The age of AI greatly boosts Semiconductor manufacturing demands in advanced packaging. As packaging complexity increases (more I/O, smaller bump pitches, higher density), making the integration of nano-precision platforms and thermal stabilization in Semiconductor automation a strategic investment.PBA Systems will debut its latest nano-precision dual gantry platform series and metrology stage series designed for CoWoS and smart manufacturing requirements, to be showcased in the 2025 SEMICON Taiwan exhibition, located at Hall 2, 1st floor, Booth Q5536 in the Taipei Nangang Exhibition Center from Sep. 10th to Sep. 12th.For semiconductor advanced packaging technologyThe technology drivers of Heterogeneous Integration Architectures in Semiconductor advanced packaging involve different materials and bump density, and drive different process equipment requirements. From 2.5D to 3D development, semiconductor advanced Packaging may require different Die Attachment Processes, from high-speed, high-accuracy to thermal compressed and hybrid bonding. These processes require highly precise, custom-designed platforms for automation.PBA's latest dual gantry nano precision platform series offers high precision solutions for flip-chip bonding, thermo-compression bonding, and hybrid bonding. Its special dual-gantry architecture facilitates special simultaneous, multi-axis motion controls for high-speed die bonding and precision assembly applications, with less floor space requirements and high yield rates. PBA offers fast custom design services.Key advantages of PBA dual gantry series include:Nanometer-level assembly accuracy to boost high throughput and yield rates.Design with controllable suppression of thermal expansion minimizes yield loss.Scalability to support heterogeneous integration and next-generation chip architectures.Custom-designed High-speed, high-precision positioning to ensure both productivity and process stability.Flexible joint design, reduction of vibrations and resonance, improved accuracyPowered by PBA motors, an advancement from traditional ball-screw or belt motors, enjoyed low cogging force with anti-cogging features.In addition to offering fast custom design solutions, PBA also offers 250,000 square feet of contract manufacturing space for flexible manufacturing plans for worldwide system partners.PBA will also showcase its Z-Axis High-Precision Positioning Stage series at the upcoming SEMICON Taiwan show. This stage series offers ideal motion solutions for vertical movement in semiconductor automation with limited space and high-precision requirements, ideal for AOI inspection and PCB pick-and-place applications.Leader in nano-precision stage and gantry solutions for automationPBA Korea specializes in high-precision stage technologies. PBA Group further merged Korea SOONHAN Engineering, Korea's leading manufacturer of precision stage systems for 31 years, powering PBA Group to become one of the world's top precision stage experts that provide dynamic custom design and manufacturing services. PBA Systems is also a technology-capable partner of Mitsubishi Electric and Applied Materials. PBA group's contract OEM manufacturing experiences for many world-renowned semiconductor equipment partners in Asia also differentiate the group from regional local vendors.Meet the expert tech talkThe SEMICON Taiwan show will feature several advanced technical talk sessions in dedicated show floor booth sections. In the Smart Manufacturing Expo section, PBA will participate in the Expert Talk session on September 12, located at Talk Booth Q5356, 1F, Nan-Gang Exhibition Hall 2. PBA will be presenting the highly anticipated speech topic: PBA's Dual-Gantry Precision Platform Series for Semiconductor Advanced Packaging and Metrology Equipment. This is a rare opportunity for industry professionals to gain smart manufacturing insights directly from the expert—don't miss it.Global reach, local serviceHeadquartered in Singapore, PBA Group has R&D and sales offices in Singapore, Taiwan, South Korea, Japan, Malaysia, China, the United States, and Europe. The Taiwan branch offers a one-stop solution, providing everything from direct drive motors and modules to custom-integrated, high-precision platform systems. This ensures fast, flexible, and innovative smart manufacturing services for both local and international clients.For system partners with product customization or procurement inquiries, please contact.PBA released their latest Nano-Precision Dual Gantry Stage Platform Series for Heterogeneous Semiconductor Advanced Packaging and Metrology Equipment. To Be Debuted at the 2025 SEMICON Taiwan. PBA

