FuriosaAI Inc. is pleased to announce its collaboration with GUC (Global Unichip Corporation) as a key partner on the secondgen AI accelerator, RNGD (pronounced "Renegade"), the most efficient data center accelerator for high-performance large language and multimodal models.GUC has been crucial in helping FuriosaAI to achieve an aggressive timeline for RNGD. Developing a new AI accelerator – especially one like RNGD, which utilizes advanced technology like HBM3 and a large-scale 653mm2 SoC with 40 billion transistors – is only possible with excellent partners like GUC, which brings deep expertise in designing system-on-chip (SoC) solutions."RNGD offers the unprecedented combination of performance, power efficiency, and programmability for running large language models and multimodal models. GUC's expertise in areas such as SoC design, backend implementation, and silicon interposer (CoWoS) packaging has ensured that the RNGD project stayed on schedule to launch this year," said June Paik, FuriosaAI CEO.Complementing FuriosaAI's cutting-edge technology is GUC's expertise in turnkey semiconductor design services. As a trusted partner, GUC meticulously executed the project starting from spec-in, seamlessly integrating complex HBM memory subsystems, implementing the physical design, designing the package utilizing TSMC's industry leading CoWoS technology, followed by comprehensive testing services and manufacturing logistics management, successfully enabling FuriosaAI RNGD's 1st time success. GUC played a pivotal role in enabling FuriosaAI RNGD's flawless execution, significantly accelerating its time-to-market."We are excited to partner with FuriosaAI to bring their revolutionary AI accelerator to market," said Dr. Sean Tai, president of GUC. "GUC is highly experienced with large-scale chip design. Our turnkey design services provide end-to-end support, enabling FuriosaAI to rapidly scale their innovation and meet the growing demand for AI acceleration solutions. We look forward to further supporting FuriosaAI as they continue to design innovative products for the AI market."Together, FuriosaAI and GUC are poised to drive AI innovation to new heights, empowering organizations worldwide to harness the full potential of artificial intelligence.For more information about FuriosaAI and the RNGD AI accelerator, visit https://furiosa.ai.For inquiries about GUC's turnkey design services, visit https://www.guc-asic.com

SK hynix Inc. (or "the company", www.skhynix.com) announced today that it introduced the industry's best-performing GDDR7, a next-generation graphics memory product.The development of GDDR7 in March comes amid growing interest by global customers in the AI space in the DRAM product that meets both specialized performance for graphics processing and fast speed. The company said that it will start volume production in the third quarter.The new product comes with an operating speed of 32Gbps, a 60% improvement from the previous generation, and the speed can grow up to 40Gbps depending on the circumstances. When adopted for the high-end graphics cards, the product can also process data of more than 1.5TB per second, equivalent to 300 Full-HD movies(5GB each), in a second.SK hynix also improved power efficiency by more than 50% compared with the previous generation by adopting the new packaging technology that addresses the heat issue as a result of the ultra-fast processing of data.The company increased the layer number of the heat-dissipating substrates from four to six, while applying the EMC for the packaging material in a bid to reduce thermal resistance by 74%, compared with the previous generation, while maintaining the size of the product unchanged.Sangkwon Lee, Head of DRAM Product Planning & Enablement at SK hynix, said that GDDR7 is expected to be adopted by a wider range of applications such as high-specification 3D graphics, AI, high-performance computing, and autonomous driving."We will continue to work towards enhancing our position as the most trusted AI memory solution provider by strengthening the premium memory lineup further," Lee said.About SK hynix Inc.SK hynix Inc., headquartered in South Korea, is the world's top-tier semiconductor supplier offering Dynamic Random Access Memory chips ("DRAM"), flash memory chips ("NAND flash"), and CMOS Image Sensors ("CIS") for a wide range of distinguished customers globally. The Company's shares are traded on the Korea Exchange, and the Global Depository shares are listed on the Luxemburg Stock Exchange. Further information about SK hynix is available at www.skhynix.com, news.skhynix.com.

