AT&S, a global leader in high-end IC substrates and printed circuit boards, took part in the 2025 Chongqing Mayor's International Economic Advisory Council (CMIA) conference, held under the theme "Building an AI Application Hub to Enable High-Quality Industrial Development."Credit: AT&SAT&S CEO Michael Mertin delivered a keynote speech titled "AT&S and Chongqing's Joint Path Toward AI-Driven, Sustainable Manufacturing." He reaffirmed the company's commitment to advancing intelligent, sustainable manufacturing in close partnership with Chongqing.In his address, Mertin highlighted AT&S's long-term commitment to strengthening Chongqing's position in the global industrial value chain. He stressed the importance of partnerships, talent development, and cutting-edge technology, noting that combining these strengths with Chongqing's unique advantages will accelerate the city's transformation into an AI-driven, sustainable manufacturing hub.Artificial intelligence is a driving force of digital transformation, and AT&S is positioning itself as a key enabler of this trend by delivering innovative technologies essential for AI applications. These include substrates for AI processors, energy management solutions for data centers, and embedding technologies for high-performance components. In particular, AT&S plays a vital role in enabling on-device AI, serving as an innovative partner for leading manufacturers of smartphones, notebooks, and other end devices.AT&S Highlights how AI accelerating industrial transformation of Chongqing. AT&SIn line with the conference theme, AT&S also released a white paper outlining how AI, combined with Chongqing's strategic policies, can accelerate industrial transformation and reinforce the city's global competitiveness.Chongqing is one of AT&S's most important global production bases. Since establishing operations there in 2011, the company has made continuous investments in advanced technologies and innovation. Today, AT&S Chongqing manufactures high-tech IC substrates and modules for high-performance processors, data centers, gaming, 5G, automotive, and AI applications. The rapid growth of the AI market creates significant opportunities for the site, with rising demand for high-performance infrastructure, energy-efficient components, and integrated AI solutions expected to drive continued growth. AT&S's strategic focus on"local-for-local" solutions further supports Chongqing's and China's digital transformation.Initiated in 2005 by the Chongqing municipal government, CMIA provides a platform for global business leaders to advise the Mayor and his leadership team on the city's development. The 2025 conference marks AT&S's tenth consecutive year of high-level participation in the council.Credit: AT&S

Global Unichip Corp. (GUC), theAdvanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced Package Technology (APT) platform, developed to accelerate designcycles and reduce risk for high-performance, high-yield ASICs. The platform integrates TSMC's latest 3DFabric technologies and advanced process nodes, enable next-generation designs with a comprehensive solution that spans from silicon-proven IP to 2.5D/3D packaging.The new platform builds on GUC's first-generation 2.5D/3D APT platform introduced in 2022. Since then, GUC has closely collaborated with TSMC to incorporate major technological advancements of TSMC in both logic processes and 3DFabric technologies. TSMC's evolution from FinFET-based N5/N3 nodes to next-generation nanosheet nodes-N2 and A16-has enabled unprecedentedintegration density and performance scaling. Simultaneously, TSMC's 3DFabric innovations, including CoWoS, TSMC-SoIC , and System-on-Wafer (TSMCSoWTM), allow for advanced 2.5D/3D integration of multiple dies across larger package substrates.Industry standards have also evolved. The latest HBM4 memory interface doubles I/O to 2,048 pins, unlocking significantly higher bandwidth. Meanwhile, the UCIe die-to-die interface has gained industry-wide adoption, advancing from 16Gbps to 24Gbps and now 32Gbps-and beyond.GUC Milestones and Technology HighlightsUCIe Die-to-Die IP: GUC offers UCIe-A 32G/36G IP in TSMC N3 and N5 processes, with a 64G version under development and scheduled for tape-out in late 2025. The UCIe-A IP in TSMC 2nm technology is also planned for 2026.Integration with TSMC SoIC-X: GUC successfully taped out UCIe Face-Up IP in TSMC N5 using TSVs for bottom die applications-enabling vertical die stacking in future nodes.HBM4 IP: GUC taped out its HBM4 PHY IP on TSMC N3P, achieving 12Gbps speeds. The IP supports CoWoS-L/R and SoW platforms, with porting to TSMC N2P underway for a 2026 tape-out.GLink/UCIe-3D IP: Building on its GLink-3D 1.0 success, GUC now offers UCIe/GLink-3D 2.0 IP delivering 50 Tbps/mm? bandwidth, architecture proven via TSMC N2P. A customized version has already been taped out by a lead customer for an N3 over N5 ASIC.Deep Collaboration with TSMCGUC has long worked with TSMC closely to develop silicon-proven IP and platform technologies. This ongoing collaboration ensures alignment with TSMC's latest process and 3DFabric packaging advances, enabling customers to reduce design risk while accelerating time-to-market."TSMC has been working closely with our Open Innovation Platform (OIP) partners like GUC to develop IP solutions for our advanced process and 3DFabric technologies," said Aveek Sarkar, Director of Ecosystem and Alliance Management Division at TSMC. "Our latest collaboration with GUC in enabling its 2.5D/3D platform will help customers accelerate product development cycles and deliver next-generation silicon using our advanced packaging and process technologies.""We were industry-leading with HBM3 PHY and Controller, and again with HBM4 in 2025," said Aditya Raina, CMO of GUC. "Our UCIe IP has demonstrated unmatched 32Gbps speed and is now moving to 64Gbps era. Our Custom GLink-3D 2.0 IP has achieved 40 Tbps/mm² through a lead customer. These achievements mark the dawn of true 3D ASICs."GUC's next-generation APT platform combines cutting-edge IP, TSMC-certified design flows, and high-volume production experience to enable rapid, low-risk development of next-generation AI, HPC, and networking chips.To learn more about GUC's solutions, please contact GUC sales representative via email.

