ViTrox, which aims to be the World's Most Trusted Technology Company, is excited to announce its participation in SEMICON Taiwan 2026, one of the world's leading semiconductor industry events. The exhibition will take place from 2 to 4 September 2026 at TaiNEX 1 & 2 in Taipei, Taiwan. Visitors can visit ViTrox at TaiNEX 2, 1F, Malaysia Pavilion, Booth #P6006.The semiconductor industry continues to face increasing challenges as packaging architectures such as SiP, memory technologies like HBM, and advanced processes such as CoWoS become more widely adopted. While these technologies enable higher performance and integration, they also introduce greater process complexity and stricter quality requirements.Key challenges include:-Precision Bottlenecks: Sub-micron defect detection requires inspection capabilities beyond conventional methods.-Hidden Complexity: Advanced 3D structures often conceal internal defects that are difficult to detect.-Yield Pressure: Rising investment in advanced manufacturing places greater emphasis on first-pass yield and equipment efficiency.To address these challenges, ViTrox provides next-generation AI-powered vision inspection solutions that enhance detection accuracy, improve process stability, and support efficient semiconductor manufacturing.At SEMICON Taiwan 2026, ViTrox will showcase a fully integrated inspection ecosystem that seamlessly supports the entire semiconductor manufacturing journey, delivering end-to-end quality assurance from wafer to board level.At the Wafer Level, we address the earliest stages of manufacturing with the WiX Ai Smart Wafer AOI Machine. This an unified platform that gives fabs full-depth wafer visibility, from surface to inner layer, before wafers progress to later stages. It detects sub-micron surface defects (< 1 µm) with AI-enhanced accuracy, while proprietary SWIR technology uncovers hidden inner cracks that conventional inspection cannot see.During Die Sorting & Packaging, once the wafer is transformed into dies, precision sorting becomes critical. Our PX40Ai Smart Die Sorting Machine streamlines high-speed sorting, six-sided inspection, and tape-and-reel packaging, replacing conventional manual inspection with exceptional accuracy and improved production efficiency.Designed to address the growing complexity of advanced packaging, the TH3000i Smart Tray Based Vision Handler combines an adaptive vision system with AI-powered defect detection to support diverse package inspection requirements. Building on this intelligent inspection capability, V-ONE In-Process Verification further enhances overall inspection efficiency by enabling remote inspection review and verification.During Final Assembly & Post-Seal, the VR20Ai G2 Smart Post Seal Vision Handler minimises machine idle time through a high-speed dual-track system design, while supporting automated tape insertion and width conversion (8 to 32 mm), ensuring compliance with international quality standards.At the Strip & Board Level Inspection stage, the V510Ai Smart 3D AOI System for Substrate-Level and SiP Inspection utilises high-resolution 3D measurements and SWIR imaging to detect surface anomalies, component offsets, and inner die cracks on strips and complex high-density modules, ensuring robust inspection for IC package integrity.During the show, ViTrox will also introduce our SMT Full Line Solutions, including Smart 3D SPI, Smart 3D AOI System, Smart 3D AXI System, and Smart Robotic Optical System (ARV). These smart manufacturing solutions are linked to ViTrox's Manufacturing Intelligence Solutions Towards Industry 5.0 – V-ONE to form an end-to-end AI-driven Inspection Ecosystem, guaranteeing seamless data connectivity and true closed-loop control. Ultimately, this comprehensive integration enables manufacturers to reduce human error, accurately detect defects early, optimise process performance, and maintain consistent product quality across every production stage.Visit at TaiNEX 2, 1F, Malaysia Pavilion, Booth #P6006 to connect with experts and discover tailored inspection solutions for any manufacturing needs. To schedule a meeting with ViTrox team during the exhibition, simply complete the appointment form. For further inquiries, please contact us at enquiry@vitrox.com. 

BIOSTAR, a leading manufacturer of edge AI solutions, industrial motherboards, and edge computing systems, today announces its participation in embedded world North America 2026, taking place September 22–24, 2026 at the Anaheim Convention Center in Anaheim, California, USA. At Booth 6512 in Hall B, BIOSTAR will showcase its latest edge AI and IPC computing solutions, giving visitors a firsthand look at technologies developed for smart manufacturing, smart cities, and smart retail applications.At this year's expo, BIOSTAR will feature a comprehensive portfolio of industrial motherboards and EdgeComp systems, along with live demonstrations designed to address a wide range of edge computing requirements. Highlights include AI IPC solutions powered by Intel Core Ultra platforms, edge AI computing solutions featuring NVIDIA Jetson Orin and Thor platforms, and industrial-grade systems built for dependable deployment across commercial and industrial environments.The industrial motherboard lineup will include the Intel W880, Panther Lake as well as Wildcat Lake platforms. Spanning a range of platform configurations, form factors, and connectivity options, these boards give developers, system integrators, and industrial solution providers a flexible foundation for building application-specific IPC systems.BIOSTAR will also present an extensive selection of EdgeComp systems, including the Intel Panther Lake and NVIDIA Jetson Thor, Jetson Orin edge AI platforms, together with the new WildCat SBC rugged system. Ranging from compact single-board designs to higher-performance networking and gateway platforms, this lineup supports both conventional edge computing workloads and emerging edge AI applications across smart manufacturing, smart cities, and smart retail environments.Live demonstrations will feature the EdgeComp edge AI platforms. Together, these demonstrations will give visitors a practical view of how compact edge platforms can support real-time data processing, intelligent monitoring, and connected industrial applications.BIOSTAR invites industry professionals, system integrators, technology partners, and IPC innovators to visit Booth 6512 in Hall B and experience its latest edge computing and edge AI solutions firsthand. The BIOSTAR team looks forward to connecting with industry peers, discussing emerging application requirements, and exploring new opportunities for collaboration at embedded world North America 2026.

SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has decided to build new fabs in Yongin and Cheongju to respond to the continuously growing demand for memory in the AI era.The company approved a total investment of approximately 54 trillion, on 35.2 trillion won in Yongin "Y2" fab and 19.1 trillion won in the Cheongju "M17" fab, in a board meeting.This decision represents execution of the mid-to-long-term investment strategy announced by the company last June. Under its master plan to invest 600 trillion won in the Yongin Semiconductor Cluster and 100 trillion won to expand its Cheongju production base, SK hynix is currently constructing its first fab in Yongin (Y1). With this latest decision, the company is embarking on the construction of subsequent fabs in both Yongin and Cheongju.According to market research firm Omdia, both DRAM and NAND demand are projected to maintain a compound annual growth rate (CAGR) of 19% from last year through 2030. The company views this growth not as a temporary supercycle, but as a structural transformation in which memory transcends its role as a mere component to become core infrastructure determining AI performance itself.SK hynix stated that in the AI era, technological competitiveness alone is not enough and the ability to supply the required volume at the exact moment customers need it is the ultimate competitive advantage. We reached this investment decision after a thorough review of market demand.Yongin Y2 is the second of four fabs planned sequentially for the Yongin Semiconductor Cluster. It will serve as a DRAM production base spanning a total floor area of 341,000 pyeong (approximately 1,130,000m2). Construction is scheduled to break ground in July next year, targeting the opening of its first cleanroom in June 2029 to produce high-bandwidth memory (HBM) and other next-generation DRAM products. Meanwhile, construction on Y1 is progressing smoothly toward its initial cleanroom opening target of February next year.SK hynix previously set a goal to advance the completion date of the Yongin Semiconductor Cluster by 12 years—from the originally planned 2045 to 2033—to finish constructing all four fabs. The Y2 construction serves as the second phase supporting this accelerated timeline and the investment spans to October 2031 sequentially.The investment amount includes construction costs for "Business Support Building" with administrative and welfare facilities for Y2 personnel, an "Integrated R&D Center" to consolidate product development testing, analysis, and experiments, as well as auxiliary infrastructure1..1Auxiliary infrastructure: Water treatment facilities, utility conduits (underground structures capable of accommodating power lines, telecommunications lines, water/sewer pipes, and thermal supply lines), substations, warehouses, etc.For the Yongin Semiconductor Cluster—sprawling over approximately 1.26 million pyeong(approximately 4,160,000m2) in Wonsam-myeon, Cheoin-gu, Yongin-si, Gyeonggi-do—Phase 1 power and water infrastructure required up through Y2 operation is nearing completion, currently at a 99% progress rate. As fab construction and infrastructure setup have been carried out concurrently, the company plans to proceed with the Y2 construction according to schedule.In the NAND market, demand is surging rapidly centered on enterprise SSDs driven by the full-scale expansion of AI services. This is further boosted by demand for key-value (KV) cache2 storage in AI inference, with application fields expected to broaden further as Agentic and Physical AI are introduced.2KV Cache: A technique that stores and reuses previously computed Key and Value vectors to minimize inefficient redundant calculations during inference.SK hynix selected Cheongju as its new NAND fab base because it offers the fastest fab construction timeline. The Cheongju Campus already houses the M11, M12, and M15 fabs, enabling efficient production linked to existing operations on sites equipped with substantial pre-established power and water infrastructure. Cheongju M17 will be built across a total area of 206,000 pyeong(approximately 680,000m2), breaking ground in February next year with plans to open its first cleanroom in December 2028. The investment period runs through April 2031 according to the master plan.SK hynix plans to proactively secure production infrastructure based on mid-to-long-term demand discussed with customers, while expanding actual production capacity in alignment with the timing of customer needs. Fabs will be constructed according to the master schedule, whereas cleanroom expansions and equipment installation will take place sequentially in line with demand trends to maximize capital efficiency.The company expects this investment to secure future growth foundations while strengthening the competitiveness of the domestic semiconductor ecosystem and boosting local economies. The large-scale simultaneous investments in Yongin and Cheongju are anticipated to expand joint growth opportunities for supply chain partners, generate employment, and revitalize local commercial districts, thereby contributing to the sustainable growth of the national economy.An SK hynix official stated that "This investment is a decision made to seize opportunities in line with the market's growth speed. By proactively securing production capabilities, we aim to establish ourselves as a key partner in AI infrastructure, contributing to the stability of the global AI semiconductor supply chain."SK hynix's Cheongju M17 fab.Credit: SK hynix