SK Hynix Inc. announced today that it has decided to invest about KRW 9.4 trillion in building the first fab and business facilities of the Yongin Semiconductor Cluster after the board resolution on July 26.SK Hynix (or "the company", www.skhynix.com) designs to start construction of the 1st fab to be built in the Yongin cluster in March next year and complete it in May 2027 and has received investment approval from the board of directors before it. The company will make every effort to build the fab to lay the foundation for the company's future growth and respond to the rapidly increasing demand for AI memory semiconductors.The Yongin Cluster, which will be built on a 4.15 million square meter site in Wonsam-myeon, Yongin, Gyeonggi Province, is currently under site preparation and infrastructure construction. SK Hynix has decided to build four state-of-the-art fabs that will produce next-generation semiconductors, and a semiconductor cooperation complex with more than 50 small local companies.After the construction of the 1st fab, the company aims to complete the remaining three fabs sequentially to grow the Yongin Cluster into a "Global AI semiconductor production base."The amount of investment approved this time included various construction costs necessary for the initial operation of the cluster, including auxiliary facilities, business support buildings, and welfare facilities along with the 1st fab. The investment period was planned to be from August 2024 to the end of 2028, considering the design period to prepare for fab construction and the business support building scheduled to be completed in the second half of 2028.The company will produce next-generation DRAMs, including HBM, a representative AI memory, at the 1st fab and prepare for the production of other products in line with market demand at the time of completion.In addition, SK Hynix plans to build a "Mini-fab" within the first phase to help small businesses develop, demonstrate and evaluate technologies. Through the Mini-fab, the company will provide small business partners with an environment similar to the actual production site so that they can improve technological perfection as much as possible."The Yongin Cluster will be the foundation for SK Hynix's mid-to long-term growth and a place for innovation and co-prosperity that we are creating with our partners," said Vice President Kim Young-sik, Head of Manufacturing Technology at SK Hynix. "We want to contribute to revitalizing the national economy by successfully completing the large-scale industrial complex and dramatically enhancing Korea's semiconductor technology and ecosystem competitiveness."

NewPower Worldwide, a global leader in the electronic components distribution industry, is excited to announce the addition of Carlos Da Silva as the new Vice President of Quality, working alongside NewPower's Chief Quality Officer, Barry Lafontaine. Drawing upon more than three decades of profound expertise in quality management and lean methodologies, Carlos is poised to drive the advancement of NewPower's global quality standards, and his addition will certainly continue to strengthen the company's status as one of the world's premier electronics distributors.Carlos is a Certified Manager of Quality and Organizational Excellence by the American Society for Quality (ASQ), nominated US Lead Quality Expert by ANSI/ASQ and Alumni by the Shingo Institute, with a remarkable track record of implementing and sustaining ISO 9001, IATF 16949, and Lean Systems globally. His leadership and technical expertise have earned him international recognition, including substantial contributions to the Society of Automotive Engineers (SAE), International Organization for Standardization (ISO), and presentations at numerous high-profile conferences.Before joining NewPower Worldwide, Carlos held significant roles, including the Director of Global Quality at Axcelis Technologies and Quality Assurance and Lean Manager at Rockwell Automation. He led multicultural teams across the US, Dominican Republic, Korea, Germany, Italy, China, Japan, and Singapore, developed comprehensive training programs, coordinated global quality events, and improved quality management systems. His innovative approach to problem-solving and strategic planning significantly reduced variation and enhanced product quality and availability, proving his ability to drive operational excellence across global platforms."We are thrilled to welcome Carlos to our team," said Barry Lafontaine, Chief Quality Officer of NewPower Worldwide. "His extensive experience and proven ability to drive quality and operational excellence will be invaluable as we continue to enhance our processes and deliver exceptional value to our customers."

