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Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan

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Credit: ficonTEC

As AI continues to accelerate demand for high-speed optical connectivity, technologies such as silicon photonics, CPO, LPO, NPO and OCS are moving rapidly toward commercial deployment. The next challenge is turning these technologies into scalable, high-yield production.

At SEMICON Taiwan 2026, September 2–4 in Taipei, ficonTEC will showcase its intelligent automation solutions at Booth R8124, highlighting how precision automation, assembly and testing can help photonics companies move from advanced technologies to volume production.

From assembly and test to intelligent manufacturing

As photonic devices become more complex and volumes increase, manufacturing requires greater precision, repeatability and throughput. ficonTEC's solutions address key stages of the process, including automated assembly, active alignment, fiber preparation and electro-optical testing, with a focus on connecting these capabilities into scalable production environments.

The company's presence at SEMICON Taiwan will focus on a key industry question: How can photonics scale at the speed required by AI?

The topic will also be explored during the Silicon Photonics Global Summit, held alongside SEMICON Taiwan.

ficonTEC's André Lalonde will present "AI Is Scaling Faster Than Test – Rethinking Wafer, Chip and Module Test for the Photonics Era," addressing the evolving requirements for wafer-,chip-and module-level testing.

On September 3, Moritz Seyfried will present "Intelligent Manufacturing for AI at Scale," examining how manufacturing intelligence can support the growing production requirements of AI-driven photonics.

Together, the exhibition and presentations highlight ficonTEC's focus on connecting assembly, test and manufacturing intelligence to help the photonics industry transition from engineering development to high-volume production.

As AI infrastructure continues to scale, the ability to manufacture photonic technologies with the required precision, yield and throughput will become increasingly important.

AI is scaling fast. Photonics must scale with it.