Chroma ATE Inc. will participate in SEMICON Taiwan 2025, presenting a full suite of breakthrough semiconductor test solutions. The showcase will focus on applications in AI chips, advanced packaging, high-performance computing (HPC), and AIoT—designed to meet the evolving demands of next-generation semiconductor testing.Advanced Packaging 3D Metrology Solutions - Chroma 7980/7981The Chroma 7980/7981 systems feature Chroma's patented BLiSTM technology, purpose-built for nanoscale critical dimension measurement. These systems incorporate application-optimized algorithms and user interfaces to deliver high-speed surface profiling and fast auto-focusing capabilities, along with large-area image stitching. They address key needs in advanced packaging processes such as TSV/VIA, RDL, probe mark inspection, overlay, and sub-micron surface profiling. Additionally, Chroma's inspection and in-situ AOI solutions, like the Chroma 7961, enable real-time defect detection and inline process quality control.AI-Driven Test Platform - Chroma 3680When hardware innovation meets AI-enhanced software, a new era of automated test equipment emerges.The Chroma 3680 platform is purpose-built to meet the demands of modern semiconductor testing, combining high-efficiency algorithms with a modular architecture to redefine flexibility and efficiency in test systems.This platform features a unified and intelligent system architecture that enables real-time, accurate test program conversion—reducing migration time and manpower by over 80%. It addresses key pain points such as poor portability of legacy test programs and time-consuming debugging processes, supporting diverse chip architectures with a concrete and effective solution.Chroma 3680 supports modular expansion to meet increasingly diverse future requirements, and can be equipped with the HDRF2 module for one-click activation of RF testing, greatly simplifying test setup. The overall platform is designed for high scalability and flexibility, enabling fast adaptation across different product lines, application needs, and test scales—streamlining both development and validation processes.Tri-Temp System-Level Test SolutionsChroma's 3100 and 3200 pick-and-place handler solutions, paired with the 31000R/31000K Series Temperature Forcing Systems, deliver a powerful, fully integrated platform to meet the unprecedented challenges of AI-era device testing.The advanced 3110, 3200, 3200-HD, 3210, and 3260 pick-and-place systems feature industry-leading SLT testing solutions, including a high-precision contact force system, CVOT (Chroma Virtual Operation Tools) for intelligent yield optimization, integrated device protection features, and a universal change kit design for fast, flexible device conversion. These systems ensure superior test quality through scalable architecture that integrates seamlessly into both engineering and high-volume production environments.The intelligent 31000R thermal solution provides a wide and stable temperature control range from –40°C to 150°C, with high-power dissipation capability up to 2,900 W. It features advanced thermal performance with direct phase-change cooling, intelligent power monitoring, and high-precision multi-zone control. This makes it ideal for AI, HPC, and thermally demanding automotive applications.SuperSizer Nano-Particle Monitoring SystemsPowered by advanced aerosol particle measurement technology, the SuperSizer system delivers precise monitoring of nano-sized particles ranging from 3 nm to 20 nm, overcoming the limitations of conventional optical systems, especially bubble interference.The SuperSizer II, V, VI, and VII generations have been widely adopted for real-time monitoring of critical wet chemicals such as CMP slurry, isopropyl alcohol (IPA), hydrogen peroxide/pure water, and ammonia solutions. The latest addition to the series, SuperSizer VIII, is purpose-built for hydrochloric acid monitoring—extending the system's capabilities into more aggressive chemistries.By enabling in-line and real-time particle detection, the SuperSizer platform helps minimize wafer defects, ensure chemical purity, and improve overall process yield.Visit Chroma at SEMICON Taiwan 2025From September 10–12, Chroma ATE will exhibit at SEMICON Taiwan 2025 at the Taipei Nangang Exhibition Center, Hall 1, 1F (Booth K2876).In addition to showcasing our wide-ranging portfolio of test solutions, Chroma will present at the Semiconductor Advanced Inspection and Metrology Forum. Our presentation "White-Light Interferometry Integration with Electromagnetic Simulation and Digital Light-Field Control for Advanced Packaging" will explore innovative applications of advanced packaging inspection and metrology technologies.Join us at SEMICON Taiwan 2025 and connect with our team to exchange insights on the future of test and innovation.Chroma ATE Inc. will participate in SEMICON Taiwan 2025, presenting a full suite of breakthrough semiconductor test solutions. The showcase will focus on applications in AI chips, advanced packaging, high-performance computing (HPC), and AIoT—designed to meet the evolving demands of next-generation semiconductor testing. Chroma ATE Inc.

