Micron is expanding its investment in Taiwan, with plans to exceed NT$1.1 trillion (US$33.6 billion) by the end of 2024. According to Donghui Lu, head of Micron Taiwan, the company...
As Samsung Electronics (Samsung) attempts to reshape the global memory market through its sixth-generation high bandwidth memory (HBM4), industry watchers are closely monitoring two...
Backend house Powertech Technology (PTI) anticipates a resurgence in demand from the memory sector beginning in the second quarter, with further enhancement projected through the...
Industry sources indicate that thermal issues associated with GB200 have prompted major clients including Microsoft, Amazon, Google, and Meta to reduce their orders, impacting not...
Samsung Electronics has reportedly delayed the development of its 10nm sixth-generation 1c DRAM to June 2025. Initially slated for completion by late 2024, the timeline has been pushed...
At CES 2025, Nvidia CEO Jensen Huang stated that Samsung Electronics (Samsung) must develop a "new design" to pass Nvidia's qualification, sparking discussions about whether Samsung...
New players are joining the supply chain competition as China's major memory chip manufacturers have rapidly developed. It seems to challenge the market positions of Samsung Electronics,...
Recently, South Korean testing equipment provider Nextin is reportedly in discussions to supply testing equipment to Japanese NAND Flash manufacturer Kioxia. If the negotiations work...
Global memory leaders Samsung, SK Hynix, and ChangXin Memory Technologies (CXMT) are ramping up DRAM production this year, fueling market competition. While oversupply is expected...
Memory chip prices are anticipated to face downward pressure in 2025, also posing challenges for large companies like Samsung, according to market sources.
At CES 2025, Nvidia CEO Jensen Huang publicly addressed challenges regarding Samsung Electronics' HBM3E memory design, marking his first explicit acknowledgment of the issues that...
Micron Technology initiated construction on Wednesday (January 8, 2025) of a new High-Bandwidth Memory (HBM) advanced packaging facility adjacent to its existing facilities in Sing...
While the US semiconductor revival extends beyond Intel's prominent efforts, it critically depends on Micron, the country's sole memory chip manufacturer, expanding its domestic production...
