At COMPUTEX 2025, ASUS showcased its comprehensive AI infrastructure solutions, targeting the computing needs of data centers, edge computing, and a wide range of intelligent applications. With a robust product portfolio, ASUS brings to life the NVIDIA AI Factory vision, illustrating how AI will be deeply embedded into enterprise IT infrastructure. This evolution continues to drive forward applications and services that shape the future of AI and high-performance computing

Linxens, a global leader in component-based solutions for authentication and traceability, and Dracula Technologies, a pioneer in ambient light energy harvesting, have announced a strategic collaboration to develop next-generation autonomous IoT solutions for traceability and smart labelling applications. This collaboration paves the way for smarter and more sustainable connected devices

Technology news, product launches and show highlights from the event attendees available for download (PDF).

As the demand for high-performance power semiconductors continues to escalate across automotive and industrial sectors, Henkel is addressing one of the industry's most pressing challenges: thermal management in next-generation power devices.Henkel will host a technical webinar introducing its patented Polymerization-Induced Phase Separation technology platform-an advanced solution engineered to meet the evolving requirements of power device performance, reliability, and cost-efficiency.Thermal Control as a Critical EnablerWith rising operational temperatures directly impacting device reliability and efficiency, effective heat dissipation has become essential. The industry's transition to bare copper (Cu) designs-driven by cost and reliability considerations-further underscores the need for die attach materials that combine high thermal conductivity with Cu compatibility.Henkel's innovative technology enables die attach formulations that could meet automotive Grade 0 thermal cycling and MSL1 reliability standards; provide high bulk thermal conductivity for metallized or bare silicon die; ensure compatibility with a wide range of die finish and lead frame combinations, including bare copper; deliver improved RDS(on) performance compared to conventional die attach materials; support copper wire bonding processes. This event marks the first installment in Henkel's Power Device Webinar Series, designed to provide engineers, designers, and industry stakeholders with insights into materials innovations that address the increasing demands of power semiconductor applications.To particiapting in this webinar titled :"What's Powering the Next-Gen Power Device Performance" on 2025/11/28 10:00-10:45 am (Singaporean Time GMT+8), please register, click here to register.Participants will gain exclusive access to Henkel's technical experts and learn how this proprietary platform is setting new benchmarks in thermal performance and reliability for power devices.