Wise Integration, a pioneer in digital control for gallium nitride�]GaN�^and GaN IC-based power supplies, today announced the appointment of Ghislain Kaiser as Chief Executive Officer. Kaiser succeeds CEO and co-founder, Thierry Bouchet, who will continue to serve as Chief Technology Officer and General Manager, leading the worldwide R&D and driving the technological vision.A seasoned high-tech leader with a proven track record in growing and leading global teams in the semiconductor industry, Kaiser brings deep experience in scaling deep-tech ventures. In 2006, he cofounded Docea Power, a French EDA startup pioneering full-chip, system-level power and thermal modelling, with the vision of addressing the growing power-consumption and thermal challenges in IC and platform design.As CEO, he led the company to domain leadership and its acquisition by Intel in 2015. He then joined Intel, where for the next decade he held senior director roles, most recently overseeing system-simulation engineering and worldwide customer-enablement organization. Those programs tackled the most critical power, thermal, and performance challenges in designing consumer, data-center, and AI systems. Kaiser began his career at STMicroelectronics, where he held technical and leadership positions across test and product engineering, design, and architecture teams.Targeting Fast-Growing MarketsWith Kaiser’s appointment, Wise Integration is positioning itself to scale globally and capitalize on booming markets such as data centers powering artificial intelligence (AI), and electric vehicles (EV)-which demand more efficient, compact, and digitally controlled power architectures."I'm thrilled to join Wise Integration and build on its success in providing customers differentiated solutions in power electronics to meet their biggest challenges," Kaiser said. "This talented team has created an R&D-driven culture and a robust foundation to lead the GaN power electronics transformation globally."The Next Chapter"On behalf of the board of directors, I am pleased to welcome Ghislain Kaiser as Wise Integration's new CEO, and to compliment the team for their exceptional work," said Board Chairman Patrick Boulaud. "This marks a major milestone for the company as it transitions from a CEA�HLeti spinout into a pioneering force in GaN and digital power management innovation with strong growth potential. Ghislain's background makes him a natural choice as the CEO to guide the company through this next stage of growth.""Ghislain's arrival begins a new chapter for Wise Integration," Bouchet added. "With our WiseGan devices and WiseWare digital control, we've built a strong foundation in consumer markets. Now it's time to scale our innovations and tackle the next big challenges-bringing unmatched efficiency and power density to AI servers, data centers, and tomorrow's automotive systems."Selected Highlights (2020–2025)Spun out from CEA-Leti in 2020 using the institute's GaN-on-silicon R&D platform. Developed proprietary WiseGan IC and WiseWare microcontroller. Launched its fully digital controller, WiseWare 1.1. Opened a design center in Canada and established an Asian subsidiary in Hong Kong.Wise Integration Appoints Ghislain Kaiser, Successful High-Tech Entrepreneur & Former Intel Executive, as CEO to Lead Global Growth.WISE

The modern digital supply chain is no longer a traditional linear sequence but a complex, interconnected ecosystem of suppliers, sellers, logistics providers, and customers. While digital transformation greatly improves efficiency, it also exponentially expands the overall attack surface. In this model, risks are no longer isolated but systemic and cascading. Supply chain efficiency is built on an implicit digital trust model between partners, which is manifested through application programming interfaces (APIs), shared portals, and integrated software. However, this trust structure, built in pursuit of efficiency, has become a primary attack vector. Cybercriminals are no longer just breaking through firewalls—they are exploiting the fundamental fabric of digital collaboration. As a result, the traditional perimeter defense model is outdated; The new perimeter of defense is the entire supply chain ecosystem, and its security must be built on a zero-trust model enforced with cryptography.Third-party or fourth-party vulnerabilitiesAttackers often use the weakest link in the chain—often smaller, poorly secured vendors—as a springboard to infiltrate the network of their ultimate high-value target. This highlights a stark reality: an organization's security posture is only as strong as its least secure partners. This risk stems from the pursuit of supply chain efficiency, as the smooth operation of business processes requires granting partners a considerable degree of access. This expansion of access rights, without corresponding strict security controls, constitutes a systemic vulnerability based on excessive trust.The fundamental role of traditional cryptography and its limitationsCurrent supply chain security relies heavily on traditional public key cryptography (such as RSA, ECC) to protect data in transit and at rest. Mitigation strategies such as data encryption (using AES), risk assessment, and incident response plans are crucial, but their effectiveness is built on the strength of these underlying cryptographic algorithms. While these methods are still effective against today's threats, the entire security foundation is fragile and faces an existential threat that will be the focus of the next section.Quantum Horizons: A Paradigm Shift in Cryptographic ThreatsQuantum computers use quantum mechanical principles such as superposition and entanglement to solve mathematical problems (e.g., integer factorization, discrete logarithms) that form the security basis of today's public key cryptography (RSA, ECC, Diffie-Hellman). This is not a purely theoretical deduction, but a major engineering challenge that is making rapid progress. Once a quantum computer with sufficient scale and stability comes out, the current encryption system that protects global digital communications will fail in an instant."Get First, Decrypt Later" (HNDL): An imminent dangerThe Harvest Now, Decrypt Later (HNDL) attack transforms the quantum threat from a futuristic problem to a present reality. The mechanism is that attackers, especially state-state actors, are actively intercepting and storing large amounts of today's encrypted data. These attacks target information with long-term value, such as intellectual property, government secrets, financial records, medical data, and personally identifiable information (PII).This