For enterprises whose operations span a diverse range of outdoor working environments, rugged IT solutions that combine purpose-built hardware with industry-specific software can play a pivotal role in streamlining key processes, boosting productivity, and aiding digital transformation.Getac Technology Corporation (Getac) has been focusing its research and development on Edge AI solutions that target real-world rugged industry needs. In addition to the recent launch of its S510, the world's first rugged laptop with AI support*, Getac's two main AI platforms, focusing on imaging and speech, have proved popular with manufacturers, public utilities, automotive, defense industries, and public safety organizations for their powerful smart functions that greatly aid operational efficiency.James Hwang, President of Getac Technology Corporation, said that Getac believes in the importance of Edge AI. The company integrates software, hardware and partners' AI ecosystems to provide customized solutions for vertical industries that accelerate the digital transformation process and optimize workflows.Using Intel's latest Core Ultra processor, Getac's recently launched S510 the world's first AI-ready rugged laptop features an Intel AI Boost NPU (Neural Processing Unit), which is dedicated to processing data-heavy AI-based tasks. The CPU (Central Processing Unit) and GPU (Graphics Processing Unit) are then free to focus on core tasks, resulting in optimal battery life and improved performance. The S510 also features Microsoft Windows 11 Pro and integrates the latest Windows Copilot AI assistant, which complements the Intel platform and maximizes AI performance.In addition to AI functionalities, the S510 is certified to the US Department of Defence MIL-STD-810H military standard with a dustproof and waterproof rating of IP53 (Ingress Protection), and screen brightness of up to 1,000 nits, making it well suited to professionals working outdoors. Getac also provides design customization services to meet industry-specific needs if required.In terms of AI visual capabilities, Getac supplies solutions that cover two major products: in-car video systems and body-worn cameras. The Getac CA-NF42/VR-X20G3 in-car video system is specifically designed for law enforcement and public safety applications. CA-NF42 is equipped with a dual front 4K UHD lens and supports WDR technology to capture clear images, even in poorly light environments. License plate recognition has also been successfully introduced to the CA-NF42, meaning that even in complex environments it can recognize license plates across multiple lanes simultaneously in as little as 0.5-0.8 seconds. VR-X20G3 uses the latest Intel Core Ultra Processor as an In-car video server, it can support up to six cameras to deliver 360-degree monitoring with no blind spots, both inside and outside the vehicle.Regarding body-worn cameras, Getac's solutions currently utilize the Qualcomm platform, which will soon include the ability to identify suspects through the use of facial recognition technology. Getac's imaging AI platform has completed model training and can be closely integrated with other Getac software and hardware for the deployment of optimal unified solutions. In order to provide value for more customers, this solution will initially target the North American law enforcement market, with plans for horizontal expansion into other fields, such as transportation at a later date.For its AI speech platform, Getac crafted an AI voice solution that can be deployed on terminal devices to improve the efficiency and safety of police, firefighters and paramedics. The core architecture of the audio solution consists of three features. The first is the background noise cancellation technology that can accurately isolate human speech in noisy environments. The second is an Embedded Speech Model that can control software and hardware functions directly through speech commands and connect with other auxiliary systems. The third is a multi-language voice-to-text engine. The engine is currently trained mainly for English and can convert speech into text records in realtime. Users can use the three functional modules above to perform vehicle registration checks, write reports, and perform other administrative tasks through natural speech. Eliminating keyboard or touch screen data entry allows the operator to focus on policing, thus reducing risk while on duty.Hwang said that Getac has been involved in the field of rugged computers for more than 35 years. A combination of technology development experience and market insights, combined with its large investment in R&D (Research and Development) resources, internal integration of group resources, and flexible supply chain, has enabled the company to create solutions for a wide range of end-user scenarios. In the future, Getac will continue to draw on its strengths to respond quickly to ever-changing market demands, listening to customer needs and working closely with ecosystem partners to strengthen its product portfolio even further.By providing customers with reliable, efficient, and tailor-made Edge AI solutions, Getac will help usher all professionals and industries into a smarter, AI-driven future.Getac showcases AI-enabled rugged laptops and audio-visual solutions that help industry customers perform tasks more efficiently in digital transformation applicationsPhoto: Getac Technology Corporation

Generative AI is currently the hottest topic in the high-tech industry. To meet the massive computational power demands brought by generative AI, our clients are exploring various innovative technologies and design concepts, from chip development to system design, and integrating them into their products. Responding to customer needs and helping them complete more complex designs in a shorter time, incorporating AI/ML techniques into design and simulation tools is an inevitable trend and a direction Ansys is committed to.On the other hand, the enormous business opportunities contained in generative AI have not only driven world-class semiconductor giants to accelerate their investments, but also led to the emergence of numerous startups. This thriving design activity makes the entire semiconductor industry look vibrant and dynamic.Empowering Innovation with AIAI is transforming the world. In the semiconductor industry, AI tools are already widely used in chip design exploration and optimization. For example, AI tools are used in the design and optimization of on-chip and