iCatch Technology, a leading provider of AI imaging SoCs and vision processing solutions, today introduced PAISB (Physical AI Sensor Bridge), an HSB-aligned ASIC sensor bridge platform designed to enable scalable multi-sensor data ingest for NVIDIA Holoscan-based Physical AI systems.The first product in the platform family, PAISB-E1, will be demonstrated at GTC 2026 running on NVIDIA Thor at ApproPho Booth #3420.As Physical AI systems increasingly rely on multiple high-bandwidth sensors - including cameras, stereo vision modules, and other perception devices - efficient and deterministic data pipelines from sensors to GPU compute platforms have become critical infrastructure. PAISB addresses this challenge by providing an ASIC-based bridge optimized for time-aligned, low-latency sensor streaming into GPU computing environments.Aligned with the NVIDIA Holoscan Sensor Bridge (HSB) architecture, PAISB enables developers to ingest synchronized sensor streams directly into GPU memory, allowing real-time perception workloads to scale across a wide range of Physical AI applications.At GTC 2026, iCatch will demonstrate PAISB-E1 using FoundationStereo Depth as an application example. The system streams synchronized multi-sensor data to NVIDIA Thor, enabling real-time perception pipelines for robotics and intelligent machines."Physical AI systems demand scalable and deterministic sensor-to-GPU pipelines to process massive volumes of multimodal data in real time," said Weber Hsu, President of iCatch Technology. "With PAISB, we are introducing an ASIC-based sensor bridge platform aligned with the NVIDIA Holoscan ecosystem, enabling developers to build high-performance, time-synchronized sensor architectures for Physical AI platforms."The PAISB platform is designed to support a broad range of Physical AI applications, including robotics, industrial automation, medical imaging, broadcast infrastructure, and automotive perception systems. By enabling high-bandwidth, synchronized sensor ingestion into GPU-based computing environments, PAISB accelerates the deployment of AI systems requiring precise perception and real-time decision-making.To learn more about PAISB and explore collaboration opportunities, visit us at ApproPho Booth #3420 during GTC 2026, or schedule a meeting in advance.
The "Mini SSD Strategic Seminar" convened recently to strengthen collaboration and accelerate ecosystem development following the successful "Mini SSD Ecosystem Application Seminar" held in Shenzhen on January 26.Leading companies across the industry chain, including Intel, BIWIN, Longcheer, BYD Electronics, Luxshare, Emdoor, Weibu, JWIPC, CYX Industrial, MINISFORUM, Decenta, and SIXUNITED, reached a strategic consensus to jointly build the Mini SSD industry ecosystem, marking a significant step toward large-scale adoption of this emerging storage form factor.As the first batch of core builders of the Mini SSD ecosystem, the initial partners will gain early access to patent licensing benefits, as well as the synergies created through ecosystem collaboration. This milestone signals that Mini SSD is evolving from a standalone product innovation into a collaborative, win-win industry ecosystem.Global Recognition: International Awards Validate Mini SSD's Innovation and Commercial PotentialSince its market debut, Mini SSD has rapidly gained recognition on the global stage, earning multiple prestigious international awards that highlight its technological innovation, design excellence, and industry impact.International Awards Validate Mini SSD's Innovation and Commercial Potential. Credit:BIWINTIME Best Inventions of 2025Founded in 1923, TIME Magazine is one of the world's most respected media institutions. Its annual Best Inventions list is widely regarded as a global benchmark for breakthrough innovation. Selected from thousands of nominations worldwide by TIME's editorial experts, the award recognizes inventions that demonstrate outstanding innovation, practical value, influence, and future potential.Edison Awards (Finalist)Named after legendary inventor Thomas Edison, the Edison Awards are often referred to as the "Oscars of Innovation." Judged by more than 3,000 global academics, industry leaders, and technology experts, the awards evaluate candidates across four dimensions: concept, value, impact, and achievement. Mini SSD's recognition as a finalist highlights its world-class standing in technology innovation, market potential, and societal impact.CES TWICE Picks AwardsAt CES 2026, widely known as the world's premier technology showcase, Mini SSD stood out among over 4,000 exhibitors and tens of thousands of products to win the TWICE Picks Awards, presented by leading U.S. consumer electronics publication TWICE. The award honors products demonstrating breakthrough innovation, exceptional quality, and strong market potential, and is widely regarded as a mark of excellence in consumer technology.Embedded World "Best-in-Show"The Best-in-Show Award at Embedded World is one of the most respected honors in the embedded systems industry. Evaluated by professional engineers and industry experts, the award recognizes products that excel in performance, reliability, and real-world application value. The recognition underscores Mini SSD's strong