ADLINK Technology Inc., a global leader in edge computing solutions, introduces the cExpress-R8, a COM Express COM.0 R3.1 Type 6 Compact module powered by AMD Ryzen Embedded 8000 Series processors (8845HS, 8840U, 8645HS, 8640U). Engineered to satisfy the demands of modern smart industrial applications, it delivers an advanced integration of high-performance and energy-efficient design. This module ignites mission-critical AI capabilities, accelerated edge computing, and advanced graphics performance-bringing the confidence that comes with the reliability needed for complex, graphics-intensive workloads.COM Express R3.1 Type 6 Compact Size Module. ADLINKcExpress-R8-B. ADLINKPushing the limits of edge performance, ADLINK's cExpress-R8 combines up to 8 "Zen 4" cores and 16 threads with integrated AMD RDNA 3 graphics and an XDNA NPU, delivering up to 40 TOPS. The cExpress-R8 fuels power-efficient AI inferencing and fast decision-making across machine vision, robotics, medical imaging, infotainment, and intelligent human-machine systems. With XDNA architecture, performance-per-watt efficiency is optimized, delivering advanced AI processing, and enabling more complex AI workloads without a significant spike in energy demands.cExpress-R8-F. ADLINKTo guarantee real-time processing, the cExpress-R8 supports up to 96GB of DDR5 memory at 5600 MT/s, with both ECC and non-ECC options available. ECC acts as a watchdog, detecting and correcting errors in environments where failure isn't an option, whether in mission-critical applications, gaming, transportation, and POS (Point of Sale)/POI (Point of Information) systems.With support for up to four displays, DP, eDP, HDMI, LVDS, and VGA interfaces. VGA and eDP outputs are available as optional features, allowing flexible visual configurations to meet edge computing demands. Combined with scalable performance, power, and graphics configurations, the cExpress-R8 is well-suited for a diverse range of edge applications. With 10-year product availability, it ensures long-term design stability and lifecycle alignment for system integrator roadmaps.Key Features:- AMD Ryzen Embedded 8000 Series Processors- AMD RDNA 3 Graphics and XDNA NPU (up to 40 TOPS performance)- Up to 96GB DDR5 5600 MT/s (ECC/non-ECC)- Four independent display outputsADLINK's cExpress development kits, including reference carriers and full I/O support, will be available in Q4 of 2025 to help you accelerate prototyping and simplify system integration.For more information about ADLINK COMs, visit adlinktech.com and explore the cExpress-R8 module.Summary:- Built on AMD Ryzen Embedded 8000 Series processors for powerhouse performance.Deploy 8-core, 16-thread processing with AMD RDNA 3 graphics for accelerated multitasking and immersive visuals.- Achieve up to 40 TOPS of AI inferencing performance with Zen 4, RDNA 3, and XDNA architectures for enhanced on-device intelligence.- Support up to 96GB DDR5 with ECC for reliable data integrity and system stability.- Enable versatile multi-display configurations (DP, eDP, HDMI, LVDS, VGA), accommodating complex visual setups with convenience.

In the face of global challenges such as traffic congestion, air pollution, and rising oil prices, electric two-wheelers are rapidly becoming an important transportation choice due to their advantages of flexibility, affordability, and zero emissions. To address the urgent market demand for high-performance electronic control systems, Holtek Semiconductor, leveraging its technical expertise accumulated through deep involvement in the consumer electronics sector, has officially launched a full-featured electronic control component solution for electric two-wheelers, enabling customers to achieve rapid product development and mass production.Complete technology ecosystem covering all vehicle electronic control requirementsBased on its independently developed complete technology ecosystem, Holtek deeply integrates technologies such as instrument display, anti-theft security, power control, energy management, and wired/wireless communication to launch an electric two-wheeler electronic control solution, abbreviated as the E-2W solution. This solution covers six core electronic control components: dashboard, RF vehicle alarm, central controller, motor controller, battery management system (BMS), and EV charger, flexibly supporting single-component development and whole-vehicle integration applications.Development efficiency revolution: dual engine drive in the form of evaluation boards + parametric platformHoltek's E-2W solution is equipped with feature-rich evaluation boards and a graphical development platform, allowing developers to quickly enter the functional testing stage by parameter configuration. It is worth noting that this series of evaluation boards supports the popular CAN bus communication, including:1. Intelligent LED dashboard: real-time display of vehicle data and operating status2. Hopping code alarm: RF remote control, supports abnormal vibration detection, and sound and light alarms3. 4G/Bluetooth central controller: multi-mode positioning, remote vehicle condition management, and OTA upgrades4. 250W motor controller: 3-shunt sensor FOC algorithm and multiple protection mechanisms5. 350W charger: precise control of battery charging curve and multiple safety protections6. 16S battery management system (BMS): battery power estimation and multiple protection mechanismsEnabling Green Transformation of the IndustryHoltek will collaborate with industry chain partners to accelerate technological innovation in electric mobility by providing vertical support from core chips to system solutions. Holtek will also continue to invest in R&D resources to deepen its technological footprint in the green transportation sector.Holtek wishes to announce its participation in Electronica India 2025, which will take place in Bangalore from 17th to 19th, September. At the exhibition visitors can see Holtek's E-2W development platform and the electronic control evaluation boards suitable for low-speed e-scooters. We welcome interested partners to visit the site to learn more information. For further details on our solution, please contact Holtek's sales or agencies.Holtek E-2W Solution for Green Travel. Holtek

