Montreal-based AON3D is setting a new standard through its mastery of high-performance materials and precision 3D printing technology.Co-founded in 2015 by Andrew Walker, Randeep Singh, and Kevin Han - who started the company in his family's basement - AON3D has evolved into a global leader in high-performance additive manufacturing.With an eye on the Taiwan market at COMPUTEX 2026, Han and his team are ready to bridge the gap between complex aerospace technology and the agile SME ecosystem.The Materials Engineer's VisionKevin Han's journey began at McGill University with a background in materials engineering. After operating as a service bureau, Han recognized a gap in the market for machines capable of handling specialized materials. Through multiple product iterations, AON3D today offers it's Hylo High-Temperature 3D Printer, along with Basis, it's advanced physics simulation software for additive manufacturing. Hylo and Basis: AI-Infused and Physics-BasedAON3D's product suite offers an AI-infused manufacturing solution that reduces the trial and error usually experienced in additive manufacturing processes. "What we do is actually model out at the physics level what's going to happen as you run the print job," says Han. "Our technology creates a digital twin of the print, meaning we can use simulation to identify process irregularities that lead to hidden defects, instead of in post-production."Within the Basis platform, simulated data and real data are also compared to offer automatic optimizations. The Power of "Open Materials"AON3D's primary competitive advantage is its "Open Materials" philosophy. Unlike competitors that "lock" users into proprietary, expensive filament spools - much like the cartridges on a paper-based printer - AON3D's platform is supply-agnostic. "We support the full gamut of industrial polymers, but many customers are most interested by high-performance varieties like PEEK, PEKK, and PEI (Ultem)," Han explains. "This includes their carbon and glass-fibre variants, where strength and lightweighting benefits most appeal to demanding industries like aerospace and defense." From NASA to the Factory FloorAON3D's credentials extend to outer space. The company has worked with the Canadian Space Agency (CSA) to print components for the International Space Station, and their parts were aboard the Artemis 1 mission.Closer to home, AON3D's solutions are used by customers like Boeing, Lockheed Martin, Northrup Grumman, and more in aerospace, while also offering benefits to automotive, energy, and general manufacturing. One automotive customer saw full payback under 2 months for their first Hylo purchase, and is eagerly awaiting more. Leveraging Taiwan's EcosystemAt COMPUTEX 2026, AON3D aims to connect with Taiwan's semiconductor packaging and testing sectors. Beyond chips, they see massive potential in Taiwan's drone industry and medical prosthesis field. Hylo's ability to "light-weight" components makes it ideal for rapid drone iteration.  "We want to bring capabilities to a group that didn't have them before," Han concludes. AON3D isn't just selling a printer; they are offering a gateway to the next generation of industrial manufacturing.

The dream of a world without charging cables - where phones, headsets, and even industrial robots never need to be plugged in - is moving from science fiction to reality. AWL Electricity, often referred to by partners as All Electricity, is at the forefront of this shift by leveraging advanced semiconductor breakthroughs to deliver power wirelessly over distance. As the company prepares for COMPUTEX 2026 in Taipei this June, it aims to solidify its position as the global leader in mid-power, mid-range wireless charging.The Breakthrough: GaN and the Five-Foot RadiusThe foundation of AWL Electricity's technology lies in a scientific leap made in 2017 by the invention of CEO Emmanuel Glenn. While the concept of wireless power dates back to Nikola Tesla, traditional low-frequency methods were often unsafe or impractical due to the extreme power required at low frequencies. By utilizing Gallium Nitride (GaN) transistors, the company successfully increased operating frequencies while reducing electric field strength, making the technology safe and highly practical.Unlike standard charging pads that require direct contact, AWL-E's Resonant Capacitive Coupling technology focuses on a 1.5-meter (five-foot) radius. Francis Beauchamp-Verdon, Co-Founder and Chief Revenue Officer, explains that human moves around within a five-foot bubble, whether at a desk, in a car, or at a café. While the company remains "planet-centric" and advises that high-power stationary devices like coffee machines or electric vehicles should remain wired for maximum efficiency, wireless power is reserved for mobility and devices where cables create significant friction.Transforming Industry 4.0Beyond consumer electronics, AWL-E is targeting the "New Age of Physical AI" and smart manufacturing. Modern factory lines can require between 40,000 to 50,000 sensors, with an automotive leader noting that every single wire adds significant connection costs. AWL-E's solution eliminates the