With more than 35 years of experience in ASIC design services, Progate Group Corporation (PGC, TPEx: 8227), a member of the TSMC Design Center Alliance (DCA) and a Synopsys IP OEM Program partner, provides cost-effective and flexible ASIC turnkey services to help startups and enterprises overcome the barriers to customized chip development and accelerate their products from concept to mass...

As demand for AI servers, high performance computing (HPC), and data center infrastructure accelerates, the semiconductor and power electronics test equipment market is experiencing strong growth. This momentum is expected to continue as advanced semiconductor technologies drive increasingly sophisticated testing requirements.

SK hynix Inc. (or "the company", www.skhynix.com) announced today that its Board of Directors has approved a resolution to repurchase and fully cancel 40 trillion won worth of its own shares...

For Malaysian engineering students entering their final semesters, the transition from academia to the professional world can feel daunting. Nicholas Tan Peng Gen, a Computer Engineering graduate from Asia Pacific University (APU), found himself at that exact crossroads just a year ago...

BIOSTAR, a leading manufacturer of edge AI solutions, industrial motherboards, and edge computing systems, today announces its participation in embedded world North America 2026, taking place September 22–24, 2026 at the Anaheim Convention Center in Anaheim, California, USA...

SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has decided to build new fabs in Yongin and Cheongju to respond to the continuously growing demand for memory in the AI era.

As global healthcare systems evolve, preventive medicine and digital health technologies are becoming key drivers of medical innovation. Aging populations, rising healthcare costs, and increasing chronic diseases are accelerating the transition from treatment-oriented care toward preventive, personalized, and data-driven health management.

SK hynix Inc. (or "the company", www.skhynix.com) announced today in collaboration with Sandisk that it has unveiled the first standard specifications for High Bandwidth Flash (HBF), a next-generation storage technology.

Montage Technology today announced the industry's first trial production of its CXL 3.2 Memory eXpander Controller (MXC) chip, designed to address escalating demands for memory expansion and resource pooling in AI, cloud computing, and data center environments...

Advanced Chip and Circuit Materials (ACCM) today introduced Celeritas SMC (Silicon-Matched Core), a production-ready core for advanced IC substrates engineered to match the in-plane coefficient of thermal expansion of silicon while running on established organic-substrate manufacturing lines...