When you walk the halls of the TPCA Show Taipei 2025, one theme is impossible to miss: AI is no longer the future-it's the engine driving the next great wave of electronics manufacturing. From cloud data centers to handheld devices, Artificial Intelligence is reshaping how the world processes information. And behind every AI-driven device is an intricate network of high-performance PCBs, advanced substrates, and precision manufacturing technologies.Reporter Gary with the MKS-Atotech leadership team, including the CEO. Credit: MKS-AtotechAt the center of this transformation stands MKS Instruments, whose strategic brands Atotech and ESI are powering the next chapter of Asia's semiconductor and advanced electronics industries.The New Frontier: AI and the Rise of Advanced PackagingAI's explosive growth has created a new set of demands: faster computing, higher data throughput, and unprecedented integration of components. The era of simple, monolithic chips is long gone. Today's AI processors rely on heterogeneous integration, where multiple chiplets are packaged together on complex organic substrates."It's a materials revolution," explains Dave Henry, Executive Vice President Global Strategic Marketing and GM, Materials Solutions Division. "Our technologies touch more than 70% of the critical steps in PCB and substrate manufacturing-and over 85% of semiconductor front-end processes. MKS is deeply embedded in the future of electronics."This new generation of packaging requires ultra-fine features, tighter interconnects, advanced metallization, and laser-drilled structures at microscopic scale. The PCB industry-particularly in Taiwan-is experiencing a surge in demand, driven by applications in AI, HPC, satellite communications, automotive electronics, and beyond.Inside the MKS Booth: Where Chemistry Meets Systems Technology: From Via Drilling Lasers to horizontal and vertical chemical process equipmentOne of the busiest destinations at TPCA 2025 was the MKS booth, where crowds gathered to explore a unique, fully integrated portfolio: lasers, chemistry, plating systems, motion control, optics, software, and more.MKS is one of the few companies in the world capable of delivering this level of end-to-end process integration. Its Atotech and ESI brands showcased side-by-side how laser drilling, surface treatment chemistry, plating systems, and advanced software work together to Optimize the InterconnectSM—a strategic approach to enabling next-generation electronics.This unified offering is more than convenient-it's transformational"AI chips require high-speed interconnects, smaller geometries, and new substrate materials," says Harald Ahnert, Vice President and GM of Chemistry. "Our solutions bring together decades of expertise to help customers manufacture these advanced products at scale."Spotlight on Innovation: The Technologies Everyone Was Talking AboutA walk through the MKS booth was a look into the future of electronics manufacturing, with several standout technologies drawing sustained attention from visitors.One major area of focus was breakthrough chemistry for advanced substrates. MKS highlighted InPro Pulse TGV, designed for high-aspect-ratio through-glass vias, alongside Cuprapulse IN, a reverse-pulse plating solution developed for HDI and package substrates. For reliable final finishing, the company showcased Aurotech G-Bond 3, Stannatech 2100, and PD Core, complemented by EcoFlash S300U, Bondfilm EX, and Novabond PX-S2, which support high-speed, low-loss signal integrity. Taken together, these chemistry solutions cover a broad spectrum of manufacturing needs, from SAP and SLP production to ultra-fine line formation down to 2/2 μm.Another highlight was the portfolio of next-generation equipment systems. G-Plate was presented as a solution for high-volume PTH processing with capability below 5/5 μm, while vPlate offered continuous vertical plating with industry-leading uniformity. Uniplate platforms were positioned as robust systems for mass production of HDI PCBs, and the PLB Line was specifically engineered to meet the demanding requirements of AI server boards. Combined, these systems form a core platform for the future of PCB and substrate fabrication.The ESI brand further elevated the booth with cutting-edge laser systems. Capstone was featured for high-throughput UV flex drilling, Geode A demonstrated precision CO？ processing of ABF laminates, and Geode G2 showcased ultra-fast via drilling for HDI and mSAP applications. "The industry is facing growing complexity: more I/O, more drilling, more layers," says Michael Stubelt, VP and GM of Equipment Solutions. "Our laser systems give manufacturers the flexibility and productivity advantage they need."Why Glass Substrates Are the Next Big ThingOne of the most talked-about highlights at the show was a striking, panel-scale processed glass substrate sample on display at the MKS booth. Glass, once considered exotic, is fast gaining traction as the next major substrate material in heterogeneous integration.MKS is developing complete process flows for glass—including surface preparation, seed-layer formation, metallization, and via filling—combining Atotech chemistry with ESI's high-speed laser drilling. This collaboration reflects a broader theme: MKS doesn't just deliver tools; it builds ecosystems.Scaling Up: New Investments Across Southeast AsiaWhile the spotlight was on technology, MKS also shared details of its expanding regional footprint. "Competition in APAC and Greater China is intense," says George Yang, VP and GM for MKS Greater China. "Our strategy is to be local—local manufacturing, local tech support, local expertise." Today, MKS operates 14 manufacturing sites across the APAC region and is investing aggressively in Southeast Asia.One of the major new investments is a Super Center for wafer fabrication equipment in Penang, Malaysia, which has been under construction since 2024. In Samut Prakan, Thailand, the company has recently opened a Tech Center and manufacturing site dedicated to PCB and substrate development, further strengthening its presence in advanced electronics manufacturing.MKS is also moving ahead with a flagship expansion in Thailand. In May 2025, the company broke ground on a new Atotech chemical manufacturing facility and Tech Center near Bangkok, representing an investment of more than US$40 million. The site is designed for an annual capacity of 18,500 tons and is scheduled to begin operations in the second half of 2027. As Thailand rapidly emerges as a major PCB manufacturing hub and attracts investments from China, Korea, Taiwan, and Japan, MKS aims to be a pillar in this fast-growing ecosystem.The Road Ahead: Enabling the Electronics of TomorrowFrom semiconductors and substrates to optical systems and laser drilling, MKS Instruments touches nearly every step in the electronics manufacturing chain. Its integrated approach—rooted in deep expertise across materials science and precision engineering—provides customers with the tools needed to build faster, more compact, more efficient AI hardware."MKS is proud to contribute to the industry's move toward advanced and eco-friendly manufacturing," says Wayne Cole, Senior Vice President of Global Sales and Service. "Our mission is to help customers stay competitive in a world that is evolving faster than ever."With major investments across Southeast Asia, a powerful portfolio of technologies, and a unified vision MKS is not just participating in the AI revolution-it is helping to build the foundation on which the future of electronics is being created.MKS is enabling the shift from transistor scaling to advanced integration - merging logic, memory, and photonics. The company's APAC Tech Centers act as co-innovation hubs for customers, encompassing: supporting R&D, process training, and sub-5/5 µm SAP prototyping.These centers are not just service nodes - they're bridges between customer vision and manufacturing reality.MKS has a proud history of innovations and inventions that have shaped the evolution of the key industries we serve. As a global leader in providing equipment, processes, and production solutions that power the most advanced electronic devices, our expansion in Asia reflects our commitment to supporting the growth of the semiconductor, PCB, and package substrate markets in this region. We are excited to be a key player in the future of technology and look forward to continuing to invest in Asia's bright future.  Reporter Gary interviewed the MKS-Atotech leadership team at TPCA Show 2025. Credit: MKS-Atotech

