中文網
繁體
简体
SUBSCRIBE
My account
Sign in
Sign up
TECH
Tech Home
Semiconductors
Communications
ICT
Displays
Electric Vehicles
Sustainability
REGIONS
Asia Home
East Asia
Southeast Asia
South Asia
AsiaTech Frontier
RESEARCH
Research Home
By Industry
Servers
IC Manufacturing
IDM & Fabless
AIoT
Notebooks
Smart Devices
Vehicle Tech
Asia Supply Chain
Other Tools
Research Insights
Meet the Analysts
TechStats
Single Reports
Preview Report
Reports Index
On-Demand Briefing
Products & Services
OPINIONS
Opinions Home
Interviews
Colley & Friends
Commentary
FINANCE
BIZ FOCUS
Biz Focus Home
Trending Issues
COMPUTEX
SEMICON
EVENT+
Event+ home
Featured Events
MULTIMEDIA
SUBSCRIBE
Trending
Semiconductor News
Server News
Meet the Analysts
HotSpot
On-Demand Briefing
GenAI Report
Trending
SUBSCRIBE
CONNECT WITH US
REALTIME NEWS
TSMC demand boosts suppliers performance; smaller ones gain competitiveness
Tomorrow's Headlines
9h 21min ago
Network chipmakers perceive inadequate demand visibility from China
Tomorrow's Headlines
9h 39min ago
Golden Apollo event illustrates business risks as geopolitical tensions rise
Tomorrow's Headlines
9h 44min ago
Taiwan aerospace supplier AIDC seeks international project partnerships
Tomorrow's Headlines
11h 3min ago
EIH promotes medical care applications on e-paper
Tomorrow's Headlines
11h 11min ago
Walsin posts record PCB capex
Tomorrow's Headlines
11h 33min ago
Radiant plans to acquire Danish optical solutions company
Tomorrow's Headlines
Sep 19, 20:03
Battle for USB4 transmission chip route: Retimer or Redriver
Tomorrow's Headlines
Sep 19, 19:49
Xiaomi to debut tri-fold smartphone, sources say
Tomorrow's Headlines
Sep 19, 19:30
Ferrari sales increase in Taiwan; CEO visits frequently
Tomorrow's Headlines
Sep 19, 19:21
Niching expects AI momentum to grow in 2025
Tomorrow's Headlines
Sep 19, 19:21
Home
Biz Focus
PRNewswire
LONGi at the WEF 2024 in Davos Makes Case for Net Zero Manufacturing Powered by Efficient Clean Energy
KL Wellness City Drives Healthcare Tourism with IoT Integration
Segway's Transformative Robotics Portfolio Takes Center Stage at CES 2024
ipaymy Launches First-of-Its-Kind Automated Invoicing Platform, Fetch, for SMEs to Get Paid Easier, Better and Faster
Bybit Transforms Token Swapping Dynamics with the Upgrade of Bybit Web3 Swap
Bybit Web3 Surpasses 1 Million Wallet Users, Introduces Keyless Wallet for Unrivaled Security and Simplicity
ViewSonic Announces New Meeting Space Solution and TeamWork Software
Telstra International partners with Google and APTelecom to connect central and south Pacific with new subsea cable system
Gaining the competitive edge in retail with AIoT technology
Huawei Releases Top 10 Trends of Data Center Facility for 2024
Rockwell Automation Releases 2023 Sustainability Report Outlining Progress and Outcomes
CES 2024: Timekettle Releases X1 AI Interpreter Hub, World's First AI Interpreter Hub
Artisse AI Secures $6.7M Seed Funding Round Led by The London Fund
ZO Motors and Weichai New Energy Establish Strategic Cooperation, Announcing Global Brand Strategy and Executive Team
BRImo: The Mobile Banking Super App Driving Sustainable Growth of Bank Rakyat Indonesia
Risen Energy Release White Paper "Development and Industrial Application of Ultra-Thin Silicon Wafers"
ARTERY AT32 Work Bench Accelerates Embedded Systems Development
Tobii launches UX Explore cloud platform, making eye-tracking-based mobile UX research more scalable
Sailing with intelligent technology towards internationalization: GAC MOTOR awarded "2023-2024 Global Intelligent Vehicles Brands Top10"
Indonesia Crypto Web3 Report 2023 Unveils 5 Key Insights
BIGO Technology Boosts Tech Investment Opportunities at the Jordan-Singapore Tech Alliance Forum
Lexar and Silicon Motion Collaborate to Unveil Next-Gen Performance Portable SSDs - ARMOR 700 and SL500
Bybit Web3 Unveils NFT Pro: Redefining Openness in NFT
TCL CSOT Presents A More Advanced, Connected and Healthy Future with Latest Display Technologies at CES 2024
UGREEN Announces Its Next-Generation Network Attached Storage Devices into International Market at CES 2024
SuperAI, Asia's Premier Artificial Intelligence Conference, Debuts in Singapore
GCL secures order for supply of 1.1 GW of PV modules from NTPC
GIGABYTE Debut OLED Monitor Lineup at CES 2024 with the World's First DP2.1 UHBR20 Gaming Monitor
The World's First EV Powered by Farasis Energy's Sodium-ion Batteries Rolls Off the Assembly Line
Linker Vision Leverages AWS, Together with Taiwan's Ministry of Digital Affairs, Kaohsiung City Government, to Showcase New Technology and Release of VisionAI Platform at CES 2024
GIGABYTE Debuts Next-Gen 16-inch AI Gaming Laptops at CES 2024
Hyundai Motor Reveals Vision for Hydrogen Energy and Software Solutions Beyond Mobility at CES 2024
Metalpha Invests in NextGen Digital Venture Limited, Strengthening Institutional Investor Access to Digital Assets
Bybit Web3 Deepens Ecosystem Integration with Mantle, Unveils Gas Fee Subsidies and One-Click mETH Staking Campaign
Hyundai Motor and Kia to Develop Polymer Electrolyte Membrane with Gore for Hydrogen Fuel Cell Systems
ARTERY AT32 MCU-based Solutions for High-speed Multi-Functional Peripheral
Montage Technology Introduces 4th-Gen DDR5 RCDs Enabling Data Rates up to 7200 MT/s
Bybit Web3 Unveils Comprehensive Guide to Navigating the Crypto Wallet Landscape
Hyundai, Kia and Samsung Electronics to Collaborate on Connecting Mobility and Residential Spaces
Artificial Intelligence helps predict falls, creating safety system for patients
13/23
pages
1
...
10
11
12
13
14
15
16
...
MULTIMEDIA
Exclusive Interview with Daniel Silverman, VP, at Investissement Quebec International 《SEMICON 2024》
TOP STORIES
7 DAYS NEWS
How far is China from 28nm process after domestic lithography breakthrough?
Tata plans to build two more fabs in India
Huawei's triple-fold Mate XT reaches 5 million pre-orders, but converting to actual orders will be challenging
Huawei encounters difficulties with Kirin SoC performance breakthroughs
Qualcomm comes up short in AI PC debut, casting doubt on MediaTek market entry
Glass substrate technology gains traction for advanced packaging by 2026
Chinese smartphones employ 3nm chips, exacerbating Qualcomm and MediaTek competition
TSMC solves mass production issues in US; advanced process self-sufficiency may be realized
China races to boost domestic chip output as trade tensions rise
Japanese semiconductor suppliers expand in India amid Chinese import substitution
Full list
RESEARCH INSIGHTS
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research
×
Members only
×
Sorry, the page you are trying to open is available only for our paid subscribers.
Please
login
to read more
New users, please
register
first
Notification
×