off-chip power delivery networks (PDNs). The addition of AI allows designers to create more advanced and complex chip architectures. With the assistance of AI, designers can explore more design possibilities, find better architectures, and speed up the chip design iteration process through more automation, shortening the time to market.Ansys recently launched a new AI-based technology called Ansys SimAI, a physics-agnostic, Software as a Service (SaaS) application that combines the predictive accuracy of Ansys simulation and the speed of generative AI. The new solution allows engineers and designers to predict the performance of their design within minutes, democratizing simulation through intuitive interfaces and processes.The impact of AI on semiconductor design is just beginning. As AI technology continues to advance and become more powerful, we can expect AI to be used in optimizing chip layout, reducing chip size, and increasing density. In chip manufacturing, AI technology will become a crucial tool for improving overall process yields. The emergence of generative AI also alleviates the pressure caused by talent shortages in the semiconductor industry. With the help of large language models (LLMs) and Copilot tools, engineers can make better design decisions, enhancing productivity and efficiency.The operation of Ansys itself has also undergone significant changes due to the advent of generative AI. One of the main values Ansys brings to its customers is assisting them in achieving more complex and advanced designs. Thus, the Ansys team must provide intensive technical support to help customers solve problems encountered during the design process. Until now, customer support has been highly reliant on manpower, but Ansys believes that virtual assistants based on generative AI technology will be the future direction, as they can provide more immediate responses and support, offering an advantage in speed.To this end, Ansys has invested considerable resources and recently officially launched AnsysGPT. If users encounter issues while using Ansys tools, they can ask AnsysGPT at any time and receive nearly instantaneous responses. Ansys will continue to invest more resources to further strengthen AnsysGPT, enabling it to answer user questions more accurately.At the same time, AnsysGPT ensures data security and compliance, since it is trained using new public sources, including product documentation, product and engineering-related training documentation, FAQs, technical marketing materials, and public Ansys Learning Forum discussions. And this is just the beginning. In the future, Ansys will embed virtual assistant features based on generative AI into the products it provides, making the products more intelligent in responding to user needs.Governments Actively Foster the Semiconductor Industry: AI Chips Gain MomentumFrom the perspective of overall industry development, the emergence of generative AI has made the semiconductor industry vibrant and dynamic. To meet the huge computational power demands brought by generative AI, besides GPU companies, many international chip giants are intensively developing new products, trying to get a share of the market. It is also worth mentioning that, against the backdrop of governments worldwide actively fostering their domestic semiconductor industries, many startups have emerged in the AI chip market.Industry support policies and even government investments are key factors driving the AI chip startup boom. Without government resource injection, startups might take a considerable amount of time to become self-sufficient. On the other hand, performance, power consumption, and cost are the three major factors determining the competitiveness of AI chips, all of which rely on advanced process technologies. While governments strategically support new IC design startups, they are also actively investing in semiconductor manufacturing, especially advanced processes. This dual-track policy approach helps build a robust semiconductor industry ecosystem and makes the AI chip industry more prosperous.To further share with Taiwan's high-tech industry how generative AI can assist R&D teams in accelerating design exploration and verification, enabling products to reach the market faster, Ansys will host Simulation World 2024 on August 6 at the Sheraton Hsinchu Hotel. This annual user conference will feature not only experts from Ansys but also leading companies such as Delta Electronics, Google, NVIDIA, MediaTek, Realtek, ASE Group, Global Unichip, and Lite-On. These experts will share their firsthand experiences of using generative AI in advanced process technology, advanced packaging, silicon photonics, smart vehicles, and power electronics applications. Let us join hands and participate in this grand event to jointly explore the potential applications of multiphysics simulation and new technologies in the field of R&D design, pushing the boundaries of technology!2024 Ansys Taiwan Simulation World (event-simulate.com.tw)Padmesh Mandloi, Regional Vice President, Customer Excellence, APAC Ansys

Crypto Quantique, a provider of quantum-driven security for the Internet of Things (IoT), has announced three new partnerships with intellectual property (IP) distributors in the Asia-Pacific region.Crypto Quantique is partnering with Kaviaz Technology for Taiwan, LoMicro for China, and KRM for Japan and Korea.The proliferation of IoT devices poses a growing security threat to critical infrastructure. As a result, there is accelerating demand for devices that are secure-by-design. Crypto Quantique's semiconductor hardware IP, called QDID, provides the highest standard of IoT security and regulatory compliance. Its patented physical unclonable function (PUF) creates unique chip identities and cryptographic keys on demand. These do not need to be stored in memory, where they would be vulnerable to attack, and cannot be counterfeited, copied or hacked, even in a post-quantum era. As a result, QDID provides the secure foundation of a root-of-trust for any IoT device. QDID is compatible with standard CMOS manufacturing processes at nodes from 55 nm down to 12 nm.Dr Shahram Mossayebi, Co-Founder and CEO of Crypto Quantique said, "These alliances mark a significant milestone in our mission to democratise access to scalable, quantum-driven chip security across Asia. These partnerships significantly strengthen our presence in the APAC region and demonstrate our commitment to securing infrastructure and supply chains globally."

