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Wednesday 2 September 2026
World Diamond Technology accelerates mass production of 300 mm diamond wafers
As AI, high-performance computing (HPC), and advanced packaging continue to move toward higher levels of power integration, chip power consumption is rising rapidly. Thermal management has therefore become a critical factor affecting performance, reliability, and system design...
Wednesday 2 September 2026
Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
Taiwan is home to the world's most advanced semiconductor ecosystem. The island produces over 60% of global contract chip manufacturing and dominates key segments from IC design to advanced packaging. For international engineers, joining this ecosystem represents an opportunity to work at the frontier of chip technology - but succeeding here requires more than technical brilliance...
Wednesday 2 September 2026
8 September Hsinchu seminar: Silicon photonics driving AI chains
As AI infrastructure drives demand for higher bandwidth, lower power consumption and faster connectivity, silicon photonics is becoming increasingly important to the future of computing. However, moving technologies such as silicon photonics and co-packaged optics (CPO) from development to commercial deployment presents a critical challenge: how to achieve reliable, high-volume production.
Wednesday 2 September 2026
Innovative Solutions for Fabricating High-Performance AI Multichip Packaging Using Glass Substrates
Interested in knowing how to solve the microcrack problem in through-glass via (TGV) fabrication? Interested in knowing how to supply 1,000 Watts, 1 Volt and 1,000 Amperes electricity to semiconductor IC chips in an AI multichip package? Interested in knowing how to increase the glass panel size for manufacturing AI multichip packages? If so, visit iCometrue® at Booth M0957, Hall 1, 4F, Taipei...
Wednesday 2 September 2026
Take Control of Your Process: Onto Innovation at SEMICON Taiwan 2026
This year's SEMICON Taiwan will be packed with discussions about artificial intelligence and the on-wafer challenges it's creating, where the advanced node and emerging technology worlds collide. And at the center of it all is the need for better process control at a reduced cost-of-ownership (CoO).
Wednesday 2 September 2026
Keywave Technology innovative radar sensors spark a smart sensing revolution
Keywave Technology is a fabless semiconductor company founded in December 2022 that specializes in radio frequency (RF) integrated circuit (IC) design and advanced radar sensing solutions...
Wednesday 2 September 2026
Manz Asia Broadens ECD Platform for Mass Panel-Level Packaging
Rapid evolution of High-Performance Computing (HPC) and artificial intelligence chips for Hyperscalers and tech giants continue pushing large sized silicon demands...
Wednesday 2 September 2026
SiliconAuto Expands into Physical AI at SEMICON Taiwan 2026
At SEMICON Taiwan 2026 Booth T9116, SiliconAuto will showcase automotive-grade silicon solutions for Physical AI, developed through collaboration across Taiwan's world-leading semiconductor ecosystem. Visitors can experience live demonstrations of technologies designed to power future robotics and autonomous driving applications...
Wednesday 2 September 2026
DAS Introduces ALCEA for Integrated NOx Treatment in Semiconductor Fabs
DAS Environmental Expert GmbH today announced the launch of ALCEA, a new secondary abatement solution for nitrogen oxide (NOx) emissions in semiconductor manufacturing. Installed downstream of NOx-generating waste gas treatment units, ALCEA can reduce NOx by up to 95 percent while its catalyst stage is integrated directly into the exhaust duct, minimizing additional floor space in the subfab...
Tuesday 1 September 2026
Rising Packaging Complexity Elevates Glass in Semiconductor Manufacturing
As transistor scaling becomes more difficult and costly, advanced packaging has become one of the most important paths for extending Moore's Law...