中文網
Taipei
Tue, Jun 15, 2021
21:37
mostly cloudy
29°C
CONNECT WITH US
TSMC sees CoWoS packaging capacity utilization ramp up
Julian Ho, Taipei; Jessie Shen, DIGITIMES 0

TSMC has seen utilization of its chip-on-wafer-on-substrate (CoWoS) packaging capacity rise substantially in the second quarter of 2020, and now runs the packaging production lines at full utilization, according to industry sources.

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Related stories