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Monday 21 June 2021
FSP U3 series adapter - compact and powerful
In order to meet the need for increasingly powerful functions, many terminal devices have been designed with significantly increased product computing capacity and power consumption. Power supplies that serve the purpose of providing power must also increase power wattages to meet large power supply needs. However, must products with high-wattage requirements come with large-capacity power supplies? FSP thinking outside the box of conventional design, has developed adapters with high wattages and compact sizes, thereby meeting users' portability and space-saving needs.
LATEST STORIES
Tuesday 15 June 2021
ADLINK high-efficiency die sorting machine solution increases effectiveness of IC packaging and testing
The back-end semiconductor manufacturing process refers to the IC packaging and testing that people often hear about. Specifically, the process known as chip probing (CP) is conducted to test the electrical characteristics of each die on the wafer, so that dies with faulty electrical performance can be vetted before packaging, effectively reducing unnecessary manufacturing costs from faulty products.
Thursday 10 June 2021
Macroblock's mini-LED backlight driver ICs raise display performance of LCD
Consumer demand for higher audiovisual quality is driving the evolution of technologies behind LCD displays. Specifically, mini-LEDs, with their superior contrast and color gradation performance, have emerged in the field of display backlights. With a strong R&D foundation in the field of mini-LED technology, Macroblock recently launched a series of mini-LED backlight driver ICs that correspond to various LCD display sizes. According to Chris Chen, Macroblock backlight product manager, the company can help clients create the most suitable products tailored to the needs of different groups in the market.
Wednesday 9 June 2021
Simulation is the key to autonomous driving systems
NVIDIA has continued to innovate tools and platforms for developing autonomous driving applications and has developed a growing ecosystem of automakers, suppliers and startups worldwide.
Wednesday 9 June 2021
NVIDIA prepares for next-generation AI computing
NVIDIA, with the acquisition of Arm and its keen push in AI applications, has been aggressively releasing innovations to help improve datacenters' computing capability over AI workloads.
Wednesday 9 June 2021
AEWIN partners with D8AI to launch edge AI solutions
AEWIN announces partnership with D8AI to accelerate the arrival of AI empowered future. With continued growth in smart applications, D8AI solutions enable companies of all sizes to leverage the power of AI to provide better value and improve organizational efficiency.
Wednesday 9 June 2021
Micron unveils new products based on leading 176-layer NAND and 1-alpha DRAM process for the new data economy
The digital transformation driven by the convergence of AI and 5G has made data a key enabler of economic development. As a result, in addition to requiring higher computing performance, memory and storage components are playing an increasingly important role for various computing architectures. At 2021 Computex Taipei, Micron Technology unveiled several new products based on its leading 176-layer NAND and 1α (1-alpha) DRAM technology. Meanwhile, Sanjay Mehrotra, Micron President and CEO, and Raj Hazra, Senior Vice President and General Manager of Compute and Networking Business Unit, also gave speeches, explaining how the innovation of memory and storage can drive the expansion of AI applications, in a bid to realize the unlimited possibilities from data center to intelligent edge devices.
Tuesday 8 June 2021
GUC tapes out AI/HPC/networking platform on TSMC CoWoS technology
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out AI/HPC/Networking CoWoS Platform with 7.2 Gbps HBM3 Controller and PHY, GLink-2.5D and third-party 112G-LR SerDes IPs. The main die of the platform contains the world's first HBM3 Controller and PHY IP with a record-high 7.2 Gbps performance. The platform meets strict signal and power integrity (SI and PI) requirements of 112G-LR SerDes routed through TSMC CoWoS technologies.
Tuesday 8 June 2021
ASM Pacific Technology leads the upsurge and breakthrough of camera sensors
The outbreak of COVID-19 has brought a massive change to the world. People are connected by digital data on an unprecedented scale. A part of our life takes place in a virtual environment and the world is greatly transformed by things like digital workplace, virtual learning, mobile web, cloud computing, and Internet of Things (IoT), indicating how smart life has truly become the new normal.
Monday 7 June 2021
AEWIN partners with UNISEM to launch edge AI solutions
AEWIN announces partnership with UNISEM to leap into the AI-assisted future. UNISEM has taken its video analytics expertise and implemented it into useful real-world applications. These innovative AI solutions will change the landscape of how things are done in the near future.
Friday 4 June 2021
Optimizing wireless communication quality, iST makes compatibility an issue of the past
Although wireless technology has become the communication medium of choice for many types of technology products in recent years, wired communication remains the preferred choice for data transmission, thanks to its stability and bandwidth advantage. Communication standards such as HDMI, PCIe, USB, etc have become essential specifications for all kinds of electronic devices in daily life. Therefore, the compatibility of wired communication standards has become a key focus of product design.