TerraONE Tech Co., Ltd., a company specializing in modern IT solutions, has announced a strategic partnership with Wasabi Technologies, a leading cloud storage company, becoming the authorized distributor for Wasabi Technologies in the Taiwan market. With the partnership, Taiwanese businesses can enhance their data management and redundancy services with high-performance, secure, and cost-effective cloud object storage.Credit: TerraONEWasabi is one of the technology industry's fastest-growing companies. Wasabi Hot Cloud Storage is a predictable, affordable cloud object storage service. Compared to traditional storage solutions, Wasabi eliminates fees for egress and API usage and provides 99.9999999999% (11 nines) data durability and robust enterprise-grade security. Wasabi Hot Cloud Storage is widely adopted by tens of thousands of businesses and MSPs worldwide.Kevin Chen, General Manager of TerraOne Technology, said, "Amid digital transformation and IT modernization, many businesses are increasingly demanding highly flexible and scalable cloud storage. Wasabi Technologies' services offer significant advantages in performance, price, and security, making them ideal for storage, backup, redundancy, video surveillance, big data analytics, and other application scenarios across various industries. By partnering with Wasabi, we can provide our customers with more professional technical support, integration services, and customized solutions, helping businesses seamlessly transition to cloud platforms.""TerraONE has extensive experience in enterprise IT deployments and a broad distribution network in the Taiwanese market, making them a key partner in our efforts to expand our distribution network in Taiwan," said Raymond Koh, Country Manager, ASEAN, Wasabi Technologies. "We look forward to working together to accelerate the adoption and innovative applications of enterprise cloud storage."TerraOne Technology will host a Wasabi partner product launch event on 9th September 2025. Interested distributors are welcome to contact TerraOne. Alternatively, click here to stay up-to-date on TerraOne Technology events.For more information, please visit.

In the past decades, the memory industry has been one of the most volatile sectors in semiconductors, marked by price fluctuations, supply-demand imbalances, and rapid capacity shifts. Yet as we step into 2025, the rise of AI, massive data processing, and edge intelligence is propelling memory from a "cycle-driven" market into a new stage of "structural growth."The global memory market is moving beyond sheer "capacity expansion" toward "breakthroughs in performance, energy efficiency, and system-level integration". Rapid advances in DRAM and NAND, coupled with the accelerated adoption of new packaging, protocols, and architectures, are propelling the memory ecosystem into a new phase of robust and sustainable development.According to the World Semiconductor Trade Statistics (WSTS), the global semiconductor market reached USD 346 billion in H1 2025, up 18.9% year-over-year, with the memory segment growing by 20%. Multiple institutions forecast that memory product prices will continue to rise in the third quarter of 2025, particularly in high-value segments such as enterprise SSDs and high-speed DRAM. This wave of AI-driven structural demand is becoming the starting point of a new growth cycle for the memory industry.GMIF2025: Shaping the Future of Memory in the AI EraIn this paradigm-shifting moment, the industry needs a collaborative hub to connect upstream and downstream players, bridge technology with markets, and bring together key forces across the global memory ecosystem to explore trends, align resources, and foster partnerships.The 4th Global Memory Innovation Forum (GMIF2025 Innovation Summit) will be held on September 24–25, 2025, at the Renaissance Shenzhen Bay Hotel.Co-hosted by the Shenzhen Memory Industry Association and the School of Integrated Circuits at Peking University and organized by JWinsights (Shanghai) Technology Co., Ltd., GMIF2025 will focus on the theme "AI Applications, Innovation Empowered" to discuss memory breakthroughs and ecosystem collaboration under the momentum of AI.Four Core Themes:01 Trends and Roadmaps of Storage and Memory Technologies: From CXL and Chiplet to near-memory computing, new architectures are transforming memory from isolated optimization to system-level synergy.02 AI Applications & Deployment Practices: Deep dives into emerging memory innovations driven by AI servers, AI smartphones, AI PCs, and intelligent vehicles.03 Industry Collaboration Across the Value Chain: Uniting IDM manufacturers, controller providers, solution vendors, packaging & testing suppliers, material and equipment companies to build dual engines of technology and market growth.04 Global Ecosystem & New Industry Dynamics: Exploring new pathways to reshape supply chains, jointly build standards, and establish a paradigm for cross-border collaboration in the post-globalization era.Summit Highlights. Credit: GMIFGMIF2024 Data Insights. Credit: GMIFAn Industry Gathering Not to Be MissedGMIF is more than just a technology summit; it is a global high-end platform that combines dialogue, showcase, partnership, and influence:For enterprises: it's a premier stage to showcase technological achievements and expand upstream & downstream collaborations.For industry professionals: it's a vital arena to grasp trends, access resources, and discover opportunities.For investors: it's a unique vantage point to anticipate turning points and uncover industry value.For media & academia: it's a core hub for first-hand insights and shaping industry discourse.We sincerely invite you to join us this September in Shenzhen Bay, where global industry leaders will gather to discuss memory innovation in the AI era, witness a new stage of collaboration, and co-create the future of the memory ecosystem.Click the link to secure a seat.An Industry Gathering Not to Be Missed. Credit: GMIFFor more information about GMIF, please visit.