Over the last 15 years, cryptocurrency has not only revolutionized finance but also technology. Specifically, crypto has influenced the development of tokenization, encryption, and compatibility. Crypto technology has already been adopted by other industries - gaming and eCommerce to name a few.One industry that has yet to integrate crypto technology fully is the public finance sector. However, financial experts are forecasting that centralized financial institutions will soon adopt crypto tech.As Kane Pepi's Next Crypto to Explode article highlights, crypto is a fast-moving market, with new, high-speed cryptos constantly emerging as potential competition to Bitcoin and Ethereum. Investors buy into up-and-coming coins as they offer high returns - as long as they can keep up with the fast-paced market.The market is so fast that even the public finance sector struggles to keep up with it. However, traditional finance institutions need to adopt crypto tech to stay relevant in the modern world of eCommerce, crypto gaming, and crypto casinos.One aspect of crypto tech that we'll see financial institutions soon using is tokenization. Tokens are used to represent the ownership of an asset. They're recorded on an electronic ledger which makes them easily tradable. These tokens, which can be bought on Initial Coin Offering (ICO) platforms, can represent anything from a share in a company to a set amount of money.Financial institutions will likely adopt this crypto technology through the tokenization of financial assets such as stocks and bonds.We're already seeing signs of tokenization happening in prominent financial institutions. Several mainstream banks have recently experimented with tokenized deposits. This is when the amount deposited to a savings or checking account is tokenized and recorded on a blockchain network. A token that represents your deposited amount provides greater transparency and security - it also means that your assets can be traded instantly.Crypto technology has also already influenced how central banks issue money, as proven by the advent of Central Bank Digital Currency (CBDC). As less physical money is used, the need to issue digital money becomes vital in keeping economies healthy.CBDCs are currently used as a means of payment, but will soon also provide banking infrastructure. For example, besides representing value and serving as a form of payment, CBDCs can automate clearance and settlement actions themselves, which brings greater efficiency to banking institutions.Eventually, money will be sent and received through a CBDC ledger. This ledger will automate several banking processes, which reduces the bank's need for certain technologies and employees. Already, we're seeing physical bank branches closing at a high rate, with 1,409 US banks closing last year. We'll likely see an increasing amount of year-on-year bank closures as more financial institutions adopt crypto technology.A combination of CBDC technology and tokenization could also increase the seamlessness of cross-border transactions, while also providing additional security.Rather than sending the money itself across borders, digital representations - or tokenized versions - of bank reserves can be sent to financial institutions in different countries. These digital representations are far more easily tradable than fiat currencies.Sending money abroad comes with a variety of obstacles, including currency exchange, fraud prevention, differing time zones, and so on. This normally results in the money taking around one to five days to be processed and sent to the recipient's account.Digital representations of value would not have to go through these obstacles. The value would be universal, and would not have to be exchanged into a different currency.The amount and value of cross-border payments are constantly increasing year-on-year, with value expected to reach $250 trillion by 2027. With an increasing need for seamless international payments, the need for banking institutions to adopt crypto technology becomes more pressing.How cryptocurrency technology can enhance financial services

