The top-4 Taiwan-based foundries - TSMC, UMC, PSMC and VIS - together generated an aggregated total revenue of US$19 billion in fourth-quarter 2021, up 6% from a quarter ago, taking their combined whole-year 2021 revenue to top US$68 billion, up 26% from a year ago.
Hybrid bonding and other new advanced assembly techniques widely used for smartphone application processors (AP) and high-performance computing (HPC) chips will continue to expand advanced packaging technologies.
Silicon (Si) semiconductor with widespread use is close to reaching the physical limits of Moore's Law and is thus being replaced by wide bandgap semiconductors of third-generation semiconductors in a growing number of applications.
Digitimes Research believes 2021 were a fruitful year for the global foundry industry thanks to strong order momentum and is optimistic about its outlook going into 2022.
Thanks to ongoing strong chip demand, the top-3 Taiwan-based foundries - TSMC, UMC and VIS - performed outstandingly in second-quarter 2021 and will see revenue climb further in the third quarter.
While there may be different views on the validity of Moore's Law, TSMC is confident that it can uphold Moore's Law as it makes smooth progress in advanced process technologies.
China's top-3 wafer foundries enjoyed an over 20% on-year growth in their combined revenues in 2020 and the amount is expected to increase further in 2021.
