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TSMC may commercialize InFO_SoW for supercomputer AI chips in two years

Julian Ho, Taipei; Willis Ke, DIGITIMES Asia Monday 6 July 2020 0

TSMC, after launching 3D SoIC backend service, has also developed InFO_SoW (system-on-wafer) technology mainly for processing supercomputing AI chips and is expected to enter commercial production with the InFO-derived process within two years, according...

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