means that by the time a "Cryptographically Relevant Quantum Computer" (CRQC) appears that can crack current encryption algorithms (known as "Q-Day", which is expected to arrive as early as 2035), these obtained data will be retroactively deciphered. Therefore, the security of any sensitive data transmitted today that requires long-term confidentiality is already at risk.This attack pattern transforms a company's data retention policy into a huge potential security liability. Regulations such as the Health Insurance Portability and Accountability Act (HIPAA) or the General Data Protection Regulation (GDPR) often require organizations to retain data for an extended period. The HNDL attack vector turns this legal compliance requirement into a potential ticking time bomb. Organizations are legally required to encrypt data stored for years, making it an ideal target for HNDL attacks. This creates a direct conflict between compliance and security: the act of adhering to data retention regulations inadvertently creates vulnerabilities for future quantum decryption threats. Therefore, risk management and legal teams must be immediately involved in the migration strategy of post-quantum cryptography. This is no longer just an IT issue, but a simmering corporate governance and compliance crisis.To learn the latest cybersecurity regulations and trends, download the hardware security whitepaper for free.Post-Quantum Cryptography (PQC): Laying the foundation for quantum resilienceDefinition of post-quantum cryptographyPost-quantum cryptography (PQC) refers to traditional algorithms that are designed to run on today's classical computers but are resistant to attacks from both classical and quantum computers. This distinguishes PQC from quantum cryptography, which requires specialized hardware, such as quantum key distribution, or QKD. PQC's goal is to develop a new generation of public-key cryptographic systems based on mathematical problems that are equally difficult for quantum computers.NIST PQC Standardized Process: A globally recognized markThe National Institute of Standards and Technology (NIST) has led a multi-year, transparent, and collaborative global process to select and standardize the next generation of public key algorithms. This process is crucial in building trust in the new standard. The process began in 2016 with a public call for proposals, receiving 82 proposals from 25 countries and undergoing multiple rounds of rigorous public review and analysis in the global cryptography community.The finalization of NIST standards is the starting gun that triggers a massive technology update cycle across the tech industry. This was not only an academic milestone but also a turning point in business and logistics. It directly prompted government agencies such as CISA and the National Security Agency (NSA) to issue migration directives, which in turn pushed major software vendors and hardware manufacturers such as Microsoft and Google to integrate these specific algorithms into their products. This ripple effect ultimately extends to enterprises, who must plan their migrations to maintain compatibility and security. NIST standards are the core domino that initiates PQC adoption worldwide.Secure the edge: Protect IoT and operational technology equipment in the supply chainInternet of Things (IoT) and operational technology (OT) devices face the biggest challenges in PQC migration for the following reasons:*Long life cycle: The device may be used in the field for 10-20 years without replacement.*Limited resources: Limited processing power, memory, and energy budgets.*Lack of Updability: Many devices are not designed to be conducive to easy firmware or cryptography updates.The application of PQC in these areas will be gradual and there will be significant differences between the old and new systems. For "greenfield" systems, such as new IoT product lines, PQC can be integrated from the outset. For "brownfield" systems, such as existing factory OT equipment, the challenge is enormous, often requiring the entire hardware to be replaced. This means that the PQC migration of the supply chain will be a two-speed process. Businesses must prioritize the adoption of PQC in new systems while developing long-term, potentially costly, retirement or retrofit capital plans for existing assets that are not quantum-safe.Use cases for PQC include:*Industrial automation: Protecting communication between sensors, controllers, and management systems in factories and processing plants.*Smart Infrastructure and Logistics: Protecting smart grid equipment, traffic control systems, and connected logistics sensors.*Automotive V2X Communication: Secure vehicle-to-vehicle (V2V) and vehicle-to-infrastructure (V2I) communications to ensure security and prevent malicious manipulation.*Healthcare Supply Chain: Ensuring the integrity and privacy of data from connected medical devices.Conclusion and recommendationsWinbond's W77Q Secure Flash Memory is a robust solution to address the PQC threats mentioned above. Key PQC-Safe features of the W77Q Secure Flash include:*Platform Resilience: In accordance with NIST 800-193 recommendations, the system automatically detects unauthorized program changes and can automatically restore to a secure state to avoid potential cyberattacks. *Security Software Update and Fallback Protection: Supports remote security software updates while preventing fallback attacks, ensuring that only legitimate updates can be executed. To maintain the highest level of security and integrity, the W77Q adopts the quantum-secure Leighton-Micali signature (LMS) algorithm recommended by NIST Special Publication 800-208 to ensure the authenticity and integrity of updated software, providing additional security*Secure Supply Chain: Secure Flash ensures the origin and integrity of flash content at every stage of the supply chain. The W77Q implements LMS-OTS-based remote authentication (NIST 800-208). This advanced method effectively prevents content tampering and misconfiguration during assembly, transportation, and configuration, protecting the platform from cyberattacks.Winbond's secure flash solutions help system manufacturers meet industry regulatory compliance requirements, improve platform security, and improve supply chain information and communication security during production, shipping, and construction and operation.To learn more about Winbond's advanced security solutions, visit Winbond's website or contact Winbond directly, or download the latest Hardware Security White Paper.To learn the latest cybersecurity regulations and trends, download the hardware security whitepaper for free.

