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Thursday 30 December 2021
Merry Electronics reaffirms its commitment to sustainable corporate operations by joining the RE100 Initiative
As global warming continues to intensify, and due to the impacts of El Niño and La Niña, abnormal climate events such as the Australian bushfires are increasing in frequency. For this reason, sustainable development has risen to the forefront for countries and corporations. For example, following international pressure at the 26th United Nations Climate Change Conference (COP26), both China and India have agreed to set net-zero carbon emission targets for 2060 and 2070, respectively. Merry Electronics, whose business philosophy focuses on "transparent and sustainable operations, and a sense of responsibility towards the wellbeing of our country and society," has recently announced that it will become Taiwan's first electro-acoustic solution provider to join the RE100 initiative.
Tuesday 28 December 2021
Tokyo Electron highlights environmentally friendly solutions
Driven by leading edge investment, global semiconductor equipment billings increased 38% year-over-year to US$26.8 billion in the third quarter of 2021, and an 8% rise from the prior quarter to register the fifth consecutive quarter-over-quarter record high, according to the SEMI report on December 1st 2021. This is continuously on track to register a rare three consecutive years of record highs in fab equipment spending from 2020. Strong demands for IC chips across a wide range of markets including high performance computing (HPC), 5G communications, artificial intelligence (AI) and automotive applications have fueled this tremendous increase of growth for semiconductor equipment. The equipment market's booming growth is the envy of industries around the world.
Tuesday 28 December 2021
Providing one-stop service for FOPLP RDL, Manz helps consumer electronics companies develop new opportunities
With the rise of smart devices, applications for semiconductor components are quickly expanding. The requirements for chip size, information transmission speed, and power in network communications, automotive applications and manufacturing are also becoming more stringent. However, traditional packaging methods cannot keep up with the new market demands. Therefore, wafer level packaging and Fan Out Panel Level Packaging (FOPLP) have gradually become the focus of 5G, AIoT and high performance computing (HPC) companies when purchasing chips. Redistribution layers (RDL) is a core technology during the production of these chips, an it has also become a key area of focus of the industry in recent years. However, FOPLP demands a relatively high level of customization in its equipment. The Vice President of Sales at Manz, Adam Jian, stated that companies who intend to introduce this technology must focus on design and integration verification when selecting an equipment supplier.
Monday 27 December 2021
Premium heat treatment tool for semiconductor industry application
BTU International, a wholly-owned subsidiary of Amtech Group, is a global supplier and technology leader of advanced thermal processing equipment in the electronics and semiconductor manufacturing market. BTU's high-performance reflow ovens are used in the production of SMT printed circuit board assemblies and in semiconductor packaging processes. For semiconductor packaging applications where warpage of very thin substrates is a concern BTU offers the Pyramax TrueFlat configuration.
Thursday 23 December 2021
Chenbro launches innovative RM25324 high density storage server chassis to meet diverse data needs
As enterprises continue to digitize at an even faster pace, global data is also on a slope of substantial growth. According to research from IDC, the total global amount of data will climb to 175ZB by 2025, far exceeding the total of 33ZB in 2018. Given the increasing demand from enterprises for massive data storage, Chenbro Micom launched the RM25324 high-density storage server chassis. In its just 2U height, it supports installation of up to 24 3.5" SATA/SAS interface hard disk drives.
Wednesday 22 December 2021
CHT, Thai National Telecom, WhiteSpace, Delta Thailand join forces to build 5G private network
National Telecom (NT), The WhiteSpace (The WSP), Delta Electronics (Thailand) and Chunghwa Telecom signed a memorandum of understanding (MOU) for collaboration in a 5G private network in December 2021. The joint project will support the "Thailand 4.0" innovative manufacturing plan and assist Thailand in accelerating the use of 5G Innovative applications to introduce technologies such as the Internet of Things (IoT), information security, artificial intelligence (AI) and big data. In addition, the project will help realize innovative application services, such as Thailand's smart manufacturing, remote collaboration, and smart medical care.
Tuesday 21 December 2021
Chenbro server chassis solutions meet diverse needs of customers
The global server market will be in short supply in 2021. From the perspective of the larger trend, the growth of cloud services dominates the development of the server industry, especially in this post-pandemic era. It continues to drive home office, remote teaching, online shopping, and audio-visual applications, leading to higher demand for data centers and cloud services. Another major trend is 5G applications. With its characteristics of high-bandwidth communications, wide-area connectivity, and low latency, 5G applications are regarded as a boost to the development of smart cities and the IoT, and it also drives strong growth in servers.
Monday 20 December 2021
Dow to showcase new silicone technologies for advanced semiconductor packaging at SEMICON Taiwan 2021
Dow (NYSE: Dow) will preview its latest silicone technologies for advanced semiconductor packaging at SEMICON Taiwan 2021 in Booth #I2616. These next-generation silicone-organic hybrid adhesives, silicone hotmelt solutions and silicone die-attach films (DAF) deliver improved performance, durability, uniformity and processability vs. traditional organics. Dow's high-performance technologies are engineered to address top trends in advanced semiconductor packaging, including ever-thinner, smaller and more-complex designs, by mitigating stress from mismatched coefficients of thermal expansion (CTEs) that can cause warpage. They also provide greater durability and reliability for applications exposed to harsh environmental conditions in industries such as aerospace and automotive electronics.
Friday 17 December 2021
Fusion Worldwide celebrates 20 years in the electronics sourcing industry
Fusion Worldwide, the premier global open-market sourcing distributor of electronic components and finished products, is celebrating its 20th anniversary.
Wednesday 15 December 2021
Powering a great night's sleep for infrastructure managers
At dusk on November 9, 1965, all of New York state, parts of seven adjoining states, and the Canadian province of Ontario were plunged into darkness. A heavily loaded protection relay in southern Ontario had tripped out, causing a trip-out cascade when the load was transferred and overloaded other power lines. The blackout was one of the biggest power failures in history and at the height of rush hour, leaving 800,000 people trapped in New York's subway system, delaying millions of commuters and stranding thousands more in office buildings, elevators, and trains.