potential across embedded and edge computing environments.MWC "Best in Show"At MWC 2026, Mini SSD also received the "Best in Show Award", jointly selected by leading global technology media including TechRadar, Tom's Guide, Android Central, and T3. The recognition highlights Mini SSD's achievements in technological innovation and user experience, further reinforcing its global industry recognition.Mini SSD Receives Multiple Global Industry Awards. Credit:BIWINToday, Mini SSD has rapidly progressed into commercial deployment, gaining adoption among leading device brands. OneXPlayer, GPD, and Waterworld have already integrated Mini SSD into flagship devices including handheld gaming consoles, AI PCs, and smart albums. Early partners report that the adoption of Mini SSD has enhanced user experience while driving measurable market growth and positive brand perception.From global awards to real-world product adoption, Mini SSD is steadily advancing from technology validation to commercial success.Industry Collaboration: Partners Outline the Future of the Mini SSD EcosystemDuring the seminar, industry participants engaged in in-depth discussions around standardization, ecosystem governance, and application deployment, jointly outlining the strategic roadmap for the Mini SSD ecosystem.Industry Collaboration: Partners Outline the Future of the Mini SSD Ecosystem. Credit:BIWINShared Value and Ecosystem GovernanceParticipants agreed on the need to establish a shared-benefit mechanism to accelerate ecosystem development. Plans include forming a dedicated IP management company and governance framework, with clear policies for incentive structures, licensing models, and revenue distribution, ensuring that ecosystem partners share both the value and growth opportunities generated by the technologyDesign-In and Technical CollaborationLeading partners including Longcheer, Emdoor, MINISFORUM, and GMKtec announced plans to initiate design-in programs for upcoming flagship products such as ultra-thin laptops and Mini PCs. Through joint development, design validation, and system optimization, the industry aims to establish a collaborative innovation model across the entire supply chain.Market Expansion and Application StrategyThe seminar also outlined a value-driven market strategy. For PC platforms, participants discussed the possibility of pre-loading popular games and AI models on Mini SSD, creating new value-added distribution channels that enable hardware vendors to unlock additional revenue opportunities.Moving forward, ecosystem partners will work together to accelerate Mini SSD adoption across handheld gaming devices, AI PCs, robotics platforms, and other emerging edge-AI applications.Enabling Edge AI: Mini SSD Unlocks New Possibilities for Next-Generation DevicesWith its ultra-compact footprint (approximately half the size of a coin), PCIe Gen4 flagship-level performance, LGA packaging for enhanced shock resistance, and SIM-card-style expandability, Mini SSD provides a flexible, high-performance storage solution for next-generation intelligent devices.IMini SSD Unlocks New Possibilities for Next-Generation Devices. Credit:BIWINUltra-Thin LaptopsWeighing just 1 gram and offering 40% smaller volume compared with traditional M.2 2230 SSDs, Mini SSD frees valuable internal space within ultra-thin devices, enabling manufacturers to integrate additional components. Its user-replaceable expansion design also allows users to scale storage capacity as AI PCs increasingly require large datasets for local AI model deployment.Intelligent RoboticsFor robotics operating in high-vibration and complex environments, Mini SSD delivers high-speed read/write performance and strong shock resistance, ensuring stable access to vision and environmental data. Its modular architecture enables flexible storage expansion across the robot’s lifecycle, supporting continuous data accumulation for lifelong learning and system evolution.DronesMini SSD’s shock resistance and wide temperature tolerance ensure reliable performance during high-speed flight, rapid maneuvering, and extreme temperature variations. With capacities up to 2TB, it supports stable recording of 4K and 8K aerial video, providing creators with greater storage capacity for professional content capture.Handheld Gaming DevicesIn high-performance handheld gaming consoles from brands such as GPD and OneXPlayer, Mini SSD delivers console-class loading speeds within a footprint only slightly larger than a TF card. With random read performance up to 850K IOPS, it enables near-instant loading for large 3D games, while meeting the strict space constraints of compact gaming devices.Building the Mini SSD Ecosystem Together for the FutureThe Mini SSD Strategic Seminar marked the formal establishment of the Mini SSD ecosystem on the basis of in-depth technical exchange. With a clear roadmap spanning shared-value mechanisms, unified standards, and Design-in collaboration, industry partners are now aligned around accelerating large-scale adoption.Backed by Shenzhen's market accumulation and fast response of the industry chain, BIWIN will continue working closely with ecosystem partners to develop technical standards, expand application scenarios, and build a thriving Mini SSD industry platform.