As cybersecurity threats continue to evolve, attackers are no longer just targeting applications or operating systems, but are now penetrating deeper into the boot firmware layer of devices, including BIOS, UEFI, and BMC. These firmware components are responsible for initializing and verifying the system integrity during the boot process. Once compromised or embedded with malicious code, they can compromise the entire system.Real-world incidents and attack simulations have shown that firmware attacks are highly stealthy and persistent, often eluding traditional antivirus software and OS-level defenses. The National Institute of Standards and Technology (NIST) addressed this as early as 2018 in the release of NIST SP 800-193: Platform Firmware Resiliency Guidelines, proposing a three-step framework: Detect–Protect–Recover, as the core architecture for platform firmware security.Among these, the"Recover" mechanism has drawn significant attention. It not only mandates that a system halt upon detection of firmware anomalies, but also be capable of restoring original firmware from a secure image (such as a Golden Image)—automatically, without human intervention—thus ensuring the platform can return to a trusted state and cutting off any potential long-term malware residency.To learn the latest cybersecurity regulations and trends, download the hardware security whitepaper for free.Challenges in PFR Adoption: Legacy Architectures and Weak Firmware VerificationAlthough NIST SP 800-193 is widely recognized as a reference for governments and enterprises implementing firmware security, the practical deployment of PFR (Platform Firmware Resiliency) still faces numerous hurdles.First, many embedded systems or server platforms rely on conventional SPI NOR Flash as firmware storage, which lacks support for key-based verification, partition control, and redundancy mechanisms, making it difficult to meet the "Protect" and "Recover" requirements defined by NIST. Even when the platform includes a Root of Trust (e.g., TPM, CPLD, BMC), vulnerabilities remain if the external memory used does not support secure image switching or key-binding mechanisms.Common challenges include:Firstly, firmware regions vulnerable to rollback attacks, where outdated, exploitable images are reintroduced. Secondly, the inability to separate access rights between boot-time and run-time, leading to broken access control. Thirdly, the lack of integrated verification tools and APIs requires extensive engineering effort to build verification workflows.Unnder these conditions, the search for a secure storage component that supports the PFR framework has become a critical entry point for enhancing firmware security.Winbond TrustME Secure Flash — W77Q: A Secure Memory Fully Supporting PFRTo address the above challenges, Winbond's TrustME Secure Flash — W77Q series offers a solution specifically designed for platform firmware security and recovery. It allows for fast deployment of the NIST PFR-required protection and automatic recovery features without altering the main platform architecture.Dual Images with Secure Verification—Seamless Auto-Recovery DeploymentThe W77Q integrates both a Primary Image and a Recovery Image, supporting secure verification mechanisms and auto-switching logic. When the primary firmware image is corrupted or fails verification, the Root of Trust controller (e.g., BMC or CPLD) can trigger a switch to restore the system to the Golden Image. This entire process requires no additional software or CPU intervention, fulfilling the "unattended, automatic recovery" requirements of PFR.Moreover, the mechanism complies with the Detect-Protect-Recover architecture outlined in NIST SP 800-193, and can be integrated with major platform vendors' boot verification logic, establishing a full Chain of Trust from chip initialization to firmware validation.Multi-Level Access Control and Key Binding to Strengthen Firmware IntegrityW77Q supports partitioning and key-based access control, allowing different keys and permissions to be configured for each firmware region (e.g., Bootloader, UEFI, BMC). This prevents unauthorized access and tampering. It also supports rollback prevention and restricts firmware updates to authorized controllers only, significantly reinforcing platform firmware integrity verification.Modular Integration and Development Support—Accelerating PFR ImplementationThe W77Q Secure Flash not only strengthens hardware-based firmware protection but also provides complete software development and validation support to help device manufacturers accelerate PFR deployment:Offers ready-to-integrate verification API interfaces and reference designsProvides boot verification parameters and switching logic in coordination with Root of Trust controllers (e.g., BMC, CPLD)Delivers test reports and certification documents compliant with NIST SP 800-193 and ISO 26262The Winbond W77Q Secure Flash is pin-to-pin compatible with existing SPI Flash devices, requiring no hardware changes, greatly reducing implementation costs.For applications like server motherboards, 5G base stations, industrial control systems, or automotive ECUs, W77Q presents an ideal solution for quickly realizing platform firmware recovery mechanisms and meeting security compliance requirements.To learn more about Winbond's advanced security solutions, visit Winbond's website or contact Winbond directly, or download the latest Hardware Security White Paper.

