Notebook ODMs enjoyed stronger-than-seasonal demand in the first half of 2026, but the traditional peak season is losing momentum. Shipments are expected to decline sequentially from the third quarter, while component suppliers increasingly view 2026 as a turning point in the global notebook supply chain.
As the world enters an AI-centric era, the global race for technological leadership is no longer defined only by who can build the most advanced models. It is increasingly shaped by who can secure compute, deploy infrastructure at scale, reduce energy constraints, and turn research into commercial capability.
Trans-Sun Materials Technology posted record revenue for June, the second quarter and the first half of 2026, supported by rising demand for AI servers and high-performance computing (HPC) applications. June consolidated revenue rose 40.83% year on year to NT$163 million (US$5.43 million), second-quarter revenue increased 28.22% to NT$441 million, and first-half revenue climbed 28.43% to NT$820 million, all record highs for their respective periods.
Apple is reshaping its Mac chip roadmap to prioritize AI, accelerating development of future processors as the company seeks to strengthen its position in the AI era.
AI demand is still outrunning advanced semiconductor capacity, putting foundry output, HBM supply, packaging and server infrastructure at the centre of this week's tech agenda.
India is moving from semiconductor planning to execution, using funding, tariff changes, foreign investment approvals, and regional development efforts to build a broader electronics ecosystem beyond assembly.
As the world enters an AI-centric era, the global race for technological leadership is no longer defined only by who can build the most advanced models. It is increasingly shaped by who can secure compute, deploy infrastructure at scale, reduce energy constraints, and turn research into commercial capability.