As artificial intelligence (AI) continues to reshape industries worldwide, the demand for smarter, faster, and more efficient electronic systems has never been greater. AI-enabled applications-from data center accelerators to compact edge devices-require processing systems with exceptional computational power, high performance, and access to large memory storage.To meet these demands, the semiconductor industry is making rapid strides in advanced packaging technologies. These innovations are now central to system integration and architectural breakthroughs-yet they also introduce new challenges in reliability, thermal management, and multi-chip assembly.Material companies are transforming their offerings to meet the stringent purity, precision, and performance requirements of the evolving semiconductor industry, while also creating more sustainable and environmentally friendly products. In this exclusive interview with Mr. Kenji Kuriyama, Director of Electronics for Japan & Taiwan at Henkel Adhesive Technologies, we explore how Henkel is helping semiconductor leaders overcome these challenges through materials innovation, strategic collaboration, and a deep commitment to Taiwan's ecosystem.Mr. Kuriyama shares his optimistic outlook on the explosive growth of the advanced packaging market. In particular, Taiwan's semiconductor industry stands out as a global leader in advanced node manufacturing, producing the majority of the world's most sophisticated chips. Henkel looks forward to working closely with customers in Taiwan to accelerate the development of high-performance chips that drive AI innovation.Mr. Kenji Kuriyama Director, Japan & Taiwan, Henkel Adhesive Technologies Electronics.Credit: HenkelHenkel Adhesive Technologies' Electronics division maintains a strong and deliberate focus on both the semiconductor and consumer electronics sectors, supplying advanced materials for electronics assembly, semiconductor packaging, and thermal management. Its product portfolio includes solutions for die attach, underfills, encapsulants, lid attach adhesives, and thermal interface materials—essential components that enable the high performance, miniaturization, and reliability of modern electronic devices.Showcasing Material Solutions for AI-Enabling Advanced Packaging at SEMICON Taiwan 2025Taiwan remains a global hub for advanced packaging innovation, and at SEMICON Taiwan 2025, the spotlight is on technologies that are rapidly evolving to become the backbone of system integration and architectural breakthroughs.Henkel Adhesive Technologies Showcases a portfolio of high-performance materials, and offers tailored solutions aligned with the industry's most critical technologies. The company presents encapsulation, underfill, and adhesive materials that support high-end AI accelerators in data centers, as well as compact Edge AI chips. These devices rely on packaging architectures such as 2.5D and 3D designs, chiplet designs and heterogeneous integration to meet the demands of next-generation computing.Advanced data center AI accelerator chips and smartphone application processors require large dies and large-body packages that consume significant power during operation. As a result, they are susceptible to high stress, warpage, and thermo-mechanical challenges that can impact reliability and performance.Henkel Adhesives has developed semiconductor underfill technologies-including pre-applied pastes and films, capillary materials, and liquid molded solutions-that have set the benchmark for both performance and processability.Henkel's encapsulation technology plays a critical role in protecting large, thin dies from warpage. It also enables high-density 2.5D fan-out wafer-level packaging (WLP) and supports emerging panel-level packaging (PLP) formats-making it one of Henkel's flagship innovations.In the automotive electronics sector, Henkel offers die attach pastes and encapsulants which are widely used across the ecosystem. Its pressure-less and pressure-assisted sintering materials are instrumental in enabling high-performance wide band gap power devices that are critical for modern electric vehicles. Henkel showcases a broad range of sintering technologies, including its latest copper-based pressure-assisted sintering material. This innovation delivers exceptional thermal conductivity, requires lower processing pressure and temperature compared to silver-based alternatives, and offers a lower total cost of ownership.Mr. Kenji Kuriyama presenting at Henkel seminar and panel talk in SEMICON Taiwan 2025.New Release: Loctite Eccobond LCM 1000AG-1 -Liquid Mold Material for Warpage Control in WLP and PLP ProcessesFurthermore, as heterogeneous integration and photonic convergence become increasingly prevalent, advanced packaging technologies such as panel-level packaging (PLP) and co-packaged optics are gaining significant attention. PLP, for example, enables larger AI-enabling IC packages by improving scalability and manufacturing efficiency. However, these advancements introduce new challenges in managing the thermal demands of heterogeneously integrated devices-particularly in data center and smartphone applications-as well as in optimizing materials that interface directly with IC chips. A range of advanced materials-including liquid molded underfills (LMUF), first-level thermal interface materials (TIMs), and capillary underfills-are being developed to effectively distribute and extract heat, thereby enhancing device performance and reliability. Notably, the rise of advanced AI processors with stacked memory architectures has driven strong demand for molded underfill materials that address key challenges in 3D stacking and assembly, such as manufacturing throughput, process complexity, and overall cost.Meanwhile, Henkel is introducing new innovations in fine-filler liquid compression molding (LCM) and molded underfill materials to support both near-term and long-term roadmaps for 2.5D and 3D packaging. These materials are designed to mitigate warpage while demonstrating excellent flowability and void-free filling capabilities at the wafer level, even in fine-pitch (<30 µm) and narrow-gap (<20 µm) configurations.At SEMICON Taiwan 2025, Henkel launches Loctite Eccobond LCM 1000AG-1 , a new anhydride-free, ultra-low warpage liquid molding material designed for wafer-level packaging (WLP) and panel-level packaging (PLP) processes. This new product delivers stable warpage control throughout redistribution layer (RDL) processing, enabling high-yield, reliable advanced packaging solutions.Working with Customers to Enable Materials for Next-Gen Semiconductor DevicesAdvanced packaging is rapidly emerging as a key driver of innovation in semiconductor technology, enabling breakthroughs in system integration, performance, and sustainability. As an innovator in the advanced packaging materials space, Henkel is actively collaborating with Taiwan's leading industrial customers across critical areas-including new material design, customer support, green energy, and sustainable development.This type of collaboration facilitates the sharing of knowledge, resources, and technology, accelerates global competitiveness, and ultimately achieves a