Hanmi Semiconductor has increased the price of its thermal compression bonder (TC Bonder; TCB), a critical piece of equipment for high-bandwidth memory (HBM) production, by 25% starting...
Hiroshi Kawamoto, Division Officer, Finance Division of Tokyo Electron Limited (TEL), one of Japan's leading semiconductor equipment manufacturers, projects that demand for high-bandwidth...
SK Hynix announced during its 77th shareholders' meeting that it will determine product volume for its high bandwidth memory (HBM) lineup in the first half of 2025. CEO Noh-Jung Kwak...
As the memory chip market re-enters a favorable cycle, industry forecasts predict that Samsung Electronics and SK Hynix's operating profits in 2025 could surge by 40% compared to...
According to Counterpoint Research, robust HBM DRAM memory demand and a surge in advanced logic/foundry momentum in the latter half of 2024 propelled a 9% year-over-year growth in...
SK Hynix is reportedly accelerating equipment installation at its M15X fab in Cheongju, South Korea, moving the original timeline forward from December to October in response to surging...
Nvidia CEO Jensen Huang visited the Samsung Electronics booth at GTC 2025 on March 20, Pacific Time, where he left a signature including the words "Samsung," "GDDR7 rocks!" and "RTX...
Micron's strong second-quarter earnings, driven by surging data center and HBM demand, signal a memory market recovery. Exceeding revenue estimates and forecasting continued growth,...
Micron's HBM revenue exceeded US$1 billion this quarter. The company expects multibillion-dollar HBM revenue by 2025 and plans to start HBM4 production in 2026 while expanding capacity...
Samsung Electronics' fifth-generation HBM3E received satisfactory scores during Nvidia's recent audit and is expected to pass Nvidia's quality certification as early as June, according...
Samsung Electronics Co. pledged to strengthen its position in the high-bandwidth memory (HBM) chip market this year, in response to shareholder criticism over its underperformance...
SK Hynix announced on March 19 that it has begun delivering early samples of its new 12-layer HBM4 ultra-high performance DRAM for AI applications to key clients.
SK Hynix Inc. (or "the company") announced today that it has shipped the samples of 12-layer HBM4, a new ultra-high performance DRAM for AI, to major customers for the first time...
Samsung Electronics Chairman Lee Jae-yong has reportedly issued a blunt warning to top executives, acknowledging that the company is at a make-or-break moment. In a pre-recorded video...