Robust computational capabilities are fueling the rapid evolution of artificial intelligence (AI) applications. The rise of large language models (LLMs) such as ChatGPT-5 has triggered a surge in global data center investments, accelerating the expansion of Taiwan's semiconductor and server industries. Today, the production, assembly, and outsourcing of AI servers have become key benchmarks for industry and technology leaders aiming to lead in global AI innovation. As high-density CPU and GPU architectures continue to advance, the demand for next-generation cooling technologies has intensified dramatically.In an exclusive interview on "Thermal Solutions Powering the AI Era" with host Ashley Chu on IC Radio Broadcasting, Ricky Yu, Deputy Manager at T-Global Technology, and Director Chris Chuang discussed how rapid advancements in AI-integrated electronic devices are reshaping thermal design. They emphasized that thermal management-critical for improving heat dissipation efficiency-has emerged as one of the most pressing engineering challenges in the AI era. Currently, the industry is witnessing a significant transition from traditional air-cooling approaches to liquid-cooling systems in the design of thermal modules for advanced processors.The thermal design power (TDP) of processor cooling modules initially started at around 800 W and rose to 1,200 W by 2024, following updated thermal specifications. Today, TDP levels have reached 2,300 W, marking a steep upward trend. The cooling module market is thriving, and Chuang predicts that specifications may soon exceed 5,000 W, and could potentially approach 10,000 W in the near future - an unprecedented leap in thermal design requirements.Currently, three primary cooling methods dominate thermal management: air cooling, liquid cooling, and immersion cooling. Among these, air and liquid cooling remain the mainstream technologies, utilizing a variety of materials to absorb and dissipate heat efficiently.Immersion cooling, on the other hand, represents a promising frontier in heat dissipation. This approach submerges entire servers in electrically insulating fluids to achieve maximum thermal efficiency. While it delivers superior performance, its high cost and complex system integration continue to pose challenges, and the technology remains under active development and validation.As AI computing power continues its exponential growth, the demand for high-performance, reliable, and sustainable thermal solutions will only intensify. Companies like T-Global Technology are at the forefront of this transformation-bridging the gap between innovation and practicality, and empowering the world’s transition into the high-efficiency, high-density era of intelligent computing.PCM Development Exacerbates Heat Dissipation Challenges in AI EraYu notes that only a handful of technology giants - particularly those engaged in large language model (LLM) training - exhibit such extraordinary energy consumption in the development of advanced AI technologies. In contrast, small and medium-sized enterprises, as well as general consumers, tend to prioritize thermal solutions that balance performance and cost for their specific applications. Recognizing this market need, T-Global Technology is actively expanding its presence in this growing segment.To meet evolving thermal challenges, T-Global continues to invest in cutting-edge materials and technologies for product research and development. These include liquid metal, metal heat sinks, aluminum silicon carbide (AlSiC), and indium sheets - materials engineered to enhance heat dissipation and conductivity. The company is also advancing the design and manufacturing of solid-state heat sinks, metal modules, and cooling fans, ensuring customers receive more comprehensive and efficient thermal solutions across diverse applications.In recent years, T-Global has also integrated phase-change materials (PCMs) into new product lines. These materials, initially solid and easy to assemble, transition to a liquid state when exposed to heat, enabling efficient heat absorption and transfer. This liquid-metal-based cooling approach, already adopted in high-end gaming PCs and consoles, has emerged as a new technological highlight in advanced thermal design.To address the common issues of material overflow and cost associated with liquid metal, T-Global has developed an innovative containment design that effectively prevents leakage and corrosion - two factors that could otherwise compromise system stability and longevity. This advancement underscores the company's ongoing commitment to developing safer, more reliable, and performance-driven thermal technologies for the AI generation.Actively Enhance Global Synchronous Service Operations and Customer CollaborationIn parallel with the advancement of emerging technologies, Ricky Yu analyzed real-world customer use cases to identify their most pressing challenges. One key issue arises when clients face space constraints in computer rooms or data centers. To accommodate greater cooling demands, they often seek to upgrade thermal performance using existing equipment and infrastructure, rather than complete system overhauls.For instance, when power consumption requirements rise from 200W to 500W and even 1,000W, customers look for solutions that enhance cooling efficiency without disrupting the surrounding environment. This shift has redefined T-Global's role - transforming the company from a traditional supplier of complete cooling modules into a consultative partner that collaborates closely with clients to develop tailored, high-efficiency solutions.Global Expansion and Manufacturing ExcellenceTo meet growing international demand and the globalization of supply chains, T-Global Technology has intensified its manufacturing and operational investments. The company has established a network of zero-time consultants in China, Japan, and other overseas markets, ensuring 24/7, 365-day global support and synchronized operations.At the same time, T-Global continues to expand its overseas manufacturing base in Vietnam while scaling up production capabilities at its Taiwan headquarters. By leveraging its vertically integrated strengths in research, design, and manufacturing, T-Global is well-positioned to seize the opportunities emerging from the AI era's rapid growth - delivering agile, high-performance, and globally supported thermal solutions to customers worldwide.