win-win for more markets-helping to grow the global semiconductor industry. Henkel is committed to investing resources in solution design tailored to specific functions and maintaining long-term relationships with its customers.Mr. Kuriyama shares two use cases that demonstrate strong momentum in customer collaborations in Taiwan. The first example is thermal cycle reliability for application processor chips. A customer approached Henkel to help pass thermal cycle reliability testing for an end customer's application processor. The challenge extended beyond reliability-it required enhanced processability for high-throughput production. Henkel responded by investing resources and developing new materials to meet the target and support the customer's goals.Among the two cases, the second example focuses on underfill flow speed optimization. In this case, a customer was facing production bottlenecks due to the slow flow speed of their existing underfill material. Henkel stepped in to assess the specific requirements and engineered a faster-flowing underfill solution to replace the legacy product. This not only resolved the throughput issue but also significantly improved overall production efficiency. The case is well-articulated, outcome-driven, and demonstrates Henkel's ability to deliver tailored, high-performance solutions in advanced packaging.The timelines for joint development projects vary significantly depending on the scope of work. Projects involving complex advancements-such as new process development or complete material replacement-can take two to three years. In contrast, initiatives focused on optimizing existing processes within current specifications are much faster, with development cycles of just three to six months.In Taiwan, IC design houses, semiconductor foundries, and Outsourced Semiconductor Assembly and Test (OSAT) providers represent the three major customer types. Design houses focus on delivering new products with innovative IC chips, foundries explore novel materials for advanced packaging solutions, and OSATs emphasize manufacturing capabilities. Once a new material is introduced, Henkel's Taiwan-based application engineering and sales teams work closely with all customer types to ensure the material's functionality meets their specific requirements.Henkel Provides Next-Level Support to Build Strategic Partnerships with Taiwan CustomersAs semiconductor advanced packaging technologies continue to evolve, new opportunities are emerging across Co-Packaged Optics (CPO), panel-level packaging (PLP), and other next-generation formats. These innovations are reshaping how chips are integrated, aligned, and scaled for high-performance applications.Taking CPO as an example, Mr. Kuriyama highlights it as a rising application in advanced semiconductor packaging. Henkel is developing light-pass adhesive materials to address the challenge of precise active alignment for optical components. These light-curing adhesives enable accurate alignment, supporting the assembly of complex optical systems within the CPO process.Henkel Adhesives continues to invest heavily in material innovation and deepen its understanding of the evolving needs of the semiconductor and electronic materials markets. It is aligning its solutions with customers' technology roadmaps and contributing to the development of next-generation products. To fulfill these needs, the Henkel Taiwan Electronics Adhesives Technical Center in Zhubei City provides prompt technical support and fosters collaboration with Taiwan customers to accelerate prototyping and development. This Technical Center is dedicated to supporting innovation and product development through faster application simulation, data generation, and analysis—ultimately speeding up time-to-market for advanced packaging technologies.As the industry shifts from a linear supply chain to a more integrated and collaborative ecosystem, Henkel Adhesives plans to strengthen its local support for Taiwan's semiconductor sector. This includes expanding beyond its application center by establishing local R&D resources and a satellite R&D office in Taiwan to provide direct, localized support. This strategic move will strengthen customer partnerships and accelerate the development of packaging technologies critical for AI chip innovation and the broader semiconductor ecosystem."Taiwan is a leading global center for advanced semiconductor process nodes and packaging innovations," Mr. Kuriyama concludes. "Through Henkel's dedicated support teams and close partnerships with customers, Henkel Adhesives is strongly committed to the Taiwan market and will contribute to technical breakthroughs that open a new frontier in advanced semiconductor packaging."To learn more about Henkel and its advanced packaging solutions, visit the official Henkel website or official LinkedIn for more information.

Smiths Interconnect, a leading provider of innovative solutions for critical semiconductor test applications, and a business of Smiths Group, is pleased to announce that its patented, state-of-the-art DaVinci Gen V test sockets have been selected as the exclusive test socket solution by a major global provider of high-performance artificial intelligence semiconductor chips.Credit: Smiths InterconnectThis strategic contract supports the customer's upcoming global launch of their next-generation AI semiconductor chips, designed for data center GPU applications. These GPUs are engineered to accelerate deep learning, artificial neural networks, and high-performance computing workloads.Smiths Interconnect's DaVinci Gen V sockets will play a critical role in the manufacturing test process, ensuring ultra-reliable and repeatable performance of the chips prior to deployment. This selection underscores the superior performance, innovation, and reliability of Smiths Interconnect's test socket technology.The award builds on a successful collaboration initiated in 2024, when Smiths Interconnect supported the customer's previous AI chip programme. This latest win marks a significant expansion of the partnership and reinforces Smiths Interconnect's position as a trusted technology partner in the semiconductor industry.Brian Mitchell, Vice President of Smiths Interconnect's semiconductor test business unit, said: "Our goal is to provide the fastest, most reliable test with the greatest precision, to meet the demands of semiconductor manufacturers in a fast-moving technological environment. We are proud to grow our relationship with such a world-class company and proud that they trust us to test and validate their products which are integral to so many aspects of modern computing."Smiths Interconnect's test sockets play a critical role in testing semiconductor chips, otherwise known as 'AI chips', which are deployed in a range of areas such as automotive systems, robotics, large language models, computer gaming and 6G communications networks.As AI becomes ever more sophisticated, the need for higher processing power, speed and efficiency in computers has grown-and AI chips are essential for meeting this demand. The testing of these products to ensure reliability, repeatability and longevity, is therefore of crucial importance.

