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TSMC sees CoWoS packaging capacity utilization ramp up

Julian Ho, Taipei; Jessie Shen, DIGITIMES Asia Thursday 9 April 2020 0

TSMC has seen utilization of its chip-on-wafer-on-substrate (CoWoS) packaging capacity rise substantially in the second quarter of 2020, and now runs the packaging production lines at full utilization, according to industry sources.

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