The memory industry is facing noise regarding market supply and demand imbalances. The rapid capacity expansion by Chinese memory manufacturers has raised concerns regarding its impact...
Samsung Electronics (Samsung) has confirmed delays in high bandwidth memory (HBM) supply, leading to a downward adjustment of its production target for 2025. To enhance semiconductor...
Samsung Electronics reported consolidated revenue of KRW79 trillion (about US$58.6 billion) and an operating profit of KRW9.1 trillion for the third quarter of 2024, missing market...
As general DRAM prices decline, recent forecasts indicate a divergence in the DRAM expansion strategies of Samsung Electronics (Samsung) and SK Hynix for 2025. Samsung plans on reducing...
SK Hynix recently participated in TSMC's open innovation platform (OIP) forum, where the company not only emphasized its collaboration with TSMC and Nvidia but also revealed key details...
Samsung Electronics has reported a weaker-than-expected operating profit for the third quarter of 2024, with experts attributing this shortfall to the company's lagging position in...
SK Hynix is set to diversify its supply chain for thermocompression bonding (TCB) equipment used in HBM manufacturing. The company acquired an order of 30 units of TCB machines from...
Samsung Electronics and Nvidia have reportedly completed the on-site inspection of the fifth-generation high bandwidth memory (HBM3E). Despite delays in mass production and supply,...
Reports suggest that the Chinese government is discouraging local companies from purchasing Nvidia's AI chips, which may affect Samsung Electronics' High Bandwidth Memory (HBM) sales...
In anticipation of favorable market conditions, Micron Technology will implement extensive talent recruitment initiatives in Taiwan and Japan, according to the US memory chip vendo...
SK Hynix recently spotlighted its high-bandwidth memory (HBM) technologies with great emphasis on its collaboration with Nvidia during its participation in TSMC's Open Innovation...
Presently, the enhancement of AI chips' computing power heavily depends on advanced packaging technologies such as CoWoS and HBM, with the two technologies complementing each other...
SK Hynix is expediting the development of 16-layer HBM3E (High Bandwidth Memory) to reinforce its leading position in the competitive HBM market, as challenges from rivals like Samsung...