The Fourth GMIF2025 Innovation Summit (Global Memory Innovation Forum), co-hosted by Shenzhen Memory Industry Association and School of Integrated Circuits at Peking University, is scheduled to be held on September 25, 2025 in Renaissance Shenzhen Bay Hotel. GMIF2025, themed "AI Applications, Innovation Empowered", will bring together leading enterprises, technology experts, and industry leaders across the global memory industry chain to explore the evolution of storage technologies and emerging opportunities in the AI era.The Fourth GMIF2025 Innovation Summit is scheduled to be held on September 25, 2025. Credit:GMIFThe summit will feature executives and experts from School of Integrated Circuits at Peking University, Samsung Semiconductor, Sandisk, Solidigm, Silicon Motion, Maxio Technology, Intel, MediaTek, BIWIN Storage, InnoGrit, Arm, China Greatwall, Montage Technology, iFlytek, OKN Technology, GreaTech Substrates, and more than 19 other top global companies and universities. The keynotes will cover topics ranging from storage and memory technology roadmaps and market strategies to AI application practices and ecosystem collaboration, empowering innovation across AI scenarios from cloud to edge.GMIF2025 Innovation Summit Keynote Agenda - Part 1. Credit:GMIFGMIF2025 Innovation Summit Keynote Agenda - Part 2. Credit:GMIFGMIF2025 Innovation Summit Keynote Agenda - Part 3. Credit:GMIFIn the exhibition zone, over 27 exhibitors will present more than 200 innovations, spanning the entire storage ecosystem-including leading IDMs, controller vendors, solution providers, packaging and testing companies, platform providers, and AI terminal enterprises. Attendees will experience immersive interactions, gain first-hand insights into the latest industry trends, and witness the evolving global storage ecosystem landscape.Register now by clicking the link to secure your GMIF2025 pass and join global storage industry leaders in shaping the future of AI-driven innovation!For more information about GMIF, please visit.

Hybrid work is reshaping the way organizations train their people. The new reality requires a balance of efficiency and flexibility, as organizations strive to achieve easy access to learning and measurable results across groups dispersed in different locations.Flexible working models give employees greater control over where and how they learn. However, they also create challenges around consistency, engagement, and measuring results. The solution lies in a blended approach: combining online and in-person training with a corporate LMS.Training Issues in Hybrid WorkplacesConsistency remains a significant issue. Hybrid workforces include both in-office and remote employees, and both sides need the same access to learning for both to be fair and productive. Skewed opportunities can quickly ruin employee trust and retention.Disengagement is another issue. Online sessions that last extended periods tend to cause fatigue, making learning less effective.Measuring effectiveness is also a challenge. Virtually based teams complicate monitoring skill acquisition, and organizations are left solely reliant on analytics and online tests as a fair gauge of results. Without effective systems in place, organizations often offer programs that are difficult to measure, thereby limiting their long-term impact.Corporate LMS as a Central FrameworkTo address these needs, a corporate LMS can serve as the central hub for all training content. It combines live classes, self-paced resources, and microlearning modules into one blended system. This approach gives employees the flexibility to learn in ways that fit their schedules, while still keeping development aligned with company goals.A business LMS also incorporates gamification elements, interactive modules, and certification tools that retain motivation. Integration with workflow systems, such as Slack or Microsoft Teams, allows training within everyday workflows.Just as important, corporate LMS platforms provide visibility. Progress tracking makes it easier to spot skill gaps, measure outcomes, and consistently meet objectives across the workforce. But their true value goes further: connecting business strategy with individual performance. In doing so, they transform learning from a functional process into a growth driver—for employees and the organization.Opportunities in Hybrid Training ModelsDespite the challenges, hybrid work presents new opportunities for business training.One is scalability since corporate LMSs can reach employees in various locations without logistical issues. Another is customized learning paths, which are also on the rise. These paths enable employees to progress at their own pace and focus on specific skills.Dynamic access to course materials provides added flexibility. Users can access or navigate modules at will again, boosting retention. Data-driven insights through analytics add a new level of value, providing organizations with a precise understanding of training results.Beyond talent development, training has since been used to maintain organizational culture, and long-distance teams can maintain a sense of shared mission and identity.Skill-building in the Hybrid WorldHybrid work environments demand more than technical know-how. They call for a renewed focus on soft skills. Today's training programs strike that balance, offering flexibility and efficiency while nurturing the human abilities that keep teams connected.A corporate LMS plays a central role in making this possible. Online learning sessions, quizzes, and exercises bring interactivity into virtual spaces, recreating the energy of face-to-face sessions and helping counter "Zoom fatigue." Scenario-based modules and group projects encourage peer learning, turning abstract concepts into real-world behaviors.What makes this even more effective is the insight behind it. Data gathered through the LMS highlights where learners struggle and where they thrive, allowing trainers to adjust and keep people engaged.Best Practices in Hybrid Workforce TrainingA corporate LMS makes it possible to turn hybrid training into a consistent and engaging experience. The most effective programs share a few standard best practices: flexibility and modularity allow training to adapt to shifting workloads and varied schedules, so learning becomes part of the flow of work rather than a disruption. Peer-to-peer learning fosters collaboration and community, helping employees stay connected even when they're physically apart. Accessibility is prioritized, with mobile-friendly design and multilingual content ensuring every team member can access training without barriers. Certifications and recognition keep motivation high by rewarding progress and giving learners a sense of achievement.The Final OutlookThe hybrid model is here to stay, and training strategies must evolve alongside it. Centralized systems, like a corporate LMS, are now the baseline. What sets organizations apart is how they weave flexibility, personalization, and engagement into every learning experience.Corporate Training for Hybrid Workforces. Pexels