xMEMS Labs, the global leader in solid-state MEMS speakers and micro-scale thermal solutions, today announced the return of its highly anticipated xMEMS Live Asia seminar series, taking place September 16 in Taipei and September 18 in Shenzhen.Now in its third year, xMEMS Live Asia brings together engineers, product designers, system architects and company executives to explore how MEMS-based audio and active thermal management technologies are redefining the design and performance of next-generation AI interface devices – from AI glasses, smartphones, headphones and earbuds to SSDs, optical transceivers and rack servers in the data center.This year's one-day seminars will center on live product demonstrations of Sycamore, xMEMS' revolutionary thin and lightweight full-range MEMS loudspeaker, and cooling, the world's first solid-state air pump-on-a-chip delivering active thermal management in devices where conventional fans can't go.Attendees will experience:1) AI glasses featuring Sycamore speakers and cooling for discreet, high-fidelity sound and heat management in ultra-thin eyewear2) Next-gen headphones featuring full-range Sycamore, paired with cooling to deliver the world's first active earcup ventilation3) SSD thermal management featuring cooling for higher sustained data transfers4) Plus a smartwatch with Sycamore, TWS earbud solutions with Cypress and Lassen, and thermal demos showcasing cooling at both chip and system levelsIn addition to hands-on demos, the seminar features deep-dive technical sessions from xMEMS engineers, covering performance testing, system integration, and product optimization for Sycamore and cooling across a variety of applications. Dedicated sessions on headphone and TWS implementations will offer further insight into how xMEMS solutions deliver superior fidelity, form factor reduction, and system-level benefits for consumer electronics."AI is changing how we interface with devices while also increasing processor and thermal loads," said Joseph Jiang, CEO of xMEMS Labs. "At xMEMS Live Asia, we'll demonstrate how Sycamore and cooling technologies are enabling a new generation of thinner and lighter-weight conversational AI interfaces and active thermal management for improved on-device intelligence and system performance."Registration is now open. Seating is limited. Click here for English, here for Simplified Chinese, or here for Traditional Chinese. Reserve your spot today to experience the future of conversational AI interfaces and AI thermal management!For more information about xMEMS and its solid-state solutions, visit xmems.com.Showcasing Live Demonstrations of AI Interface and Thermal Device Innovation Enabled by Sycamore and cooling on September 16 in Taipei and September 18 in Shenzhen.

