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NEWS TAGGED HBM
Friday 29 November 2024
Micron targets Samsung's home turf with 'on-the-spot hiring' to attract talent
Micron has intensified its recruitment efforts in South Korea, targeting university campuses with "on-the-spot hiring" initiatives. Previously focused on hiring experienced engineers...
Wednesday 27 November 2024
Samsung's challenges mount: Nvidia Jensen Huang urge HBM3E swift approval
Nvidia is currently conducting high bandwidth memory (HBM) verification tests with Samsung Electronics (Samsung), with industry attention focused on the validation timeline and potential...
Wednesday 27 November 2024
US sanctions threaten to snuff out China's nascent HBM development
While the US has not yet imposed sanctions on China's high-bandwidth memory (HBM) chips and manufacturing equipment, industry sources expect such restrictions are inevitable. This...
Wednesday 27 November 2024
US ban expansion may stifle China's AI chip ambitions
Market speculation suggests that the US may impose stricter restrictions on China. On November 28, it is anticipated that 200 Chinese semiconductor companies will be added to a trade...
Wednesday 27 November 2024
Samsung, SK Hynix trim DRAM output while Chinese rivals expand
SK Hynix and Samsung Electronics are focusing on upgrading equipment, transitioning processes, and expanding high-bandwidth memory (HBM) packaging capacity instead of investing in...
Tuesday 26 November 2024
Samsung's market risks, SK Hynix's fab dependence: Diverging paths to decoupling from China
South Korean media report that SK Hynix and Samsung Electronics have reduced their reliance on China over the past seven quarters. SK Hynix's China revenue dropped from 30% to 24%,...
Tuesday 26 November 2024
Korean chipmakers consider reducing LPDDR4 memory output
Korean memory vendors intend to promote LPDDR5 as the prevalent specification, which will necessitate a reduction in the output of LPDDR4 and LPDDR4X chips, according to industry...
Monday 25 November 2024
High-value demand boom: AI chips drive Samsung, SK Hynix US 2024 revenue surge
In 2024, Samsung Electronics and SK Hynix saw their US semiconductor revenue surge, driven by robust demand from AI-focused tech firms and data centers. This growth stemmed from increased...
Monday 25 November 2024
Samsung's HBM3E availability remains uncertain for Nvidia's Blackwell
During Nvidia's earnings call for the third quarter of fiscal year 2025, CEO Jensen Huang expressed gratitude to supply chain partners including TSMC and SK Hynix for their contribution...
Friday 22 November 2024
ESMT struggles with inventory backlogs, projects weak early 2025 market
Elite Semiconductor Microelectronics Technology Inc. (ESMT) expected a rebound in the memory market in the second half of 2024, driving an increase in wafer production. However, demand...
Friday 22 November 2024
HBM memory supply to scale in 2025
With the acceleration of Blackwell mass manufacturing, the capacity of HBM3E will greatly grow. According to industry estimates, after a twofold rise in HBM production in 2024, demand...
Thursday 21 November 2024
SK Hynix closes in on Samsung with NAND market share set to top 20%
SK Hynix's strategic focus on high-end NAND memory, coupled with rising AI-driven demand, is expected to push its annual market share above 20% in 2024, bringing it closer to industry...
Thursday 21 November 2024
Samsung expands Suzhou packaging investments to bolster HBM competitiveness
Samsung Electronics is bolstering its HBM competitiveness through significant investments in advanced packaging. Upgrades are underway at its Cheonan facility in South Korea, and...
Wednesday 20 November 2024
Taiwan PMIC makers struggle to gain foothold in DDR5 market
Despite making progress in DDR5 power management IC (PMIC) development over the past two years, Taiwanese suppliers have seen limited revenue growth in this sector. This limitation...
Wednesday 20 November 2024
SK Hynix accelerates US expansion with new packaging facility, strengthens ties with TSMC, Nvidia
SK Hynix has revealed plans to establish a new company in Indiana through its third quarter 2024 business report, marking a significant step toward building a semiconductor packaging...