There are reports of Samsung Electronics (Samsung) delaying the R&D of the automotive chip Exynos Auto and instead focusing on the development and mass-production of items including...
Samsung Electronics (Samsung) is not only lagging in the HBM area, but its large lead in universal DRAM also shows signs of erosion, intensifying its internal sense of crisis. There...
The surging momentum of generative AI has placed Taiwan's semiconductor supply chain at the center of the AI stage. As the industry leader, TSMC showcased its influence at SEMICON...
Taiwan-based memory chipmakers Nanya Technology, Winbond Electronics, and Macronix International, as well as fabless firms Etron Technology and Elite Semiconductor Memory Technology...
As SK Hynix and Samsung Electronics compete for dominance in high bandwidth memory (HBM), each is championing different technical solutions. Meanwhile, Samsung continues to address...
HBM4 memory will move toward integrating logic and memory processes to address greater power consumption issues and break performance constraints. Samsung Electronics and SK Hynix...
Key AI chipmaking and high-bandwidth memory (HBM) technologies will be highlighted at SEMICON Taiwan 2024, where major manufacturers will gather to present their most recent develo...
SK Hynix is making significant strides in the development of 16-layer HBM4 memory, successfully demonstrating the integration of Advanced MR-MUF technology into these products. Kangwook...
After more than a year of insight into AI models and hardware, the market has a better understanding of the upcoming bottlenecks facing cloud-based generative AI: high bandwidth memory...
Even though the third quarter is the traditional peak season for consumer electronics and other end-market applications, DRAM and NAND flash memory spot prices have decreased almost...
After Nvidia confirmed the on-schedule shipment of its latest Blackwell GPUs, high-bandwidth memory (HBM) providers, including SK Hynix and Samsung Electronics, expressed relief as...
August 28 marked the 100th day since Vice Chairman Young Hyun Jun was appointed as the new Head of the Device Solutions (DS) Division at Samsung Electronics. The South Korean industry's...
In recent years, advanced packaging has become increasingly crucial in high-performance computing, and Chinese OSAT companies, particularly Tongfu Microelectronics, are determined...
Kioxia, currently ranked third in the global NAND market, is reportedly set to go public in Japan in October 2024. The move aims to secure funds for R&D and production capacity...