Despite political and national security concerns about US domestic semiconductor production, American companies continue to account for more than half of the global chip industry's total spending on research and development, according to the latest annual analysis of R&D expenditures by TechInsights.About 62% of worldwide semiconductor industry R&D spending in 2023 was by companies headquartered in the Americas region—essentially all of them in the US and a large chunk of that came from Intel (16%, or $16.0 billion last year), according to TechInsights' analysis of research and development trends published in its June Update of the 2024 McClean Report (Figure 1). The top 10 semiconductor R&D spenders in 2023 included six US companies, two Taiwan companies, one South Korean and one European company.Semiconductor R&D expenditures by Asia-Pacific companies—including wafer foundries, fabless chip suppliers, and integrated device manufacturers (IDMs)—accounted for about 24% of the worldwide total in 2023, followed by suppliers based in Europe at about 8%, and Japan at 6% of industry spending. Since 2012, the global share of semiconductor R&D expenditures held by chip suppliers based in the Americas has grown from nearly 56% and the percentage held by Asia-Pacific companies (including China) has climbed from 18%.Semiconductor R&D Spending by Headquarters Location. Credit: TechInsightsSemiconductor companies based in Taiwan—including wafer foundries, like Taiwan Semiconductor Manufacturing Co, (TSMC)—accounted for 14.4% of the industry's total R&D expenditures in 2023 (about $14.2 billion). South Korean suppliers primarily Samsung and SK Hynix—represented 8.1% ($8.0 billion) of global semiconductor R&D spending and Chinese companies accounted for about 2% of semiconductor R&D expenditures last year. The rest of the Asia-Pacific region accounted for less than 1.0% of the global total, according to the updated report.Worldwide, semiconductor companies collectively spent 17.7% of their combined sales on R&D in 2023 ($98.8 billion) versus 16.9% ($53.8 billion) in 2012, according to TechInsights' June Update of The McClean Report. R&D spending covered by TechInsights includes expenditures by integrated device manufacturers (IDMs), fabless chip suppliers, and pure-play foundries, but does not include other companies and organizations involved in semiconductor-related technologies, such as production equipment and materials suppliers, packaging and test service providers, universities, government-funded labs, and industry cooperatives.R&D expenditures as a percent of semiconductor sales for companies headquartered in the Americas region averaged 21.5% in 2023 and was 11.7% for semiconductor suppliers in the Asia-Pacific region. European companies spent about 13.6% of their combined chip revenues on research and development last year and Japanese semiconductor companies had an R&D/sales ratio of 12.9% in 2023.South Korean companies (heavily influenced by memory giants Samsung and SK Hynix) had an R&D/sales ratio of 10.2% last year. Taiwanese and Chinese companies averaged about 7.0% and 11.0%, respectively, in 2023.About The McClean ReportThe McClean Report—A Complete Analysis and Forecast of the Semiconductor Industry, is available by subscription. The McClean Report service includes a January Semiconductor Industry Flash Report, which provides clients with an initial overview and forecast of the semiconductor industry through 2028. Monthly Updates continue throughout the year. Find out more about the McClean Report.About TechInsightsTechInsights is the information platform for the semiconductor industry.Regarded as the most trusted source of actionable, in-depth intelligence related to semiconductor innovation and surrounding markets, TechInsights' content informs decision-makers and professionals whose success depends on accurate knowledge of the semiconductor industry—past, present, or future.Over 650 companies and 85,000 users access the TechInsights Platform, the world's largest vertically integrated collection of unmatched reverse engineering, teardown, and market analysis in the semiconductor industry. This collection includes detailed circuit analysis, imagery, semiconductor process flows, device teardowns, illustrations, costing and pricing information, forecasts, market analysis, and expert commentary.TechInsights' customers include the most successful technology companies who rely on TechInsights' analysis to make informed business, design, and product decisions faster and with greater confidence. Find out more on the TechInsights platform.