As the global satellite communications industry rapidly advances toward a multi-orbit, multi-band architecture, the flexibility and scalability of ground terminal equipment have become core concerns for operators. Ultraband Technologies announced it will showcase its 16×16 Ku-band phased array module at the Taiwan Space Pavilion during Satellite 2026. Through a modular design philosophy, the company delivers more flexible and scalable terminal solutions for multi-orbit, multi-band satellite communications.Against the backdrop of multi-orbit, multi-frequency satellite networks gradually taking shape, ground terminal equipment must simultaneously support satellite systems operating across different orbits and frequency bands. However, when implementing multi-orbit, multi-frequency architectures, operators face the common challenge of rapidly escalating costs associated with mass production and large-scale deployment for terminals centered around phased array antennas. To address this need, Ultraband Technologies proposes a predictable and consistent ground terminal evolution strategy. This approach assists global satellite operators managing multiple satellite constellations in maintaining technological platform consistency while effectively addressing cost and performance challenges during mass production and deployment phases.Modular Stitching Architecture: Supports gradual expansion from UAV BLOS (Beyond Line of Sight) applications to large ground terminal equipment. Operators can enhance system capabilities through modular expansion, adapting to different orbital or frequency strategies and mission requirements without replacing the entire platform.Multi-Orbit, Multi-Band Switching Design: Collaborating with industry partners to enable a single terminal device to support multi-orbit and multi-band switching capabilities. This allows equipment to operate flexibly across different satellite orbits and frequency band systems, further reducing terminal SKU counts and lowering overall operational costs.Gallium Nitride (GaN) Technology: Integrating proprietary GaN design and process capabilities, this technology enhances signal output power while maintaining low power consumption and superior thermal performance. This ensures high stability and reliability for equipment operating in prolonged and all-weather environments.Ultraband Technologies'newly launched 16×16 Ku-band phased array module serves as a Proof of Concept (POC) and early testing platform, open for evaluation and validation by satellite operator technical teams and research institutions. Through real-world application testing, it assists industry partners in verifying the feasibility of antenna architecture design and field deployment processes prior to formal commercial deployment.For multi-orbit, multi-band operators, this signifies that phased array ground equipment is evolving from a high-performance technology demonstration into deployable, repeatably scalable, and operationally ready infrastructure, laying the foundation for the future large-scale development of satellite communication networks.In the drive toward seamless system implementation, Ultraband Technologies is collaborating with a strategic network of domestic and international partners - including Ubiqconn Technology - to leverage extensive expertise in ruggedized system integration and manufacturing.By introducing a cutting-edge Fast Calibration Mechanism, the collaboration effectively addresses the industry's mass production bottlenecks. This innovation significantly shortens calibration cycles for phased array systems during the manufacturing stage, ensuring superior batch consistency and drastically reducing system tuning costs for large-scale deployments.Ultraband Technologies will showcase the aforementioned phased array modules and related technological achievements during the Satellite 2026 exhibition, engaging in collaboration and exchange with global satellite operators, system integrators, and industry partners.Satellite 2026 Exhibition InformationExhibition Dates: March 23–26, 2026Venue: Walter E. Washington Convention CenterBooth Number: Taiwan Space Pavillion #2747Click here for more information.Ultraband
EDOM Technology (TWSE: 3048), Asia's best solutions partner, will participate in NVIDIA GTC for the third consecutive year under the theme "From AI to Action: Physical AI in Motion." Together with ecosystem partners, EDOM will showcase its latest AI computing platforms, key components, and system integration capabilities. At Booth #242, EDOM will present physical AI and robotics solutions powered by NVIDIA Jetson hardware and software resources, demonstrating how AI technologies are being developed and deployed across diverse fields such as smart healthcare, vision recognition, and speech understanding. The showcase will highlight EDOM's capability to connect the AI ecosystem and accelerate industry innovation through integrated solutions.During the GTC exhibition, EDOM Technology plans to demonstrate several innovative applications that combine physical AI with edge computing. With the introduction of the NVIDIA Jetson Thor, AI inference and control architectures can now be integrated into a single system, providing a high-performance computing foundation for real-time closed-loop control and multimodal sensing, and accelerating the real-world deployment of multimodal intelligent robots.In the robot interaction showcase, EDOM collaborates with Algoltek to present "Dexterous Hand AI."Powered by 4D AI Vision technology and vision-action models, the system can recognize and predict audience hand gestures in real time and respond accordingly. This demonstration highlights low-latency AI inference and instant feedback, while also presenting a complete Sim-to-Real workflow, from virtual simulation to physical deployment. EDOM also