As AI applications rapidly expand across PCs, mobile devices, and content creation workflows, there is a parallel surge in demand for high-resolution video, real-time generative content, and on-device inference. This transition is redefining storage within system architectures: it is no longer just a matter of capacity planning, but a critical determinant of performance, bandwidth, and reliability.To address this, AGI Technology has sharpened its strategy and will debut next-generation storage solutions at CES 2026, targeting the high-speed and usability demands of the AI era. PresidentMiranda Lee pointed out that while high specs are now "table stakes" across the market, the real differentiator going forward will be how well products adapt to real-world scenarios - and whether brands can sustain stable delivery and consistent quality.Miranda emphasized that AI is doing more than just driving capacity growth; it is fundamentally changing how data is utilized.First, edge computing and multi-task content creation are becoming the norm. This increases the frequency of data access and the need for mobility, transforming storage devices from auxiliary components into critical links in modern production workflows. Second, pricing dynamics are reshaping consumer behavior. As the cost of high-end storage and memory rises, the market is witnessing more "buy-down" purchasing and phased expansion: users tend to select mid-range configurations initially, supplementing capacity with external devices later. Third, high speed and capacity are increasingly becoming entry requirements rather than differentiators. With interfaces such as PCIe Gen4/Gen5 and USB4 continuing to advance, adhering to these specifications has become a baseline standard that all brands must meet.Consequently, AGI Technology is moving beyond differentiation through specifications alone. The company is transitioning its brand identity from a component manufacturer defined by performance metrics to a solutions provider centered on usage scenarios. This strategic realignment ensures that while AGI continues to advance speed and capacity benchmarks, it also integrates robust reliability and environmental durability into its core design philosophy. Miranda emphasizes that while performance is a baseline requirement, enhancing stability and durability addresses the practical demands of mobile and outdoor workflows. This comprehensive approach creates tangible added value for users requiring consistent performance under pressure.AGI Technology will center its CES presence around a scenario-driven strategy that prioritizes reliability and practical application. According to Miranda, CES has long served as a vital stage for showcasing AGI's technological prowess. However, the company's recent strategy emphasizes private, high-level briefings over traditional exhibit formats. By moving toward a semi-exclusive engagement model, AGI can more effectively align its product roadmap with customer needs, ultimately strengthening brand loyalty and enhancing the performance of its international channels.At CES 2026, AGI is set to translate its strategic vision into a powerhouse lineup of tangible innovations, headlined by next-generation storage solutions tailored for the AI era. Leading the charge is a 6nm PCIe Gen5 SSD capable of blistering speeds up to 11,000 MB/s. By leveraging an advanced 6nm process, AGI has significantly reduced power consumption and thermal overhead, making flagship-tier performance more accessible for real-world deployment. Complementing this is AGI’s 10,000 MT/s low-latency DDR5 RGB memory, built for the rigorous demands of AI-native platforms. Furthermore, AGI is expanding its portable portfolio with three specialized external SSDs catering to content creators, outdoor adventurers, and power users, reinforcing the brand's focus on versatile, high-speed data management.Miranda emphasized that for AGI Technology, 2026 marks more than just another hardware iteration; it represents a strategic pivot in both brand identity and operational philosophy. The company is steadily evolving from a component supplier into a user-centric storage solutions brand. While continuing to push the boundaries of PCIe and USB performance, AGI is doubling down on real-world utility - tailoring products to excel in mobility, professional content creation, and long-term data archiving.She emphasized that in an era of ubiquitous AI and high-performance computing, true value transcends raw benchmarks; it is defined by unwavering reliability when it matters most. Whether capturing a split-second extreme sports feat, a creator's unrepeatable live recording, or years of cherished family milestones, storage devices house more than just data - they safeguard irreplaceable moments. Through a commitment to durable, high-performance design, AGI Technology aims to earn user trust across every scenario, transforming their brand promise, 'Preserve Your Uniqueness,' from a slogan into a lifelong digital legacy.Project K10 DDR5 - 10,000 MT/s Overclocking Flagship.Credit: AGI TechnologyProject S10 PCIe Gen5 SSD - 11,000 MB/s Performance with TSMDC 6nm Controller.Credit: AGI TechnologyNew Series of Portable SSD – Combination of High-Speed, Durability and Capacity.Credit: AGI Technology

