The South Korea-US summit offered a rare gathering of tech heavyweights, as Nvidia CEO Jensen Huang met with Samsung Electronics Chairman Lee Jae-yong and SK Group Chairman Chey Tae-won...
South Korean media reports suggest Nvidia plans to complete final qualification tests for sixth-generation high-bandwidth memory (HBM4) in the first quarter of 2026, a milestone that...
Huawei will debut its self-developed artificial intelligence (AI) solid-state drive on August 27 at its Lianqiu Lake R&D Center. The company said the device is designed to address...
Intel is reportedly leveraging its 2nm Intel Foundry process to develop artificial intelligence (AI) semiconductors, positioning itself to compete against industry leaders such as...
High bandwidth memory (HBM) has reshaped the global DRAM industry landscape, fueled by a surge in AI demand over the past three years. Nvidia's next-generation AI accelerator "Rubin"...
Nvidia executives have reportedly urged Samsung Electronics to prioritize production of sixth-generation high-bandwidth memory (HBM4) rather than fifth-generation 12-layer HBM3 during...
SK Hynix Inc.'s Chief Development Officer, Hyun Ahn, described the day the company became the leading global DRAM supplier as the happiest of his career. The milestone, achieved in...
Samsung Electronics' sixth-generation high-bandwidth memory (HBM4), delivered to Nvidia in July 2025, has reportedly cleared reliability testing, positioning it for pre-production...
Micron has struck a confident tone in the race for high-bandwidth memory, announcing that all of its 2026 production has already been committed to customers. Chief Business Officer...
The high-bandwidth memory (HBM) supply landscape for Nvidia is expected to experience significant changes in 2026. Currently, about 90% of Nvidia's HBM is supplied by SK Hynix, but...
Samsung Electronics Executive Chairman Lee Jae-yong returned to South Korea this week after more than two weeks in the US, telling reporters at the airport he was "ready for 2026."...
With Moore's Law losing momentum, advanced packaging has become the industry's next significant lever to drive performance gains. At the center of this race is hybrid bonding, widely...
The global race to build ever-larger AI models is intensifying, and the battle is no longer confined to Nvidia's powerful GPUs. Another crucial, though less visible, component has...
Driven by the booming demand for artificial intelligence (AI) servers, high-bandwidth memory (HBM) has become a key factor reshaping the memory industry landscape. Micron recently...