partners with Nexuni to present "AI Workforce: Embodied Intelligence." Built on the NVIDIA Thor platform, the system enables dual-arm robot manipulation through few-shot learning. The demonstration shows a service robot performing household tasks, including object recognition, grasping, and fabric folding. Because fabric is a highly deformable material, handling it requires complex visual perception, state estimation, and coordinated dual-arm control. By leveraging Jetson Thor's edge AI inference and real-time dynamic path correction, the system continuously adjusts its movements during the folding process, improving task success rate and operational stability. This highlights the potential of physical AI in smart manufacturing, human-robot collaboration, and service robotics.In the area of enterprise AI and smart biotech applications, EDOM collaborates with Avalanche Computing to showcase the "Secure Offline Generative AI" platform. Combining enterprise-grade private LLMs with real-time speech intelligence, the platform runs on the NVIDIA Jetson edge platform, enabling low-latency offline speech recognition and semantic analysis. This allows generative AI to deliver real-time interaction within highly secure enterprise environments. EDOM is also working with CyteSi to present the "Software-Defined High-Throughput Wet Lab," an AI-driven laboratory automation platform. CyteSi's EWOD (Electrowetting-on-Dielectric) technology digitally controls micro-droplets with precision, supporting workflows such as NGS sample preparation, drug discovery, and synthetic biology research. The system uses NVIDIA Jetson as its edge computing core, integrating biochips from Japan Display Inc. (JDI) with real-time image analysis capabilities to provide an intuitive user interface and highly efficient experimental workflow, advancing AI adoption in smart biotech research and automated laboratories.In addition, EDOM will showcase the "NVIDIA Jetson Thor Peripheral Ecosystem," integrating a range of EDOM-certified peripheral components, including high-speed storage, Wi-Fi 6/6E and 5G communication modules, GMSL and MIPI cameras, 10G high-speed networking, sensors, camera modules, and high-speed I/O interfaces. This ecosystem helps developers rapidly build next-generation robotics and physical AI systems. Through comprehensive hardware integration and platform support, EDOM assists robotics developers in accelerating product design, deployment, and mass production, further expanding the physical AI and Jetson Thor ecosystem.Jeffrey Yu, CEO of EDOM Technology, stated, "The key to physical AI lies not only in computing performance, but in comprehensive hardware–software integration and ecosystem collaboration. Through NVIDIA's Three-Computer architecture and the Jetson Thor platform, we help customers build scalable, production-ready, end-to-end AI solutions - from model training and simulation validation to edge deployment." He further noted that EDOM is not just a hardware supplier, but is committed to integrating peripheral modules, AI software frameworks, and partner resources to help enterprises accelerate the adoption of AI and robotics technologies.EDOM Technology invites industry professionals, developers, and partners to visit Booth #242. Attendees are also welcome to check out the in-person session featuring Wilson Yen, Product Director at EDOM. The talk explores how EDOM leverages NVIDIA "Three Computers" architecture to help enterprises transform AI models into real-world applications, covering key domains such as computer vision, robotics, and edge AI. Participants are encouraged to add this session to their personal GTC schedule to experience firsthand the innovation of physical AI in action, and to explore the future of intelligent robotics and edge AI. Register now through EDOM's dedicated link to enjoy special GTC Conference registration offers.
SK hynix Inc. (or "the company", www.skhynix.com) announced today that it is participating in GTC 2026, held from March 16 to 19 in San Jose, California. NVIDIA GTC is the global AI conference where business leaders and developers gather to share the latest breakthroughs and future trends in AI and accelerated computing.SK hynix memory solutions are designed to minimize data bottlenecks and maximize performance for both AI training and inference in NVIDIA AI infrastructure. Through its participation in GTC 2026, the company plans to demonstrate its competitive edge in memory technology - the core infrastructure of the AI era.Under the theme 'Spotlight on AI Memory,' SK hynix will feature an exhibition space dedicated to the AI memory technologies and solutions. The booth will consist of three main areas: the NVIDIA Collaboration Zone, the Product Portfolio Zone, and the Event Zone. The exhibition is designed around interactive content to provide visitors with an intuitive understanding of AI memory technology.The NVIDIA Collaboration Zone, located at the entrance, is the centerpiece of the exhibition, highlighting the synergy between SK hynix and NVIDIA. The company will display the memory configuration mounted on GPU-based AI accelerators through physical models and actual hardware, focusing on the actual application of SK hynix's memory products such as HBM4, HBM3E, and SOCAMM2 designed for NVIDIA AI platforms.Notably, the company will showcase a liquid-cooled eSSD developed in collaboration with NVIDIA, along with an NVIDIA DGX Spark, desktop AI supercomputer equipped with SK hynix's LPDDR5X.In the Product Portfolio Zone, visitors can view a comprehensive lineup of memory products engineered for the AI era. This includes the infrastructure-essential HBM4 and HBM3E, as well as high-capacity server DRAM modules, LPDDR6, GDDR7, eSSD, and Automotive Solutions.An interactive environment allows visitors to use joysticks to select products and view