need for traditional cable management and drag chains into robotic cells. By powering humanoids and autonomous guided vehicles (AGVs) while they work, factories can eliminate 20% downtime typically lost when robots must sit next to a charging wall.Strategic Objectives for COMPUTEX 2026Taiwan holds a special place in the AWL-E story, as its semiconductor ecosystem enabled the company's initial breakthrough. During the COMPUTEX 2026 mission, the company seeks to collaborate with Taiwanese chip leaders to transition their technology into a dedicated Wireless Power Chip, which would make the solution smaller, cheaper, and more accessible. Additionally, the company hopes to help Taiwan improve its own chip-making tools, specifically in vacuum environments where wires are a "worst enemy," creating a symbiotic relationship where AWL-E powers the machines that build the chips.Beauchamp-Verdon will be carrying a portable demo unit to the event to prove that this innovation is ready for today's market. He believes that seeing technology in action is essential for the Taiwanese industry, where "seeing is believing" is a core mindset. AWL-E currently maintains flagship projects in consumer electronics, automotive, and factory automation across Asia and intends to use this visit to find the right partners for their next level of expansion.

Test Research, Inc. (TRI), the leading provider of Test and Inspection solutions for the electronics manufacturing industry, is proud to announce the launch of the TR7950Q SII Series. This highly modular platform is a dedicated solution for Back End Process and Advanced Packaging Inspection, ranging from patterning to wafer saw, and is engineered to set new benchmarks in wafer inspection and micro-measurement metrology.The AI-powered Wafer Metrology and Inspection Platform, TR7950Q SII, is built on a high-stability granite platform and the system supports 6" to 12" wafers. The platform features robust Automated Visual Inspection (AVI) for high-speed detection of surface defects, including particles, scratches, chipping, contamination, and foreign materials.The optional Short-Wave Infrared (SWIR) module allows the system to penetrate silicon to detect hidden inner cracks and subsurface defects invisible to standard sensors. For high-detail requirements, the platform offers 0.5 µm or 1 µm high-resolution imaging via the 3D DFF (Depth from Focus) module.The TR7950Q SII provides high-precision metrology for wafer thickness, top-side warpage, and complex surface topography, alongside high-speed sensing for Through-Silicon Via (TSV) depth, trench dimensions, thin film, and Chiplet metrology. Please visit the link to learn more about the TR7950Q SII.Credit: TRI

Cincoze has unveiled its all-new CV-200 Series slim-bezel industrial displays. The CV-200 Series features a minimalist profile, a narrow bezel, and industrial-grade reliability for industrial panel PCs and industrial touch monitors. Specifically engineered for modern factory HMI and process visualization, they carefully balance the durability required for harsh environments with seamless equipment integration and intuitive operation. The modular design of the CV-200 Series offers screen sizes from 10 to 21.5 inches for over 40 possible configurations. The first release is the 21.5" Full HD models with almost ten configuration options for various application needs.Ultra-Slim Bezel, High Visibility, and an Intuitive User ExperienceThe CV-200 Series offers clear visuals and smooth operation, and integrates easily into production line equipment. Its slim, die-cast aluminum alloy frame has a bezel less than 3mm wide, increasing the display area without changing existing equipment setup. The Full HD screen and 178° wide viewing angle ensure clear and crisp readability from any position. Every model features a projective capacitive (P-Cap) touchscreen with an anti-glare (AG) coating for the clearest images, even in high-brightness indoor lighting conditions. Touch response is fast and precise, making daily HMI operation smoother and more natural.Rugged and Durable for Industrial and Humid EnvironmentsThe CV-200 Series is built to handle harsh, humid industrial environments. It has an IP66-rated front panel and Wet Tracking technology, so the touchscreen works reliably even with wet fingers or splashes of water. The backlight lasts up to 50,000 hours, and a 7H hardness Glass-Glass (GG) panel adds durability. The CV-200 Series meets the IEC 61000-6-4 industrial EMC standard, ensuring stable, long-term operation and giving operators total peace of mind.Flexible Modular DesignCincoze's exclusive Convertible Display System (CDS) technology lets you pair the CV-200 Series with embedded computer modules (P2000/P1000 Series) or monitor modules (M1000 Series). Customers can configure the system as either an industrial panel PC or an industrial touch monitor, depending on display size, computing performance, and functional requirements. This plug-and-play design simplifies deployment and maintenance. If repairs are needed, only a single module needs to be replaced, cutting downtime, lowering maintenance costs, and streamlining future upgrades.