Highlighting the explosive growth and limitless potential of Edge AI opportunities, ADLINK brought together over 140 global decision-makers from strategic partners within its ecosystem, including distributors, key accounts, ISVs, and DFSIs in the APAC and EMEA regions, at the 2024 EdgeOpen Consortium. Hosted at its headquarters in Taoyuan, Taiwan, on May 30, 2024.ADLINK unites global partners at the 2024 EdgeOpen ConsortiumThemed "Scaling Business at the Edge", the 2024 EdgeOpen Consortium spotlights two key growth engines: edge AI and green energy. Anchored upon these strategies, it aims to achieve powerful computing intelligence through AI while minimizing power consumption to reduce TCO and pursue net-zero and ESG targets.Harnessing these strategies demonstrates how collaborative synergy can accelerate business across industrial automation, automotive, transportation, medical, robotics/AMR, and gaming applications.With shared expertise and resources, strategic collaborations can adeptly navigate global market complexities and fast-paced technological advancements, fostering innovative solutions and sustained growth. This rationale prompted ADLINK to establish EdgeOpen, an open platform that tightly connects ecosystem partners, aiming to co-create business opportunities, overcome challenges, and achieve mutual growth.Stephen Huang, President & COO of ADLINK, highlighted the company's growth driven by long-term partnerships and a streamlined product portfolio across the entire value chainDuring his keynote speech, President and COO of ADLINK, Stephen Huang, highlighted the company's growth driven by long-term partnerships and a streamlined product portfolio integrated across the value chain. It includes computer-on-modules, GPUs, edge AI platforms, IoT gateways, AMRs, and AI edge servers.ADLINK's strategic focus spans across four key areas:1. Developing comprehensive edge AI solutions through ecosystem partnerships.2. Teaming up with AUO to provide edge visualization solutions for vertical markets.3. Differentiating through vertical-focused software atop solution-ready platforms.4. Enhancing Design and Manufacturing Services Plus (DMS+) for embedded computing and edge AI solutions.ADLINK has also dedicated itself to sustainability, investing in energy-saving technologies to support customers in achieving net-zero and ESG goals. This reinforces its value proposition of innovation, customer-centricity, and environmental responsibility, aligning with the ecosystem partners' shared goal of "Go Intelligent, Go Green."The EdgeOpen Consortium event showcased ADLINK's collaborative efforts with its upstream and downstream partners to drive innovations in edge computing technologies. This initiative aims to promote intelligent and green solutions across various sectors, such as industrial automation, smart manufacturing, smart healthcare, gaming, and autonomous driving.In the upstream supply chain for technology platforms, ADLINK partners with Intel, NVIDIA, Arm, NXP®Semiconductors (NXP), MediaTek, Qualcomm Technologies, Inc., AMD, and Ampere to support the high computing power essential for edge AI. Meanwhile, ADLINK works closely with AUO for edge visualization applications. Furthermore, ADLINK integrates power-saving technologies to assist customers in achieving their green design objectives.In the downstream industry, partners like FARobot assist ADLINK by offering solutions in intelligent AMR applications, empowering ADLINK to deliver comprehensive and differentiated solutions for smart healthcare and manufacturing. On the other hand, partnerships with BRICKS, NexRetail, and Vossic, which specialize in generative and edge AI features for food and beverage, retail, and manufacturing applications, further strengthen ADLINK's market presence expansion.The importance of software development partners cannot be overlooked either. For instance, TIER IV, a pioneer in open-source autonomous driving systems based in Japan, collaborates with ADLINK to develop autonomous driving technology, emphasizing its commitment to deploying the technology through open-source software. It provides significant support for ADLINK's entry into edge computing applications within the high-potential automotive market.ADLINK's channel partners are pivotal in driving edge computing innovation across diverse marketsADLINK's channel partners are crucial in supporting edge computing innovation across various markets. MARUBUN Corporation from Japan, Data Respons Solutions from Sweden, and Alcom from Belgium shared how they leverage their extensive network, technical expertise, and tailored services to promote the adoption of ADLINK's solutions. They all exchanged successful projects and best practices on stage with all the participants.The channel partners emphasized the importance of customized technical assistance in successfully implementing ADLINK's innovative technologies, highlighting the value of local expertise and customer-centric strategies across diverse markets.ADLINK showcased its dynamic portfolio and real-world applications with partners for expanding enterprises at the edgeLooking ahead, ADLINK remains committed to leveraging the EdgeOpen Consortium, encouraging all partners to accelerate the development of innovative applications with faster time-to-market through shared resources. This strategy seeks to create mutually beneficial outcomes while allowing end users to benefit from the efficiency, safety, and energy savings brought by cutting-edge computing technologies. ADLINK actively invites new partners from various fields to join the EdgeOpen ecosystem, promoting collaboration to unlock better business opportunities.