specific features and use cases on-screen, enabling them to explore and understand the technology at their own pace.The Event Zone offers a hands-on experience with an 'HBM 16-High Stacking Game.' By virtually stacking memory chips, participants can gain insight into the TSV (Through Silicon Via) process and high-stack packaging technology, fostering a deeper understanding of how high-performance AI semiconductors are manufactured.Throughout GTC 2026, SK hynix plans to explore future collaboration strategies aligned with current global AI trends. Key executives, including SK Chairman Chey Tae-won and SK hynix CEO Kwak Noh-jung, will meet with global tech giants to share insights on AI evolution and infrastructure shifts while discussing long-term strategic partnerships.The company will also host technical sessions to discuss the future of AI-driven manufacturing and the pivotal role of memory technology in achieving high-performance AI.SK hynix highlighted that as AI technology evolves, memory is transcending its role as a mere component to become a core element that determines the architecture and performance of the entire AI infrastructure. By applying its memory expertise across the entire AI spectrum - from data centers to on-device applications - the company aims to shape the future of AI alongside its global partners.HBM-GPU model shows SK hynix and NVIDIA AI collaboration. Credit: SK hynixSOCAMM2 and HBM4 on NVIDIA Vera Rubin Superchip. Credit: SK hynix
As global AI computing platforms continue to evolve toward higher density, increased power demands, and rack-scale integration, Chenbro unveiled its latest AI server chassis solutions at NVIDIA GTC 2026. The showcase features the NVIDIA MGX 1U Compute Tray for NVIDIA Vera Rubin NVL72 systems, along with a comprehensive product portfolio based on NVIDIA MGX architecture, demonstrating Chenbros integrated capabilities spanning system design, thermal optimization, and rack-level deployment.Building on its close integrations with the NVIDIA ecosystem, Chenbro presented multiple server chassis solutions designed in alignment with NVIDIA reference architectures and the NVIDIA MGX architecture. These solutions address high-density computing, liquid cooling technologies, and enterprise-grade deployment requirements, enabling cloud service providers(CSPs) and enterprise data centers to accelerate AI infrastructure deployment.NVIDIA MGX 1U Compute Tray for NVIDIA Vera Rubin NVL72- A New Standard for High-Density AI ComputingAs next-generation AI training and inference workloads continue to scale rapidly, data centers face increasing demands for space efficiency and advanced thermal design. At NVIDIA GTC 2026, Chenbro highlights the NVIDIA MGX 1U Compute Tray for Vera Rubin NVL72, engineered with optimized mechanical design and airflow management to deliver high-density computing within a 1U footprint. The solution is tailored for large-scale model training and high-performance inference applications.Chenbro also showcases:NVIDIA MGX 1U for NVIDIA GB200 NVL4, supporting high-performance inference and flexible deployment.NVIDIA MGX 2U Vera Server Chassis, offering enhanced scalability and enterprise-level integration options.Together, these solutions demonstrate Chenbro's system integration expertise under the NVIDIA MGX architecture framework.NVIDIA MGX Rack- Advancing from System Integration to Rack-Scale DeploymentAs AI infrastructure expands from individual systems to rack-scale environments, Chenbro highlights its integration capabilities based on NVIDIA MGX architecture. The company leverages its strengths in mechanical design and mass production to support the deployment of high-density AI computing environments in modern data centers.By closely aligning with NVIDIA reference architectures and the broader NVIDIA MGX ecosystem, Chenbro enables customers to extend from system-level builds to rack-level integration, accelerating scalable AI infrastructure deployment.NVIDIA MGX 6U Liquid-Cooled Server Chassis- Liquid Cooling for High-Power AI PlatformsIn response to power consumption and energy efficiency requirements for AI platforms, Chenbro presents the NVIDIA MGX 6U Liquid-Cooled Server Chassis. Designed to support high-power liquid-cooled deployment architectures, the solution enhances thermal efficiency and improves data center power usage effectiveness (PUE) through optimized mechanical and fluid management design, ensuring stable operations for next-generation AI data centers.Additional showcased solutions include:NVIDIA MGX 4U Air-Cooled Server Chassis and NVIDIA MGX 2U Short-Depth Server Chassis.These offerings provide flexible deployment options for enterprise server rooms and diverse application scenarios.Strengthening Global Footprint and AI Infrastructure CapabilitiesChenbro CEO Corona Chen stated that as AI applications continue to expand, market demand for high-density computing, liquid cooling, and rack-scale integration capabilities is rapidly increasing. Chenbro will continue deepening its collaboration within the ecosystem, strengthening its integrated R&D and manufacturing capabilities to help customers accelerate the adoption of next-generation AI platforms. With its global manufacturing footprint and localized service capabilities, Chenbro is committed to supporting diverse deployment needs across AI, HPC, and data center applications—driving sustained operational growth and industry competitiveness.At GTC 2026, Chenbro not only presents its product portfolio but is supporting NVIDIA AI platforms from system integration and thermal optimization to rack-scale deployment, enabling scalable AI infrastructure development worldwide.Chenbro supports diverse AI, HPC, and data center deployment needs. Credit: Chenbro