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced a strategic technical collaboration with Wiwynn, an innovative cloud IT infrastructure provider for data centers. This collaboration integrates GUC's flagship SoC design and 2.5D/3D advanced packaging with Wiwynn's expertise in rack-scale system integration, liquid cooling and optical interconnect. Together, the collaboration enables hyperscale customers to transition more efficiently from silicon definition to deployment-ready AI infrastructure.AI clusters continue to scale in performance, bandwidth and power density, hyperscalers must increasingly evaluate silicon, packaging, interconnect, thermal and rack-level design choices much earlier in the development cycle. Through this collaboration, GUC and Wiwynn are aligning key technology pillars, including leading-edge ASIC implementation, 2.5D/3D advanced packaging, optical I/O, power delivery, thermal architecture, manufacturability, serviceability and rack-scale integration. By addressing these factors holistically at the outset, the collaboration partners aim to reduce integration complexity, improve development efficiency and accelerate the transition from silicon-ready innovation to system-ready AI infrastructure."As AI infrastructure evolves beyond chip-level optimization and scale-up networks push the limits of conventional electrical interconnects, close alignment across silicon to system architecture become critical," said Aditya Raina, Chief of Marketing of GUC. "By collaborating with Wiwynn, we are helping hyperscale customers evaluate critical system-level tradeoffs earlier, integrating optical I/O to deliver the bandwidth and power efficiency required for next generation AI systems. This partnership establishes a more practical, holistic path from flagship ASIC development to deployable, rack-scale AI infrastructure."With deep expertise across board-level innovation, rack-scale integration, and manufacturing, Wiwynn effectively bridges semiconductor innovation with data center deployment," said Tony Wen, Vice President at Wiwynn. "Together with GUC, we are enabling a comprehensive silicon-tosystem approach that delivers scalable, efficient and serviceable AI infrastructure tailored for nextgeneration hyperscale environments."For more information, please visit.

Chroma ATE Inc. successfully concluded the 3rd Chroma Paper Award on March 19, marking another milestone in the company's ongoing commitment to industry-academia collaboration. Organized in partnership with National Taiwan University of Science and Technology (Taiwan Tech), the Chroma Paper Award provides an exchange platform that accelerates the translation of research into real-world applications, fostering innovation and the cultivation of key talent.As high-performance computing (HPC) and AI applications continue to advance rapidly, demand for test and measurement technologies is rising across AI chips, HPC, and data centers. In this era of lightning-fast iteration, testing and validation have become critical enablers of system performance and reliability. With long-standing expertise in this field, Chroma has built comprehensive AI-related testing capabilities spanning the four core pillars of AI infrastructure: compute and data processing, cooling and thermal management, high-speed communications and data transmission, and power and energy management. Through its test and validation solutions, Chroma helps ensure the performance, stability, and reliability of AI systems, playing a vital enabling role across the AI value chain.Aligned with Chroma's core technology development priorities, this year's competition featured two main categories: Power Electronics-Related Technologies and Semiconductor Testing-Related Technologies. Each category included a Top Prize (NT$200,000), Excellence Prize (NT$100,000), and Merit Prize (NT$20,000), with total prize funding reaching nearly NT$1.5 million. A total of 101 papers were submitted. Following a multi-stage evaluation process comprising preliminary, secondary, and final reviews, the judging committee selected outstanding research projects distinguished by both technical innovation and strong potential for industrial application.In the Power Electronics-Related Technologies category, the Top Prize was awarded to a team from Taiwan Tech for the project "Development of a High Power Density Power Module for AI Server Applications." Supervised by Associate Professor Yu-Chen Liu and completed by student Yu-Jun Li, the project directly addresses the growing need for high-efficiency, high-power-density power systems in AI data centers.In the Semiconductor Testing-Related Technologies category, the Top Prize went to a team from National Taiwan University for the project "A Novel Full-Chip Afterpulsing Evaluation Technique for 116 x 160 Ge-on-Si SPAD Array." Supervised by Professor Chao-Hsin Wu and jointly completed by students Jia-Zhen Cai, Ren-Hong Zhang, and Qi'en