Power modules have undergone a significant transformation- from simple power sources into critical enablers of system scalability, performance, and energy efficiency. This evolution is driven by the increasing demand for energy resilience, industrial transformation and enhancement. MEAN WELL, the global leader in standard power supply solutions, will adopt an application-oriented approach and work in close collaboration with distributors to showcase the effectiveness of their diversified product portfolios in practical applications at the upcoming Automation Taipei 2025.Partnering with distributors to develop complete solutions for automation, green energyTony Hsieh, Section Manager of MEAN WELL's Technical Service Center, indicated that the company's focus at this exhibition is on automation and green energy applications. Distributors will leverage their expertise in automation applications to incorporate MEAN WELL's green energy and backup power products.Hsieh further noted that the company's product designs follow cross-industry standards, efficiently fulfilling the application requirements of distributors in their specific sectors. In the field of humanoid robotics, MEAN WELL provides an array of charging power options, including wall-mounted designs, high-power density models, and fanless or fan-equipped configurations. These technologies can be easily adapted for various scenarios, including outdoor applications. Moreover, they support CAN bus communication and system-level integration, ensuring a stable power supply.The characteristics offer a broader range of collaborative models between MEAN WELL and its distribution partners. Partners leverage their technical expertise and capabilities to integrate MEAN WELL's standard products and related components as a foundational element in their offering, in addition to traditional product sales. Furthermore, by applying their professional integration capabilities—tailored to specific application scenarios—they co-develop comprehensive solutions that deliver significant added value.At Automation Taipei 2025, factory automation specialist YAU-YIH Enterprise will present a complete industrial robotic arm display solution powered by MEAN WELL's automation-oriented power supplies. RiKO, specialist in smart lighting control, will showcase the integration of MEAN WELL's Matter wireless and DALI wired dimming controllers with its proprietary sensors for use in industrial and commercial automation scenarios. JIDIEN will exhibit its most recent XDR and XTR series DIN-rail power supplies, as well as the next-generation mobile energy storage system, the NTN-5K, highlighting its advancements in energy storage applications and power integration.MEAN WELL's distributors will present backup power solutions for energy applications. Integrating redundant power supplies with control modules allows automation systems to securely retain operational progress, document work steps, and ensure a consistent power supply during outages, thereby reducing equipment loss and downtime expenses.Hsieh stated that MEAN WELL's target applications prioritize energy conservation, green energy and smart systems. These technologies prioritize high-efficiency energy conversion, support a variety of communication protocols, and enable remote monitoring. They can be integrated with other products to enhance energy storage and feedback systems in both grid-connected and off-grid setups, effectively fulfilling the stability and intelligent energy demands of modern automation systems. This presentation leverages distributors' expert integration capabilities, combining MEAN WELL power modules with green energy and backup products to create a unified system that provides significant value-added services to end customers.The simultaneous release of key products aims to greatly improve industrial control and energy storage applications solutionsMEAN WELL will exhibit a variety of key products at this exhibition, in addition to the two target applications. These products include the XDR series DIN-rail power modules, the BIC-2200 bidirectional power supply, the LOP-200/300 ultra-thin PCB power supplies, and other solutions that have garnered significant industry attention.The XDR, XDR-E, and XTR represent significant enhancements to MEAN WELL's DIN-rail power supply product line, effectively tackling spatial limitations, thermal management, and communication needs within the industrial and automation sectors. The three products are distinctly categorized: the XDR serves as the premium flagship with superior performance and extensive communication capabilities; the XDR-E presents a budget-friendly alternative; and the XTR accommodates three-phase input, rendering it appropriate for substantial loads and extended usage. series can function at full capacity at 60 degrees Celsius. These products meet international safety standards such as CB, TUV, UL, CE, and UKCA, with some models offering explosion-proof and maritime safety certifications.The BIC-2200 is a bidirectional AC/DC power supply designed to support various energy storage applications by facilitating both charging and discharging operations. It can be paralleled with a maximum of five units for a total output of 11kW, delivering 2200W of power per unit in a 1U ultra-slim rack-mount design. It possesses a bidirectional conversion efficiency of 93% and switching rates of one millisecond. Furthermore, it has an optional CAN bus interface for connection with energy management systems. This product is TUV/UL 62368-1 and CE certified, and adheres to the IEC 62477-1 grid-connection standard. It includes comprehensive protective measures, including islanding protection, overvoltage, overload, short-circuit, and overtemperature safeguards, rendering it appropriate for battery manufacturing and energy scheduling applications like vehicle-to-vehicle (V2G) systems.The LOP-200/300 series is an ultra-thin, high-power PCB-mounted power supply, measuring 4×2×1 inches and around 25mm in thickness. They are offered in 200W and 300W variants, featuring a maximum output capacity of 150% and an output voltage range of 12-54V. They can operate reliably at altitudes of up to 5,000 meters and within a temperature range of -40 to 80 degrees Celsius. The LOP-200/300 series has obtained numerous international safety certifications, including IEC 62368-1, IEC 60601-1, and IEC 61558-1/60335-1. They demonstrate a conversion efficiency of up to 94%, and a leakage current of 500µA, and an integrated auxiliary power supply of 12V/0.5A. The entire series comes with a three-year warranty.Product and application solution partner: MEAN WELL and distributors building a complete value chainAt Automation Taipei 2025, MEAN WELL will present the outcomes of its strategic evolution into a comprehensive product and application solutions partner. Distributors can leverage their specialized expertise, together with MEAN WELL's extensive standardized product line, to create a full value chain from product to application. Hsieh indicated that driven by a triadic strategy of module standardization, application orientation, and customization support, MEAN WELL is moving beyond the traditional role of a power supply manufacturer and evolving into an application-driven power solution partner. In the future, MEAN WELL will enhance its flexible integration and application extension capabilities across automation, energy storage, AI computing, medical care, and high-density equipment. Through close collaboration with industry partners, the company aims to deliver efficient, safe, and stable smart solutions.Caption: XTR Series Ultra-Thin, High-Efficiency, and Durable DIN Rail Power Supply.Caption: XDR-E Next-Generation Ultra-Thin DIN Rail Power Supply.

