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NEWS TAGGED HBM
Friday 20 December 2024
SK Hynix lands US$458 million CHIPS Act grant
The US Department of Commerce has awarded SK Hynix a grant of up to US$458 million under the CHIPS and Science Act (CHIPS Act), supporting the company's efforts to strengthen the...
Thursday 19 December 2024
Micron sees data center-driven record sales, but guidance disappoints
Micron Technology reported record fiscal first-quarter revenue driven by data center SSD sales, which now represent over half of total revenue. While HBM shipments doubled quarter...
Thursday 19 December 2024
Micron is optimistic about HBM demand and AI growth despite market challenges
After revealing the latest financial results, Micron held an earnings call, discussing the recovery paces across markets. The company is optimistic about the demand for HBM as it...
Wednesday 18 December 2024
US tightened chip controls put Samsung's China operations at risk
The US Department of Commerce's Bureau of Industry and Security (BIS) has expanded semiconductor export controls to include high bandwidth memory (HBM), a crucial component for artificial...
Tuesday 17 December 2024
Biden's bow-out embargo expose glaring gaps in China's HBM localization
The surging AI market has driven unprecedented demand for high-bandwidth memory (HBM), placing significant strain on supply chains. In early August, reports surfaced that the Biden...
Monday 16 December 2024
SK Hynix reportedly eyes advanced IC packaging expansion with HBM expertise
According to ET News, SK Hynix is setting its sights on the semiconductor packaging market by offering packaging foundry services, a move that analysts say capitalizes on...
Monday 16 December 2024
US tightens AI chip export rules, targets Southeast Asia as China's GPU smuggling hub
The Biden Administration is expected to unveil new regulations by the end of the year, targeting China's acquisition of advanced AI chips through third-party nations. These measures...
Friday 13 December 2024
Samsung reportedly reassigns 2,000 engineers to Pyeongtaek in a bid to overcome HBM challenges
Samsung Electronics has reportedly initiated a large-scale personnel reshuffle, reallocating engineers to its next-generation semiconductor hub in Pyeongtaek. However, the company...
Tuesday 10 December 2024
SK Hynix restructures CIS organization seemingly to replicate HBM success model
Despite the low profitability of SK Hynix's CMOS image sensor (CIS) business, the company has decided to retain this segment and reorganize its CIS development team under the Future...
Tuesday 10 December 2024
Japanese intervention reportedly keeps China's CXMT off US entity list
Japan reportedly played a crucial role in keeping Chinese memory maker ChangXin Memory Technologies (CXMT) off the recently updated US Entity List, according to sources from China's...
Monday 9 December 2024
SK Hynix restructures organization, appoints new CDO to strengthen AI memory leadership
SK Hynix has announced a major organizational restructuring and executive appointments, highlighted by the creation of a new chief development officer (CDO) position to oversee DRAM...
Friday 6 December 2024
South Korea downplays the impact of US' HBM export control
The South Korean government has assured that the Biden administration's latest semiconductor control measures against China, including restrictions on high bandwidth memory (HBM)...
Wednesday 4 December 2024
China to accelerate HBM self-sufficiency leaving DDR5 with turbulence
The latest wave of export restrictions from the US on High Bandwidth Memory (HBM), particularly targeting advanced technologies such as HBM2 and above, is set to compel China's memory...
Wednesday 4 December 2024
Why CXMT escapes new series of US sanctions
The new US export restrictions on China do not include ChangXin Memory Technologies (CXMT), which has sparked discussions among industry observers regarding how the key Chinese memory...
Wednesday 4 December 2024
Samsung and SK Hynix collaborate to promote LPDDR6-PIM standardization
Samsung Electronics and SK Hynix, while competing in memory development for artificial intelligence (AI), have agreed to collaborate on accelerating technology standardization.