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U.S. government announces up to $300 million in funding to boost advanced semiconductor packaging
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1/26
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The Future of AI Chips: Driving Growth and Challenge
MOST-READ
7 DAYS NEWS
Apple reportedly cuts iPhone orders; Android camp feels strain
Samsung denies voluntary retirement and layoff rumors as executives strategize foundry solutions
Nvidia steps in to restructure Supermicro orders, reshaping AI supply chain
TSMC to hike sub-5nm quotes in 2025; 2nm to exceed US$30,000
Samsung and Kioxia reinstate NAND manufacturing cuts
China accelerates chip independence push in face of Trump 2.0
GlobalFoundries cements Chips Act deal for US$1.5 billion grant
Nvidia outpaces revenue estimates with strong data center growth amid mixed analyst reactions
Nvidia announces acceleration in Blackwell shipments amidst rising production and export curbs against China
Samsung expands Suzhou packaging investments to bolster HBM competitiveness
Full list
RESEARCH INSIGHTS
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research
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