The recent Belgium-Taiwan Technology Night held in Taiwan highlighted the synergy between Belgian innovation and Taiwan's manufacturing strength. Building resilient supply and value chains demands leadership excellence beyond borders, precisely the philosophy behind HEC Liege's Executive Doctorate in Business Administration (EDBA), tailored for Asian executives.A European Doctorate for Asian LeadersThrough HEC Liege's EDBA, students can translate decades of executive experience into doctoral level insight, combining European academic rigor with Asia-Pacific business realities.Program Highlights1.Executive-Oriented Design: Modular delivery and blended learning accommodate busy professional schedules.2.Fully English-Taught: Courses conducted entirely in English foster diverse, cross Asian participation.3.Flexible Schedule: Structured to balance executive commitments with rigorous learning.4.Three-Year Completion: Efficient yet academically robust doctoral pathway.5.Comprehensive Support: Full academic and administrative guidance throughoutBeyond Traditional Exams.Rather than traditional doctoral qualification examination, EDBA research is validated through international conference presentations, enabling you to build academic credibility, global visibility, and thought leadership while maintaining your executive role.Why Choose HEC Liège EDBA programThe program unites diverse Asian executives under international faculty with both research expertise and executive practice experience.Key Benefits:1.Prestigious European Executive DBA.2.Research addressing real global market challenges.3.Internationally recognized faculty.4.Peer learning across diverse Asian markets.5.Practical dissertations creating immediate organizational impact.Strategic TimingJust as Belgian research excellence combines with Taiwan's technological strength, HEC Liège's EDBA merges European academic tradition with dynamic Asia-Pacific leadership demands.Your Strategic InvestmentHEC Liege EDBA transcends credentialing—it's a strategic leadership investment. Deepen strategic thinking, contribute original research, enhance professional credibility, and lead organizational transformation without career interruption.Request a confidential academic consultation to explore transforming your executive experience into a European doctoral qualification.

Gaming used to mean sitting on a couch with a controller or visiting a noisy, crowded venue. Those days are fading fast. We have moved from simple pixelated screens to massive, immersive worlds that fit right in our pockets. This shift is not just about better graphics-it is about a fundamental change in how we interact with the games we love.Access RedefinedAccess is the biggest difference. No longer do players need to plan a trip or wait for a machine to open up. Many locals in the Sunshine State now prefer exploring Florida's casinos to explore online rather than dealing with the drive to a physical location. The same trend is emerging across countless regions worldwide.Online platforms offer distinct advantages that physical venues struggle to match. They host massive game libraries - often thousands of titles - ensuring players never run out of new experiences. Flexible banking options, including instant crypto withdrawals, deliver winnings in minutes rather than days. And unmatched privacy allows users to play from the comfort of home without anyone looking over their shoulder.Connectivity as the EngineThe rollout of high-speed networks has eliminated the lag that once made mobile gaming a nightmare. In the past, a dropped connection meant losing a ranked match or failing a team objective. That is changing fast. Today, 45% of networks worldwide are 5G compatible, with experts predicting this will rise to 85% by the end of the decade. This evolution guarantees smooth gameplay for everyone, regardless of device.Ultra-low latency now enables streaming 4K video of favorite games from a bus stop - without a hitch. This reliability empowers developers to build complex titles that run seamlessly on almost any device, putting a high-end console experience directly into players' pockets.AI and PersonalizationArtificial Intelligence is transforming the gaming experience. Players may notice their lobby seems to know exactly what they want to play - that's AI at work. Algorithms track history to suggest titles that fit individual styles, ensuring fast-paced shooter fans aren’t bogged down with slow strategy recommendations.But AI goes further. TechCrunch reports that AI companion apps are on track to generate over $120 million in 2025 alone, with downloads jumping 88% in the first half of the year. These apps allow users to converse with custom characters that have distinct personalities, signaling a growing appetite for digital connections that feel human rather than scripted.Virtual Reality and Cloud GamingVirtual Reality is shifting from novelty to necessity. While we aren't at Ready Player One levels yet, modern headsets now let players step into fully realized worlds where they can physically interact with environments and avatars. High-fives, opponent "tells," and shared social energy bring the excitement of a real gaming floor into the living room - solving the isolation problem that online gaming once had.Cloud gaming completes the transformation. By removing the need for expensive hardware, it democratizes access. Processing happens on remote servers, with devices acting only as screens. This shift toward instant, hardware-agnostic play is redefining user expectations across the industry. We expect things to work instantly. We expect them to look good. And we expect them to be fair. Technology is ensuring all three - and it is only getting faster.