NEXCOM, A leading global provider of industrial computing and automation technology, is coming to Embedded World in Nuremberg (booth 3/341) with ambitious goals. With the help of European partners, the company aims to further expand its AI presence in edge applications, including automation, rugged mobile computing, safety-oriented robotics, smart cities, on-premises GPT, and industrial cybersecurity."As robots increasingly become the primary physical carriers for AI capabilities, NEXCOM is committed to accelerating their adoption across various industries," explains CEO Clement Lin, who will be attending Embedded World himself. "At Embedded World 2026, we will be presenting, among other things, a comprehensive range of safety-certified industrial robotics solutions in collaboration with the German robotics innovators. These solutions are specifically designed for smart factories, service robots, automotive manufacturing, and logistics."NEXCOM Robotic Solutions: Building a Safety-Oriented Foundation for Physical AIThe integration of physical AI into industrial environments requires rigorous and comprehensive safety certification for every component, from joint actuators and control motors to safety sensors, to ensure safe human-machine collaboration. As the central architect of the intelligent machine ecosystem, NEXCOM Robotic Solutions offers a robust motion control platform integrated with joint drive modules and safety software from European partner Synapticon. These solutions enable developers to significantly shorten development cycles while achieving the highest safety standards for robots used in manufacturing, logistics, and automated services."Over the past 34 years, NEXCOM has gradually evolved into one of the world's leading providers of robotics, IoT, and Industry 4.0 solutions. NEXCOM's extensive portfolio and long-standing experience in the global market perfectly complement the innovations developed by our team in Europe," reports Simon Fischinger, CEO at Synapticon. "Especially in the field of AI-based robotics, enormous opportunities are emerging as leading providers opt for open standards, enabling them to collaborate efficiently with partners."To further accelerate the deployment of safe and flexible robotic applications, NEXCOM is also collaborating with Botfellows, a German high-tech robotics startup specializing in safety-driven automation solutions. Botfellows focuses on enabling flexible and efficient robotic applications through software-defined safety architectures and intuitive robot programming."Physical AI will only scale if robotics becomes significantly easier and safer to deploy," says Dr. Mohamad Bdiwi, CEO of Botfellows. "Our collaboration with NEXCOM and Synapticon demonstrates how the combination of edge AI computing, advanced motion control, and software-defined safety enables a new generation of flexible robotic systems for smart factories and logistics."Embedded World 2026 Highlight: Unlocking the Potential of SD Edge ComputingUnder the motto "Unleashing the Genius of SD Edge Computing," NEXCOM's presentation is divided into two main areas: AIoT solutions and AI computing. The exhibition demonstrates the enormous potential of Software-Defined Edge Computing (SDEC) using real-world implementations of Edge AI and Physical AI in global AIoT infrastructures.Key product highlights include:NDiS B340: A rugged edge computing computer specifically designed for the demanding requirements of smart healthcare.APPC 160/210 C21: Industrial touch computers for high-performance AI applications in smart factories.IP67 AI edge telematics: Innovative, rugged solutions for challenging outdoor and vehicle environments.NEXCOM remains committed to accelerating the practical implementation of intelligent applications. From high-performance AI computing platforms and physical AI to comprehensive AIoT operating frameworks, NEXCOM delivers innovative products that empower the next generation of AI-driven businesses and improve people's lives.NEXCOM at Embedded World 2026NEXCOM invites trade show visitors to discover the future of autonomous innovation at its booth (4/341) in Nuremberg. Those interested can experience firsthand how NEXCOM's software-defined solutions are transforming the landscape of industrial automation and edge intelligence.For more information, please visit.
NewPower Worldwide, a leading independent distributor of electronic components and supply chain management solutions, today announced an expansion of its committed credit facility to $500 million, strengthening the company's ability to respond quickly to evolving market dynamics and meet customers' ever changing needs.The expanded facility underscores strong lender confidence in NewPower Worldwide's operational excellence, financial discipline, and ability to move decisively in rapidly shifting global markets."This expanded credit facility gives us the financial flexibility to execute deals of any scale at the pace our customers require," said Carleton Dufoe, Chief Executive Officer of NewPower Worldwide. "Our customers need partners who can move fast, adapt to change, and deliver consistent results. This additional capacity ensures we can meet those demands every time.""Our continued partnership with NewPower reflects our confidence in their ability to support customers through dynamic market conditions," said Jason Upham, Senior Vice President at Citizens. "Our team led a new credit facility that will give NewPower the agility and resources needed to deliver solutions that align with their customer's supply goals and timing."This increased capacity provides NewPower Worldwide the financial strength and flexibility to execute deals of any size with speed and consistency. It enables the company to align seamlessly with its customers' pace, delivering tailored supply solutions that help them maintain stability, adapt quickly to market changes, and move forward with confidence.