The semiconductor industry is undergoing a profound transformation, driven by the strategic integration of artificial intelligence. At SEMICON Taiwan 2025, experts from Microsoft, Advantech, and Nvidia shared insights on the sector’s rapid shift toward “Lights-Out” factories—fully automated, 24/7 operations powered by AI. This evolution is designed to tackle monumental challenges while unlocking new levels of efficiency and resilience.AI Models Evolve for Deeper InsightsAI development has accelerated dramatically in recent years. From early domain-specific models for tasks such as entity recognition or computer vision, AI has advanced into sophisticated multi-domain models that integrate diverse functionalities within a single framework. Notable advancements include Retrieval-Augmented Generation (RAG), which constrains responses for greater accuracy, and multimodal models that seamlessly combine text, audio, and visual inputs.A pivotal breakthrough has been the emergence of reasoning models, capable of delivering deeper insights for complex problems across scientific, mathematical, and manufacturing domains. These models provide richer and more comprehensive analyses compared with their predecessors. Beyond individual models, multi-agent systems are now automating entire workflows, enabling specialized AI agents to collaborate on intricate challenges. One example is Toyota’s “obeya agent,” which integrates multiple sub-agents to assist powertrain engineers in analyzing vast datasets.According to Saj Kumar K, Senior Director of Manufacturing (APAC) at Microsoft, these advanced AI models are already being applied to manufacturing. The Production Copilot functions as a factory agent, analyzing data to identify root causes of downtime and optimize maintenance schedules. The Quality Advisor leverages multimodal AI for visual inspection and defect analysis, potentially rendering traditional image labeling obsolete. AI is also being used to optimize fab scheduling and Automated Material Handling Systems (AMHS), improving overall cycle times. Furthermore, large language models (LLMs) are training humanoid robots to perform complex tasks through single-shot teaching.Advantech’s Edge AI Strategy Targets Speed and PrecisionSemiconductor manufacturing faces unique pressures, particularly from the massive scale of data generated. A single wafer inspection can produce up to seven petabytes of data, requiring enormous computational power and real-time processing. The transition from single-beam to multi-beam inspection demands a tenfold increase in computational speed today, with projections of a hundredfold increase by 2030. Combined with the need for instantaneous data transfer and ultra-low latency to prevent defects, these requirements are driving a shift away from traditional data centers toward powerful edge computing solutions. Meanwhile, global labor shortages and skill gaps are accelerating the need for advanced automation.Advantech is at the forefront of this transformation with a comprehensive Edge AI strategy focused on process optimization, inspection, and fab automation. "Inspection is the heart of semiconductor manufacturers," said Magic Pao, Vice President at Advantech. The company’s strategy is built on four pillars: high computing power, high throughput, low latency, and robust local storage for analytics.Advantech is spearheading this transformation with a comprehensive Edge AI strategy focused on process optimization, inspection, and fab automation. “Inspection is the heart of semiconductor manufacturing,” said Magic Pao, Vice President at Advantech. The company’s approach is built on four pillars: high computing power, high throughput, low latency, and robust local storage for analytics.To achieve this, Advantech embeds AI into every element of its solutions, including products such as SkyRack and the MIC-7000/7500 industrial servers with direct-liquid cooling, both carrying critical SEMI certifications for fab deployment. High-speed connectivity is ensured through Time-Sensitive Networking (TSN) and industrial-grade switches. AI-powered vision systems—incorporating smart cameras with Nvidia GPU acceleration and FPGA-based technology—are central to the precision required for inspection. Advantech also emphasizes ecosystem strength, partnering with Nvidia for advanced computing and Intel for reliable system integration.Nvidia’s Physical AI Drives Industrial AutonomyNvidia is at the forefront of a new industrial revolution, evolving from a chipmaker into an “infrastructure company” advancing Physical AI. This strategy seeks to create “AI factories” that power advanced applications. Andrew Liu, Senior Manager at Nvidia, explained that this vision rests on two pillars: advanced foundation models for robotics and sophisticated simulation environments.Nvidia is developing powerful Vision-Language-Action (VLA) models that enable robots to interpret high-level prompts and images, translating them into precise physical actions and learning from observation or single-shot teaching. To address the scarcity of real-world robotics data, Nvidia relies heavily on its Omniverse platform for digital twins and simulation. Omniverse provides physically accurate, photorealistic virtual environments where synthetic data can be generated and robots can be trained and validated. This approach helps alleviate labor shortages and enables rapid “factory cloning” to mitigate geographic supply chain risks. Nvidia’s integrated platform spans systems for training foundation models, servers for Omniverse digital twins, and embedded platforms for industrial robot deployment.Toward the Lights-Out FutureThe convergence of advanced AI models, strategic infrastructure, and targeted edge solutions is accelerating the path toward fully automated “Lights-Out” semiconductor manufacturing, promising significant gains in productivity, efficiency, and resilience that will redefine the industry’s future. At SEMICON Taiwan 2025, the AI Technology Zone (advised by the International Trade Administration) underscores this transformation by showcasing the full AI ecosystem—from chip manufacturing and IC design to dedicated hardware.As part of its broader focus on AI innovation, SEMICON Taiwan 2025 also features the AI Technology Zone, advised by the International Trade Administration, underscores the transformation by showcasing the full AI ecosystem, from chip manufacturing and IC design to dedicated hardware. The zone brings together global innovators and industry leaders, providing a platform to foster collaboration and accelerate AI adoption across the semiconductor value chain.SEMICON Taiwan 2025 Smart Manufacturing Forum. SEMI

