Test Research, Inc. (TRI), the leading provider of Test and Inspection solutions for the electronics manufacturing industry, is proud to announce the launch of the TR7950Q SII Series. This highly modular platform is a dedicated solution for Back End Process and Advanced Packaging Inspection, ranging from patterning to wafer saw, and is engineered to set new benchmarks in wafer inspection and micro-measurement metrology.The AI-powered Wafer Metrology and Inspection Platform, TR7950Q SII, is built on a high-stability granite platform and the system supports 6" to 12" wafers. The platform features robust Automated Visual Inspection (AVI) for high-speed detection of surface defects, including particles, scratches, chipping, contamination, and foreign materials.The optional Short-Wave Infrared (SWIR) module allows the system to penetrate silicon to detect hidden inner cracks and subsurface defects invisible to standard sensors. For high-detail requirements, the platform offers 0.5 µm or 1 µm high-resolution imaging via the 3D DFF (Depth from Focus) module.The TR7950Q SII provides high-precision metrology for wafer thickness, top-side warpage, and complex surface topography, alongside high-speed sensing for Through-Silicon Via (TSV) depth, trench dimensions, thin film, and Chiplet metrology. Please visit the link to learn more about the TR7950Q SII.Credit: TRI

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced a strategic technical collaboration with Wiwynn, an innovative cloud IT infrastructure provider for data centers. This collaboration integrates GUC's flagship SoC design and 2.5D/3D advanced packaging with Wiwynn's expertise in rack-scale system integration, liquid cooling and optical interconnect. Together, the collaboration enables hyperscale customers to transition more efficiently from silicon definition to deployment-ready AI infrastructure.AI clusters continue to scale in performance, bandwidth and power density, hyperscalers must increasingly evaluate silicon, packaging, interconnect, thermal and rack-level design choices much earlier in the development cycle. Through this collaboration, GUC and Wiwynn are aligning key technology pillars, including leading-edge ASIC implementation, 2.5D/3D advanced packaging, optical I/O, power delivery, thermal architecture, manufacturability, serviceability and rack-scale integration. By addressing these factors holistically at the outset, the collaboration partners aim to reduce integration complexity, improve development efficiency and accelerate the transition from silicon-ready innovation to system-ready AI infrastructure."As AI infrastructure evolves beyond chip-level optimization and scale-up networks push the limits of conventional electrical interconnects, close alignment across silicon to system architecture become critical," said Aditya Raina, Chief of Marketing of GUC. "By collaborating with Wiwynn, we are helping hyperscale customers evaluate critical system-level tradeoffs earlier, integrating optical I/O to deliver the bandwidth and power efficiency required for next generation AI systems. This partnership establishes a more practical, holistic path from flagship ASIC development to deployable, rack-scale AI infrastructure."With deep expertise across board-level innovation, rack-scale integration, and manufacturing, Wiwynn effectively bridges semiconductor innovation with data center deployment," said Tony Wen, Vice President at Wiwynn. "Together with GUC, we are enabling a comprehensive silicon-tosystem approach that delivers scalable, efficient and serviceable AI infrastructure tailored for nextgeneration hyperscale environments."For more information, please visit.

Cincoze has unveiled its all-new CV-200 Series slim-bezel industrial displays. The CV-200 Series features a minimalist profile, a narrow bezel, and industrial-grade reliability for industrial panel PCs and industrial touch monitors. Specifically engineered for modern factory HMI and process visualization, they carefully balance the durability required for harsh environments with seamless equipment integration and intuitive operation. The modular design of the CV-200 Series offers screen sizes from 10 to 21.5 inches for over 40 possible configurations. The first release is the 21.5" Full HD models with almost ten configuration options for various application needs.Ultra-Slim Bezel, High Visibility, and an Intuitive User ExperienceThe CV-200 Series offers clear visuals and smooth operation, and integrates easily into production line equipment. Its slim, die-cast aluminum alloy frame has a bezel less than 3mm wide, increasing the display area without changing existing equipment setup. The Full HD screen and 178° wide viewing angle ensure clear and crisp readability from any position. Every model features a projective capacitive (P-Cap) touchscreen with an anti-glare (AG) coating for the clearest images, even in high-brightness indoor lighting conditions. Touch response is fast and precise, making daily HMI operation smoother and more natural.Rugged and Durable for Industrial and Humid EnvironmentsThe CV-200 Series is built to handle harsh, humid industrial environments. It has an IP66-rated front panel and Wet Tracking technology, so the touchscreen works reliably even with wet fingers or splashes of water. The backlight lasts up to 50,000 hours, and a 7H hardness Glass-Glass (GG) panel adds durability. The CV-200 Series meets the IEC 61000-6-4 industrial EMC standard, ensuring stable, long-term operation and giving operators total peace of mind.Flexible Modular DesignCincoze's exclusive Convertible Display System (CDS) technology lets you pair the CV-200 Series with embedded computer modules (P2000/P1000 Series) or monitor modules (M1000 Series). Customers can configure the system as either an industrial panel PC or an industrial touch monitor, depending on display size, computing performance, and functional requirements. This plug-and-play design simplifies deployment and maintenance. If repairs are needed, only a single module needs to be replaced, cutting downtime, lowering maintenance costs, and streamlining future upgrades.