In Taiwan's older urban neighborhoods, five- or six-story walk-ups are common. For elderly residents living with chronic conditions such as diabetes, even a routine hospital visit can become a grueling physical ordeal - often requiring the assistance of family members or caregivers. This simple yet often overlooked reality became the catalyst for a major innovation in AI-powered healthcare.A group of international Ph.D. students at Taipei Medical University (TMU), known as the TSY-AI Team, set out to address this pain point. Their goal was clear: to bring diagnostics directly into people's homes. This result is a disposable, AI-integrated biosensor system capable of measuring blood glucose and pH levels with just a drop or two of blood - and delivering results in under 10 minutes, all without the need to leave the house. This groundbreaking platform recently earned the team the Bronze Medal at the 2025 Best AI Awards, hosted by Taiwan's Ministry of Economic Affairs. "We're not just building a chip. We're building a full platform," says Asaduzzaman, the team's representative and a Ph.D. candidate from Bangladesh. "Something that supports long-term chronic care while reducing unnecessary hospital visists.”At the core of the platform is the 3DISFETCHIP, a three-dimensional ion-sensitive field-effect transistor (3D ISFET) engineered to capture biochemical data from just minimal blood samples. The chip, housed in a disposable microfluidic chamber, connects to a mobile app that displays blood glucose and pH results within 10 minutes.But the innovation doesn't stop there. The system also incorporates AI-powered image recognition, enabling patients to photograph wounds - such as diabetic foot ulcers - and receive real-time analysis of healing progress. Over time, this feature allows doctors to remotely track wound recovery without requiring in-person visits."I saw the announcement for the Best AI Award in the newspaper," recalls Asaduzzaman. "We had just finished the core development work for our biosensor and thought - why not apply?""But for us, it wasn't about the competition," he adds. "It was about sharing our idea with Taiwan's AI and healthcare communities. We wanted to show students, researchers, and industry leaders that AI medical devices can be both simple and impactful."The response from the event was overwhelming. Visitors from the medical device industry expressed surprise at the product's affordability and ease of use. Some even opened conversations about future partnerships.With product development progressing, the TSY-AI Team is now evaluating Taiwan as a long-term base for commercialization."Taiwan has world-class semiconductor capabilities, and the startup ecosystem here is extremely welcoming," Asaduzzaman explains. "We've spoken with major players like Wistron, as well as smaller chip manufacturers, all of whomare very open to supporting medical AI solutions like ours."In addition to hardware partnerships, the team has also initiated collaboration with local hospitals. They have completed preliminary testing with animal models and controlled human samples, and are currently preparing to apply forInstitutional Review Board approval. Clinical trials are planned with Taipei Medical University Hospital and Shuang Ho Hospital.While the current system focuses on glucose and pH monitoring, the team is actively expanding its biomarker detection capabilities. Plans are underway to incorporate inflammation markers, HbA1c, and early indicators of infection - all from the same minimal blood sample."We want to turn this into a multi-analyte health platform that gives both patients and doctors a comprehensive view of physical conditions from home," says Asaduzzaman. "I believe the future of medical diagnostics is home-based. Patients shouldn't need to visit hospitals every week just to monitor chronic conditions. They should be able to do it easily, safely, affordably, and accurately from home."TSY-AI Team won the Broze Award in the International Group IC Design Category at the 2025 Best AI Awards. If you have innovation would like to present, 2026 Best AI Awards with global tracks open for both AI Applications and IC Design, students and companies worldwide can compete for the grand prize of up to USD 30,000 (NTD 1,000,000). The deadline is March 16, 5:00pm (GMT+8). For more details, please follow official Linkedin for the lastest updates.