Chen, the research presents innovative achievements in advanced sensing and semiconductor testing technologies.Following the award ceremony, Chroma invited finalist teams into its R&D labs and testing facilities to see firsthand how research outcomes are transformed into real systems and industrial applications. The visit further strengthened ties between academia and industry.As the AI era continues to evolve at speed, test and measurement serves not only as a gatekeeper of quality but also as a key engine of innovation. Looking ahead, Chroma will continue to deepen its engagement with the global academic community through the Chroma Paper Award and a range of industry-academia collaboration initiatives, building an open and impactful platform that advances key technologies and sustains innovation momentum across the industry.For the full list of award winners, please visit the official Chroma Paper Award website.President Jia-Yush Yen of National Taiwan University of Science and Technology delivers remarks. Credit: ChromaCredit: ChromaFinalist students pose for a group photo with Chroma Foundation Chairman Paul Ying. Credit: ChromaChroma ATE Chairman Leo Huang (left) poses with the Top Prize-winning student Yu-Jun Li. Credit: ChromaChroma ATE Chairman Leo Huang (left) poses with the Top Prize-winning student Jia-Zhen Cai. Credit: ChromaFinalist teams visit Chroma headquarters. Credit: ChromaGroup photo at the 3rd Chroma Paper Award ceremony and banquet. Credit: ChromaChroma ATE Chairman Leo Huang delivers remarks. Credit: ChromaChroma Foundation Chairman Paul Ying delivers remarks. Credit: Chroma

The rapid advancement of generative artificial intelligence (GenAI) has significantly enhanced the efficiency of content creation and dissemination. At the same time, it has accelerated the proliferation of misinformation, manipulated content, and digital fraud, posing increasing challenges to democratic governance, social stability, and the integrity of digital trust and information ecosystems. In this context, achieving a balance between technological innovation and risk governance, while strengthening a trusted information environment, has become a key priority for both government and industry in Taiwan.Concurrently, the global expansion of virtual asset investment has prompted jurisdictions worldwide to strengthen regulatory frameworks governing digital asset transactions. Despite these efforts, fraudulent activities involving virtual assets continue to evolve in both scale and complexity. Malicious actors frequently exploit nominee accounts to conduct layered money laundering schemes, resulting in delayed fraud detection and challenges in asset recovery. Conventional approaches -including static blacklists and rule-based controls-are increasingly insufficient to address these evolving threats. As a result, the development of highly interpretable, AI-enabled early warning mechanisms to support timely risk identification and mitigation has emerged as a critical focus for both policymakers and industry.Against this backdrop, Team Bibi Lab, comprising students from National Tsing Hua University (NTHU), was awarded top honors in the "Virtual Asset Transaction Security" category-sponsored by BitoPro, a cryptocurrency exchange under BitoGroup-at the "Agent for Truth: Disinformation Defense Hackathon." Their project, "AI Anti-Fraud Guardian for Virtual Currency Transactions," demonstrated a high degree of technical innovation and real-world applicability, earning strong recognition from the judging panel.Team Bibi Lab extracted 140 features across 18 categories from KYC, fiat currency, and cryptocurrency transaction data provided by BitoPro. At the core of their approach is an innovative "three-layer risk tracking mechanism," which analyzes shared wallets, shared IP addresses, and indirectly connected users to trace how risk propagates through the transaction network-forming one of the system's most critical signal sources.To ensure high interpretability and support compliance requirements, the team deliberately avoided complex ensemble models that could obscure decision logic. Instead, they adopted LightGBM combined with Focal Loss, enabling the model to focus on hard-to-detect minority cases and effectively address severe data imbalance.In addition, the team constructed a network graph of internal transfers, shared wallets, and common IP addresses using NetworkX. By applying algorithms such as PageRank and community detection, they identified critical relay nodes within fund flows, further strengthening the system's ability to uncover hidden fraud patterns.The competition was powered by Amazon Web Services (AWS), whose cloud infrastructure enabled Team Bibi Lab to build a comprehensive AI-driven anti-fraud system. Their solution features a four-layer interpretability architecture: "Continuous Risk Scoring and Tiering," which classifies users into four risk levels from low to extremely high; "Feature