As the semiconductor market accelerates toward an estimated US$1.3 trillion valuation by 2030, industry leaders are converging on a shared vision. AI is ushering in an era of unprecedented growth and technological transformation.At the CEO Summit 2025, organized by SEMI, thought leaders from Infineon, NXP, Google,DENSO     , Tenstorrent, and ASE gathered to discuss the critical role of power in enabling AI, the opportunities and challenges semiconductors bring across applications—from data centers to edge computing—and the importance of global collaboration across the ecosystem.In their inaugural speeches in Taiwan, the CEOs of Infineon and NXP delivered a unified message on the future of AI. Both leaders underscored a critical and often overlooked point: power is the foundational element driving the next wave of AI computing performance. Their presence also underscored Taiwan’s strategic importance within the global technology ecosystem.Infineon Technologies CEO Jochen Hanebeck highlighted that AI’s power demand is becoming a fundamental bottleneck. Without sufficient power, the challenge extends beyond generation to the infrastructure needed to deliver electricity from the grid to the processing core. Ultimately, he warned, society may be unable to enjoy the full convenience and progress AI promises.NXP Semiconductors CEO Kurt Sievers echoed this sentiment, emphasizing that AI’s power demands extend well beyond data centers into "physical AI" applications such as autonomous vehicles and humanoid robots. This shift, he explained, is fueling rapid growth in edge AI. When AI interacts with the physical world, factors such as bandwidth, energy efficiency, latency, and trust become paramount. Consequently, these complex systems require advanced architectures with sophisticated power management for critical functions such as motor control and sensor integration.Sievers further elaborated on this concept, referring to it as "attending A", which he believes will enable truly autonomous machines. He stressed the industry’s immense responsibility to ensure these technologies are developed responsibly for the benefit of humanity, remarking: "We all share quite some responsibility to do this right for the better of humankind." He explained that intelligent systems consist of multiple "agents" that must be carefully orchestrated and enabled to work in harmony.Dr. Hirotsugu Takeuchi, CTO of DENSO     , shared insights on how semiconductors are transforming mobility. He outlined the requirements of automotive applications and the need for new SoCs to power the rise of Software-Defined Vehicles (SDVs). He pointed to the breakthrough of SiC technology as a key enabler of a sustainable, carbon-neutral society. Takeuchi emphasized that semiconductors will drive safer, more comfortable mobility and that collaboration with Taiwan and the broader global network will be essential to the future of the automotive industry.Rehan Sheikh, Vice President of Global Silicon Chip Technology & Manufacturing at Google Cloud, noted that demand for AI compute is growing exponentially. He highlighted that AI inference volume doubled in the past year, with Google’s internal data showing a 50-fold increase in monthly processed tokens across its services. Sheikh introduced Google’s latest TPU, Ironwood—a powerful, energy-efficient chip specifically designed for large-scale inference workloads. It represents Google’s first TPU purpose-built to balance high performance with power efficiency in meeting the demands of the AI boom.Jim Keller, veteran chip architect and CEO of Tenstorrent, emphasized his mission to champion open-source architectures and foster a spirit of global collaboration at a time when AI computing is becoming increasingly complex and costly. Keller explained that Tenstorrent aims to democratize high-end AI computing, making it more accessible, faster, and more open. The company’s strategy rests on three pillars: RISC-V, OpenAI, and a unified software stack. At the heart of this approach is a commitment to open standards and collaborative development, challenging the industry's traditionally closed ecosystems.During the fireside chat, speakers reflected on Taiwan's evolving role in the global semiconductor landscape. Long established as a manufacturing hub for logic chips, Taiwan is now emerging as the ideal platform for integrating diverse technologies and solving system-level challenges, thanks to its mature ecosystem, advanced packaging capabilities, and open-minded approach. Executives from Infineon, NXP, and Tenstorrent all stressed that no single company or region can address these challenges alone. The future of the industry, they agreed, depends on deep cooperation across sectors and geographies, combining expertise in areas ranging from high-performance computing to power and sensing technologies.In closing, ASE CEO Dr. Tien Wu referenced A Chip Odyssey, Taiwan’s first documentary film spotlighting its globally leading semiconductor industry. He described the film as a powerful reminder to both senior leaders and younger generations to maintain confidence in the steady progress of semiconductor development.The film chronicles Taiwan’s journey from humble beginnings to its emergence as a critical player in the global industry. Dr. Wu shared that he was deeply moved by the story of two generations of talent—each bringing vision, diligence, and leadership—who together created a lasting legacy. He extended this reflection beyond Taiwan, noting that the United States, Japan, Korea, and Europe have each experienced their own “chip odysseys.” This, he emphasized, illustrates that Taiwan's story is part of a larger global network of interdependence, where collective collaboration produces outcomes greater than the sum of individual contributions. Tenstorrent CEO Jim Keller champions open-source architectures and global collaboration to democratize AI computing. DIGITIMES