Intelligent Asia Thailand 2026, Southeast Asia's leading B2B platform for PCB manufacturing and industrial automation, will take place from 11 to 13 March 2026 at Event Hall 98, BITEC, Bangkok. The exhibition brings together global technology providers and regional manufacturers seeking to enhance efficiency, precision, and production flexibility, offering a unique gateway to the region's rapidly evolving electronics and smart manufacturing market.Thailand's electronics and smart manufacturing sector is expanding rapidly. In 2025, foreign direct investment in the country reached 324 billion THB (approximately USD 10.5 billion), a 42% increase compared with the previous year. While the semiconductor industry remains at an early stage, the country already demonstrates strong potential due to advanced infrastructure, skilled talent, a business-friendly environment, and integrated downstream supply chains. These conditions make Intelligent Asia Thailand 2026 a timely platform for connecting with key stakeholders and exploring growth opportunities.According to the Board of Investment (BOI), between 2018 and November 2025, investment promotion applications in the electronics and electrical sector totaled 1.17 trillion THB(USD 37 billion) across 1,748 projects. This accounted for 19% of total promoted investments, making electronics the sector with the highest investment volume. Growth was driven primarily by printed circuit boards, semiconductor packaging and testing, hard disk drives and components, as well as electronic parts for automotive, medical, telecom, and smart electronics manufacturing - further underscoring the importance of this industry in Southeast Asia's economic development.Positioned at the intersection of electronics manufacturing and smart automation, Intelligent Asia Thailand 2026 features strong participation from Taiwan's semiconductor and PCB supply chain leaders expanding into Southeast Asia. Visitors can discover cutting-edge technologies, forge regional partnerships, and seize emerging business opportunities across Thailand and neighboring countries. Covering 10,000 sqm with over 310 exhibitors, the event is organized by Yorkers Trade & Marketing Service Co., Ltd., Messe Frankfurt (HK) Ltd, Taiwan Branch, and GMTX Company Limited.Dual Focus: PCB Thailand and Automation ThailandThe exhibition is structured around two core pillars - PCB Thailand and Automation Thailand - providing a comprehensive platform where electronics manufacturing and smart automation converge. Exhibitors showcase end-to-end solutions spanning advanced PCB materials, precision processing, surface treatment, inspection systems, robotics, motion control, factory automation, and digital management. These technologies enable manufacturers to optimize production efficiency, enhance quality control, and respond flexibly to evolving market demands. FeaturedExhibitors and Technologies:PCB & Advanced Electronics Manufacturing Atotech(Thailand) – Surface treatment, plating, and finishing solutions for electronics and industrial applications.Hunson – Industrial cameras, AOI inspection systems, sensors, and machine vision solutions. Jiangsu Ysphotech – High-performance integrated circuit equipment and solutions. Nano Electronics & Micro System Technologies – Plasma etching, drilling, and cleaning machines for HDI/ABF PCBs.PATA Chemicals & Machinery – Tailored chemicals and process support for plating and surface treatment. Qnity – Advanced connectivity materials for flexible, rigid-flex, and rigid PCBs. SCREEN GP Thailand – PCB production systems: imaging, miniaturization, energy-efficient solutions. Schlötter Asia – Specialty electroplating chemicals and surface finishing solutions.Automation, Robotics & Industrial ControlAuer Signal – Smart signaling devices for industrial automation, real-time status visualization, predictive maintenance. DEEP Robotics – Quadruped robots for inspection, rescue, and industrial applications. FINERN – Automation and intelligent measurement systems for automotive, electronics, and healthcare. MRDVS Technology – AI-powered 3D robot cameras and navigation modules for AMRs and AGVs. Smart Motion Control – Motion control products: servo motors, drivers, amplifiers, PC-based controllers. TJ Solutions – Automation and QC measurement solutions with application-based consulting. Weldex – High-efficiency welding and cutting solutions with German/US technology support. Wieland Electric Singapore Pte. Ltd. – Scalable industrial safety solutions: sensors, relays, safety controllers.Manufacturing Infrastructure & Supporting TechnologiesEVERBIZ Industrial – Customized wiring solutions for automotive, electronics, and industrial applications. Long Long Clean Room Technology – Dust-free and sterile cleanrooms for semiconductor, medical, and precision industries. Molding Innovation Technology （Minnotec） – Smart mold and plastic injection solutions for Southeast Asia. Taiwan Grace – High-efficiency industrial filter cartridges, media, and housings. Thai Murata – Ceramic passive components, wireless modules, and power conversion technologies. Factory Max – 3D scanning, motor spindles, and advanced manufacturing solutions. Software & Digital Manufacturing SolutionsData Systems – Digiwin ERP and sMES for manufacturing management, IoT integration, and production optimization. Xian Jin Trading – CAD/CAM/CAE software solutions for design, engineering, and manufacturing.Technical Forums and Industry SeminarsIn parallel with the exhibition, a three-day seminar and management forum program offers actionable insights and practical guidance for manufacturing transformation:Day 1(11 March 2026): Opening Ceremony and Management Forum on Thailand's manufacturing strategy in Southeast Asia, with sessions on AI-driven quality improvement and smart factory maintenance systems.Day 2 (12 March 2026): AIoT and EDGE technologies in modern manufacturing, smart factory integration, and next-generation PCB processes.Day 3(13 March 2026): Dedicated PCB Seminar, KAIZEN-based manufacturing excellence, and strategies for high-value electronic component production.These sessions are designed for engineers, plant managers, system integrators, and business decision-makers seeking practical strategies to optimize production efficiency, quality control, and smart manufacturing capabilities. Coupled with the country's growing electronics investment, participants can gain insights aligned with Southeast Asia's dynamic industry trends.Why Attend Intelligent Asia Thailand 2026Gain first-hand access to the latest PCB and automation technologies, connect directly with industry-leading suppliers, and acquire actionable knowledge to enhance efficiency, quality, and production flexibility. Don't miss the opportunity to explore business potential in Thailand's expanding electronics sector. Register now for free visitor access: website.Credit: Intelligent Asia ThailandCredit: Intelligent Asia ThailandCredit: Intelligent Asia Thailand