Deviation Analysis," which visualizes how user behavior diverges from baseline norms; "Rule-Based Interpretation," which generates automated textual explanations; and an "AI Risk Diagnosis Report," which leverages the Claude 3.5 Haiku on Amazon Bedrock to generate professional compliance analysis reports.The system is built on a robust AWS cloud stack. The solution is deployed on Amazon Elastic Compute Cloud (Amazon EC2), with raw data and feature matrices stored in Amazon Simple Storage Service (Amazon S3), and AWS Glue handling ETL and feature engineering. AWS Lambda supports batch risk scoring, while AWS Step Functions orchestrates the end-to-end workflow. For high-risk cases, Amazon Simple Notification Service (Amazon SNS) sends real-time alerts to compliance teams, and Amazon CloudWatch ensures system monitoring and alerting-demonstrating the breadth and scalability of AWS cloud services in supporting advanced AI application development.Team Bibi Lab noted that, despite their background in AI development, they had no prior experience with AWS cloud services. Prior to the competition, AWS organized a series of technical workshops-covering AI applications and enterprise data-enabling the team to quickly build proficiency with relevant tools and services.With guidance from BitoPro mentors and industry experts, the team deepened its understanding of cryptocurrency operations. They also incorporated key design principles-including "auditability for compliance personnel" and "automated risk alerting" -into their solution, ultimately delivering a practical, deployable anti-fraud system that contributes to a more resilient and trustworthy digital financial ecosystem.

In Taiwan, scams have evolved from isolated tactics into cross-channel, multi-step attack schemes. Most victims are aware of fraud; rather, they are often driven to make poor decisions under conditions of high pressure, limited information, and tight time constraints. Enabling individuals to access reliable risk assessments and timely guidance before taking critical actions has therefore become an urgent priority.At the same time, rapid advances in generative AI have accelerated the proliferation of sophisticated misinformation, deepfakes, and fraud schemes, posing growing threats to social trust and public safety. Strengthening information verification and risk mitigation through AI has thus emerged as a pressing global challenge.In the "Agent for Truth: Disinformation Defense Hackathon," Team (1), formed by members from the Department of Electrical Engineering at National Taiwan University, was awarded the "Excellent Award" in the "Fraud Identification and Prevention" category, sponsored by Gogolook, for its solution "FakeOff."Fraud tactics continue to evolve rapidly, often leveraging current events to lower public vigilance. For instance, during the tax filing season, deceptive SMS messages tend to surge. Traditional anti-fraud models, which rely heavily on historical datasets, often lack the ability to proactively detect newly emerging fraud patterns.Team (1) explained that "FakeOff" addresses this limitation through a continuous learning and data alignment mechanism. By leveraging web scraping technologies to monitor major news platforms, the system captures real-time events and applies AI to identify content that could potentially be exploited by malicious actors. This approach enables model training and deployment prior to the large-scale spread of fraudulent messages, thereby strengthening early-stage fraud prevention.The competition was powered by Amazon Web Services (AWS), providing cloud infrastructure that enabled teams to build and deploy advanced AI solutions at scale. Team (1) utilized AWS infrastructure to build a comprehensive AI-driven anti-fraud system. The solution was deployed on Amazon Elastic Compute Cloud (Amazon EC2), with large-scale fraud datasets and training data stored in Amazon Simple Storage Service (Amazon S3). It also leveraged Amazon Titan Text Embeddings V2 on Amazon Bedrock for efficient text vectorization, highlighting the breadth and scalability of AWS cloud services in supporting advanced AI application development.From a technical architecture perspective, "FakeOff" integrates the visual language model Claude Sonnet 4.6 to analyze screenshots and textual content. The system adopts a multi-agent collaborative framework built on Claude Haiku 4.5, in which a Function Calling Agent dynamically invokes fraud detection tools, blacklists, and number lookup APIs based on visual cues. A Conclusion Agent then consolidates these outputs to generate interpretable assessment reports and actionable prevention recommendations.To address the core challenge of fraudulent message detection, "FakeOff" incorporates a cross-model alignment and voting mechanism. By integrating leading large language models-including GPT-4o, Claude Sonnet 4.5, Llama 3 70B, Mistral, and Qwen3-30B-the system performs