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NEWS TAGGED HBM
Wednesday 8 January 2025
Samsung preliminary results fall short of expectations
Samsung reported mixed financial results, with fourth quarter 2024 revenue of KRW75 trillion (US$51.26 billion) showing growth amid an operating profit decline, impacted by weak mobile...
Wednesday 8 January 2025
Micron breaks ground on new HBM advanced packaging facility in Singapore
Micron Technology initiated construction on Wednesday (January 8, 2025) of a new High-Bandwidth Memory (HBM) advanced packaging facility adjacent to its existing facilities in Sing...
Tuesday 7 January 2025
US govt boosts Micron's automotive and defense DRAM production as major players exit niche market
While the US semiconductor revival extends beyond Intel's prominent efforts, it critically depends on Micron, the country's sole memory chip manufacturer, expanding its domestic production...
Tuesday 7 January 2025
South Korea shifts chip exports away from China as Taiwan, US market surge
South Korea's semiconductor industry is rapidly diversifying its export destinations away from China, with Taiwan and the US emerging as increasingly important markets amid ongoing...
Monday 6 January 2025
TEL CEO: AI to dominate 70% of global semiconductor market by 2030
Tokyo Electron Limited (TEL) forecasts the global semiconductor market will surpass US$1 trillion by 2030, with AI-related semiconductors driving 70% of the growth. To seize this...
Friday 3 January 2025
SK Hynix to unveil 'full stack AI memory provider' vision at CES 2025
SK Hynix (or "the company") announced today that it will showcase its innovative AI memory technologies at CES 2025, to be held in Las Vegas from January 7 to 10 (local time).
Friday 3 January 2025
Generic memory slump to persist through 2025 as China's capacity expansion becomes a key factor
South Korea's memory sector faces a slump in the generic memory market due to weakening demand in smartphones and PCs, contrasting with the strong growth of high-bandwidth memory...
Thursday 2 January 2025
Samsung kickoff advanced packaging supply chain overhaul with equipment shakeup
Samsung Electronics has launched a comprehensive overhaul of its advanced packaging supply chain, focusing on "reassessing" materials, components, and equipment to boost competitiveness...
Thursday 2 January 2025
Samsung bets on high-value memory to counter CXMT amid DRAM slump
Samsung Electronics' Device Solutions (DS) division is revising its production strategy as falling DRAM prices and weak IT demand weigh on profits. South Korean securities firms have...
Thursday 26 December 2024
HBM4 race heats up among memory giants: customization and DRAM scaling at the crux
Micron is aggressively expanding its footprint in the high-bandwidth memory market, capitalizing on surging AI chip demand to accelerate growth. Backing this expansion, the company...
Wednesday 25 December 2024
SK Hynix prepares for mass production of 16-layer HBM3E amid intensifying competition
As competition in the high bandwidth memory (HBM) market escalates, SK Hynix is on track to begin mass production of its 16-layer HBM3E products as planned. The significance of this...
Wednesday 25 December 2024
TEL targets 40% AI equipment revenue amid waning China demand
Tokyo Electron (TEL) aims to increase its revenue share from AI-related semiconductor equipment to approximately 40% by the fiscal year ending March 2026, up from the current 30%...
Tuesday 24 December 2024
SK Hynix clinches major HBM deal with Broadcom
As Broadcom strengthens its position in AI chip development through partnerships with industry giants like Apple and Google, the company has now secured a significant high-bandwidth...
Monday 23 December 2024
Micron forecasts slump in general-purpose memory, casting doubts on Samsung, SK Hynix
Micron has released its first-quarter fiscal 2025 (1QFY25, ending November 28, 2024) financial results, highlighting strong performance in its HBM segment. However, a weaker-than-expected...
Monday 23 December 2024
Nanya to invest NT$6.6bn in DRAM design firm PieceMakers for AI memory solutions
Nanya Technology has greenlit a strategic alliance with DRAM design firm PieceMakers Technology, committing up to NT$6.6 billion (US$1.5 million) in a cash capital increase to secure...