As Moore's Law nears its physical and commercial limits, advanced packaging has become the new battleground defining the evolution of IC substrate technology and the global PCB landscape. Henry Utsunomiya, President of Fujitsu Interconnect Technologies (FICT) under Fujitsu Limited, noted that with heterogeneous integration now the dominant approach, the industry is undergoing a crucial shift from organic to inorganic substrates

After dominating China's first wave of electric vehicle (EV) adoption, BYD is shifting its focus in 2025 from electrification to intelligent mobility. The automaker has launched what it calls a campaign for "smart driving for everyone," aiming to make autonomous driving technologies accessible to mass-market consumers

Over the past decade, China's tech sector has surged across chip design, foundry, and packaging. Yet beneath the slogan of "technological self-reliance", two corporate storms have laid bare the contradictions between global ambition and domestic control, exposing the limits of China's bid to lead the semiconductor world on its own terms