cross-validation to identify models that best capture the nuances of the Chinese language. It further enhances performance by localizing and training on global datasets, effectively addressing the limited availability of fraud-related data in Taiwan.The solution also adopts a continuous learning architecture, combining Amazon Titan Text Embeddings V2 for text vectorization with a neural network classifier. This design enables ongoing model refinement through real-world data and human feedback, ensuring sustained accuracy and adaptability in an evolving fraud landscape.To counter emerging fraud tactics, "FakeOff" autonomously scans recent news across multiple platforms to extract high-risk keywords, enabling early detection of new scam patterns without requiring full model retraining. This forward-looking technical approach was a key factor in earning strong recognition from the judging panel.Team (1) noted that, with on-site support from AWS Solution Architects and mentorship from Gogolook, the competition enabled the team to expand its perspective beyond purely technical development to encompass real-world application scenarios. The team also expressed its aspiration to contribute to fraud prevention and strengthen information security.

SK hynix Inc. (or "the company", www.skhynix.com) announced today that it received the Corporate Innovation Award at the '2026 IEEE1 Honors Ceremony' held in New York on the 24th (local time).IEEE is the world's largest technical professional organization dedicated to advancing technology for the benefit of humanity. Established more than a century ago, the IEEE Awards Program recognizes individuals and teams whose innovations have advanced technology and improved the human condition.The IEEE Corporation Innovation Award, part of the Recognitions category, has been presented since 1986 to companies that have significantly contributed to the advancement of industry and society through innovative technology. This marks the first time SK hynix has received this honor.SK hynix attributed the honor to its contribution to the global AI computing ecosystem by ensuring the stable mass production of all High Bandwidth Memory (HBM) generations. Looking ahead, the company aims to solidify its position as a trusted partner in the global AI market by providing memory solutions that are critical to overcoming the performance limitations of AI platforms.The recognition highlights SK hynix's achievements in driving the expansion of AI computing through HBM innovation and application. Central to this success was the company's ability to preemptively offer innovative HBM solutions and respond timely to customer demands in the global AI market.Industry observers also credit this achievement to the strategic direction of SK Group Chairman Chey Tae-won, who has long emphasized securing long-term technological competitiveness. Under his leadership, the company has consistently expanded its AI infrastructure partnerships with global Big Tech firms in the United States.Ahn Hyun, President and Chief Development Officer (CDO), attended the ceremony as the company representative to accept the award."It is an honor to receive this award on behalf of our employees, who have tirelessly challenged the limits of technology," said Ahn. "By collaborating closely with our global customers and partners, we will stay ahead in creating the value the market demands and continue to be a premier company leading AI innovation."

NewPower Worldwide today announced it was recognized by Hewlett Packard Enterprise (HPE) at the HPE Operations Partner Summit 2026, receiving the Spares Supply Chain Partner of the Year Award for outstanding performance as a global supply chain partner.The award recognizes partners who deliver exceptional operational execution, responsiveness, and reliability in support of HPE's global supply chain customer base. NewPower Worldwide was selected for its ability to secure critical components, perform under pressure, and meet rigorous sourcing and fulfillment requirements in a rapidly changing market."We are honored to receive this prestigious award, which reflects our strong partnership with HPE and validates that our systems and processes are built to scale and adapt in the fast-paced market we serve together," said Carleton Dufoe, CEO of NewPower Worldwide.NewPower Worldwide supports complex global supply chains across OEMs, ODMs, and EMS providers through advanced component sourcing, inventory strategy, and risk？managed fulfillment. The company is known for executing under constraint, enabling continuity when availability is tight and conditions shift quickly. Its global operating model allows partners to respond faster, reduce exposure, and maintain performance across regions.The recognition was presented during the HPE Partner Summit 2026, which brings together top performing partners to recognize excellence in operational performance, collaboration, and customer impact.