Taiwan has officially transitioned into a super-aged society. The swiftly increasing older demographic and the labor force deficit have resulted in a significant scarcity of nursing personnel. By 2030, it is projected that the global demand for nursing personnel will rise by 5.5 million to 7.4 million, necessitating an increased patient care burden on medical professionals.Simultaneously, the quality standards of contemporary medical care are perpetually advancing, while the nursing operational procedures have become increasingly intricate and burdensome, hence augmenting the workload and time constraints faced by nursing personnel. Confronted with multiple problems, medical institutions must devise ways that sustain high-quality care while alleviating the pressure on nursing personnel. In response, Far Eastern Memorial Hospital (FEMH) implemented the ASUS VivoWatch smart band to significantly enhance nursing efficiency and service quality.The aging population affects medical care: Smart wearables helpLiu, Cai-wen (transliterated from Chinese), supervisor of the FEMH Nursing Department, stated that the ASUS VivoWatch, a wearable produced by ASUS, can automatically measure patients' vital indicators such as heart rate, blood pressure, and blood oxygen levels. It transfers this data to the hospital system in real time using its built-in Bluetooth module, allowing for continuous 24-hour physiological monitoring. Furthermore, the device boasts a pleasant and lightweight design, suitable for extended usage, which can substantially reduce discomfort and limit interference with patients' daily activities. The FEMH Information Technology Department has partnered with the ASUS team to link the wearable device to the hospital's information system, incorporating it with the early warning system to provide an automated health risk assessment process. Upon detecting abnormal vital signs in a patient, an alert notification can be promptly generated to improve care response efficiency and ensure patient safety.Liu stated that this solution effectively addressed numerous clinical pain points. Firstly, nursing workers are no longer required to measure physiological data during the night to prevent disrupting patients' sleep. Secondly, the wearable device autonomously captures physiological data, alleviating the burden on nursing staff regarding manual measurement and documentation; thirdly, high-frequency automatic monitoring, in conjunction with an early warning system, facilitates the medical team in identifying early indicators of deteriorating conditions, thereby enhancing patient safety. This smart wearable is being utilized in the VIP and general acute wards at FEMH, serving inpatients aged 18 and above. An Institutional Review Board (IRB) has authorized the assessment of the proposal's ethical criteria and safety.Clinical advantages are reinforced in a variety of ways, resulting in a win-win situation for both patients and nursesThe efficiency of FEMH nursing operations has been substantially improved by the implementation of ASUS VivoWatch wearable devices. The automated measurement and data recording capabilities allow nursing staff to focus on patient care and emergency interventions, thereby achieving the objective of "minimizing pressure and workload." The ASUS VivoWatch wearable is seamlessly incorporated with the EWS system, allowing the nursing team to promptly identify abnormal patient signs. This integration reduces the occurrence of abrupt deterioration incidents and improves patient safety. The real-time update function of physiological data boosts the quality of care by enhancing the speed and accuracy of decision-making for the medical team. Additionally, patients are less frequently disturbed during sleep by traditional measurement methods, which strengthens hospital comfort and recovery outcomes.Liu noted that FEMH and ASUS will continue to expand the use of the wearable device across wards and for patients with various diseases, while also improving technology integration. Simultaneously, they will promote the standardization of smart care by using technology to simplify consistent nursing operational procedures, so boosting overall medical service quality and the hospital's potential for long-term development. It is hoped that by combining clinical nursing experience with technical innovation, we would be able to handle the caregiving challenges posed by an aging population and attain the long-term care aim of "nursing personnel and technology collaborating," Liu concluded.