve operational excellence.Headquartered in the Netherlands, with regional hubs in the USA, Japan, and China, Prodrive Technologies serves the semiconductor, medical, life sciences, energy, infrastructure, and industrial markets. Its customer-centric approach, deep engineering expertise, and vertically integrated manufacturing enable fast time-to-market, superior quality, and scalable systems.The company's portfolio spans optical and e-beam cameras, embedded computing systems, high-precision motion control and drives, and RF plasma power solutions. These offerings are available as off-the-shelf products, customized systems, or turnkey solutions.With its broad product range, flexible business model, and decades of experience in the semiconductor sector, Prodrive Technologies is now also exploring opportunities in Taiwan. As home to the world's largest semiconductor foundry and a growing ecosystem of equipment manufacturers, Taiwan represents a potentially strategic market where Prodrive's innovation, quality, and speed-enabled by its unique vertical integration-can create significant value.