CONNECT WITH US
Tuesday 23 June 2026
The AI Power Boom, LITEON embraces opportunities for rapid development
LITEON Technology is actively capitalizing on the AI boom by restructuring its data center infrastructure around megawatt-scale power, rack and liquid cooling. The company has developed high-density 800 VDC power architectures and advanced cooling systems to support massive, next-generation AI accelerators.
Tuesday 23 June 2026
Clientron Partners with Parallels to Modernize Digital Workspaces in Asia
Clientron, a premier global provider of smart endpoint solutions, today announced a strategic partnership with Parallels, a global leader in cross-platform and virtualization solutions...
Thursday 18 June 2026
Nuvoton partners Qualcomm to advance tethered XR glass SoC business
Nuvoton Technology Corporation announced that it has agreed to collaborate with Qualcomm Technologies, Inc. on system-on-chip (SoC) products primarily targeting tethered XR Glass applications...
Thursday 18 June 2026
Cincoze showcases Edge AI and Automation at Automate 2026.
Rugged edge computing brand – Cincoze will participate in Automate 2026 in Chicago, USA, from June 22–25 (Booth #861)...
Thursday 18 June 2026
SK hynix Ships Samples of 12-Layer Next-Gen 'HBM4E'
SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has shipped samples of HBM4E, a next-generation DRAM for AI, to major customers.
Monday 15 June 2026
ACCM Solves AI Chip Warpage and Signal Loss with Celeritas
Advanced Chip and Circuit Materials today announces the commercial availability of Celeritas HM50 and Celeritas HM001, which eliminate the root causes of warpage, package bow, solder fatigue, and high-frequency signal loss in large-format AI accelerators and advanced chip packaging architectures...
Friday 12 June 2026
Overcoming the High-Speed Semiconductor Testing Challenge
As artificial intelligence (AI) becomes increasingly sophisticated, the demand for higher processing power, speed and efficiency in computing has surged. Next-generation technologies, from enterprise data centers (EDCs) and AI PCs to the Internet of Things (IoT) and 6G communications, require unprecedented bandwidth...
Thursday 11 June 2026
DATOTEK Showcases Sustainable AI Storage at COMPUTEX 2026
DATOTEK INTERNATIONAL CO., LTD., a Taiwan-based memory and storage manufacturer, showcased its latest AI-powered sustainable storage solutions and AI infrastructure technologies at COMPUTEX 2026 in Taipei under the exhibition theme "AI Together." The company presented a comprehensive portfolio of AI storage, edge AI computing, PCIe Gen5 SSD thermal management, USB4 portable SSDs, and...
Thursday 11 June 2026
Cincoze to Showcase Comprehensive Edge AI Solutions at Computex 2026
Rugged edge computing brand – Cincoze will showcase its latest embedded computing solutions at COMPUTEX Taipei 2026, from June 2–5 (Hall 2, Booth Q0401a)...
Wednesday 10 June 2026
Empowering innovation: Female engineers rise in Taiwan's semiconductor industry
The global semiconductor industry is undergoing profound transformation-not only in process technologies and transistor density, but also in the composition of its workforce. Taiwan, the undisputed center of advanced semiconductor manufacturing, is increasingly attracting a new generation of technical talent: female engineers...