Interested in knowing how to solve the microcrack problem in through-glass via (TGV) fabrication? Interested in knowing how to supply 1,000 Watts, 1 Volt and 1,000 Amperes electricity to semiconductor IC chips in an AI multichip package? Interested in knowing how to increase the glass panel size for manufacturing AI multichip packages? If so, visit iCometrue® at Booth M0957, Hall 1, 4F, Taipei...

Keywave Technology is a fabless semiconductor company founded in December 2022 that specializes in radio frequency (RF) integrated circuit (IC) design and advanced radar sensing solutions...

Rapid evolution of High-Performance Computing (HPC) and artificial intelligence chips for Hyperscalers and tech giants continue pushing large sized silicon demands...

At SEMICON Taiwan 2026 Booth T9116, SiliconAuto will showcase automotive-grade silicon solutions for Physical AI, developed through collaboration across Taiwan's world-leading semiconductor ecosystem. Visitors can experience live demonstrations of technologies designed to power future robotics and autonomous driving applications...

DAS Environmental Expert GmbH today announced the launch of ALCEA, a new secondary abatement solution for nitrogen oxide (NOx) emissions in semiconductor manufacturing. Installed downstream of NOx-generating waste gas treatment units, ALCEA can reduce NOx by up to 95 percent while its catalyst stage is integrated directly into the exhaust duct, minimizing additional floor space in the subfab...

As transistor scaling becomes more difficult and costly, advanced packaging has become one of the most important paths for extending Moore's Law...

NewPower Worldwide, one of the electronics industry's fastest-growing distributors, today announced it has expanded its committed credit facility to $750 million, further enhancing its ability to invest in inventory, support customer growth, and capitalize on opportunities across the global supply chain.

Tescan will participate in SEMICON Taiwan 2026 from September 2 to 4 at Booth R8201, 4F, Taipei Nangang Exhibition Center Hall 2 (TaiNEX 2). Under the theme "Streamlined Failure Analysis for Advanced Packaging," Tescan will present a correlative workflow that connects defect localization, rapid access to regions of interest (ROIs), site-specific sample preparation, and nanoscale characterization.

Global technology and innovation leader ASMPT will showcase its advanced packaging portfolio at SEMICON Taiwan 2026, taking place from September 2 to 4 in Taipei. At Booth L0716 (TaiNEX 1, Level 4)...

As the number of video and information sources in today's workplaces continues to grow, small control rooms, meeting rooms, and multimedia environments often need to connect multiple computers and other AV sources while displaying different types of content across multiple screens...