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Monday 14 September 2026
Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
As AI-driven high-performance computing (HPC) and chip-to-chip optical interconnects continue to see rapid growth, Hauman Technologies, a leader in test and measurement solutions, has introduced a breakthrough GHz-class, massively parallel bandwidth testing technology in collaboration with AUO Corporation...
Friday 11 September 2026
DAS Expands in Taiwan and Unveils World First at SEMICON
DAS Environmental Experts continues to expand its capabilities in Taiwan and is presenting another new product at SEMICON Taiwan...
Friday 11 September 2026
Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
Toward Technologies, Inc. concluded its participation in SEMICON Taiwan 2026, held from September 2 to 4 at Taipei Nangang Exhibition Center Hall 1. Under the theme "RELAY, REDEFINED.," the company showcased a broader switching technology portfolio at booth K3168 and demonstrated its transition from a traditional relay supplier to an advanced switching solution partner.
Thursday 10 September 2026
Stress, Sleep, and Lifestyle Balance: Perspectives from Traditional Chinese Medicine
According to survey data from the Taiwan Society of Sleep Medicine, approximately one in every five people in Taiwan experiences insomnia. Many individuals live under prolonged psychological stress, resulting in an imbalance among stress, sleep, and lifestyle...
Wednesday 9 September 2026
IDA Partners with Taiwan's Semiconductor Industry to Advance Global Talent Strategy
As graduation season arrives, Taiwan's semiconductor industry once again enters its annual competition for talent. Driven by declining birth rates and surging demand for computing power fueled by the artificial intelligence (AI) boom, semiconductor companies have continued to expand their hiring efforts year after year...
Tuesday 8 September 2026
Shining a Light on the Precision Behind AI and Data Infrastructure
Discussion around advances in AI will often focus on model performance, chip launches, and compute scale. In practice, however, progress increasingly depends on something more fundamental: the ability to build faster, more reliable infrastructure for moving, processing, and managing data.
Wednesday 2 September 2026
World Diamond Technology accelerates mass production of 300 mm diamond wafers
As AI, high-performance computing (HPC), and advanced packaging continue to move toward higher levels of power integration, chip power consumption is rising rapidly. Thermal management has therefore become a critical factor affecting performance, reliability, and system design...
Wednesday 2 September 2026
Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
Taiwan is home to the world's most advanced semiconductor ecosystem. The island produces over 60% of global contract chip manufacturing and dominates key segments from IC design to advanced packaging. For international engineers, joining this ecosystem represents an opportunity to work at the frontier of chip technology - but succeeding here requires more than technical brilliance...
Wednesday 2 September 2026
DAS Introduces ALCEA for Integrated NOx Treatment in Semiconductor Fabs
DAS Environmental Expert GmbH today announced the launch of ALCEA, a new secondary abatement solution for nitrogen oxide (NOx) emissions in semiconductor manufacturing. Installed downstream of NOx-generating waste gas treatment units, ALCEA can reduce NOx by up to 95 percent while its catalyst stage is integrated directly into the exhaust duct, minimizing additional floor space in the subfab...
Wednesday 2 September 2026
Manz Asia Broadens ECD Platform for Mass Panel-Level Packaging
Rapid evolution of High-Performance Computing (HPC) and artificial intelligence chips for Hyperscalers and tech giants continue pushing large sized silicon demands...