DBS Group and Ant International signed a Memorandum of Understanding on November 13, 2025, that connects Singapore's PayLah! digital wallet to Alipay+'s global merchant network. The partnership connects PayLah! users to over 150 million payment points across more than 100 countries, representing one of the year's largest cross-border wallet integrations. The collaboration removes currency conversion friction and streamlines authorization for Singaporean consumers making international purchases.Singapore's digital infrastructure has expanded across fintech platforms, AI research facilities and smart-city systems. The country's regulated digital entertainment sector has grown in parallel, with platforms on the Singaporean online casinos list now providing substantial welcome bonuses, rapid withdrawal processing and extensive selections of real money gaming options. These developments reflect Singapore's broader push toward comprehensive digital services that operate within strict regulatory frameworks while maintaining high consumer standards.The DBS-Ant agreement goes beyond retail payments. Both parties confirmed they will explore near-instant remittance capabilities between DBS customers and Alipay+'s 1.8 billion user accounts. Current remittance systems in Asia typically require one to three business days for settlement, with fees that can reach 5-7% of transaction value. The proposed infrastructure could reduce settlement windows to seconds while lowering costs through direct wallet-to-wallet transfers that bypass traditional correspondent banking networks.DBS chief executive Piyush Gupta said the bank plans to embed financial services in daily activities instead of treating them as separate transactions. Ant International CEO Eric Jing said cross-border commerce in Southeast Asia has expanded faster than the payment systems that support it, and the partnership will close that gap.The Monetary Authority of Singapore has backed tokenization trials and distributed ledger experiments since 2022. Project Guardian and Project Orchid both tested programmable money and cross-border settlement on blockchain networks. DBS and Ant confirmed they will research blockchain-based tokenized deposits, a sign that Singapore's banks are preparing for scenarios where traditional systems work alongside decentralized technology.Singapore holds its spot as Southeast Asia's main financial hub through rules that push innovation forward but keep the system stable. Microsoft Research Asia set up its first Southeast Asian AI lab in Singapore in September 2025. Razer, which makes gaming hardware, said it will open an AI gaming development center in the city in October. Cloud providers and chip design companies did the same earlier this year, and created a setup where fintech, enterprise software, consumer electronics and digital services use shared infrastructure.The remittance component of the DBS-Ant partnership carries weight for regional labor markets. Remittance flows within Asia hit $280 billion in 2024, based on Asian Development Bank figures, and Singapore, Malaysia and the Gulf states sent most of those transfers. High transfer fees and slow settlement have limited what families can do with remitted funds, and people often wait several days before they can access money sent for urgent needs.The instant remittance system could change how small and medium-sized enterprises handle cross-border working capital if it scales up successfully. Companies with operations in several Southeast Asian markets keep different banking relationships in each country to process local payments, and this setup creates extra costs and makes operations more complicated. Direct wallet transfers would let businesses settle invoices and pay suppliers without duplicate treasury infrastructure.The partnership builds on existing QR code payment standards that Alipay+ has deployed across Asia. DBS will integrate these capabilities into PayLah!, which currently serves over three million users in Singapore. The bank has not disclosed specific timelines for the merchant network expansion or the remittance features, stating only that both will roll out in phases.

 AGI Technology, a leading memory brand from Taiwan, announced that it will participate in CES 2026 from January 6 to 9 in Las Vegas at The Venetian Resort, Level 2, Bellini 2001B, where it will debut its complete lineup of next-generation high-speed storage solutions. Under the theme "Powering What's Next with AGI Innovation," AGI will showcase breakthrough technologies across extreme overclocking, high-speed transmission, and rugged mobile storage to address the surging demands of AI computing, ultra-high-resolution content workflows, and multi-task creative environments.AGI's Next-Generation Storage Portfolio DebutsProject S10 Gen5 SSD - 6nm Controller, 11,000 MB/s PerformanceAGI introduces its new flagship Project S10 Gen5 SSD featuring TSMC's 6nm controller, delivering significantly enhanced efficiency and effectively addressing the thermal challenges common in Gen5 devices under extended heavy workloads. With PCIe Gen5 x4, the drive reaches speeds of 11,000 MB/s, offering a dramatic bandwidth upgrade over Gen4. Combined with its low-power controller and high-efficiency cooling module, the S10 provides sustained, stable performance for AI datasets, AAA gaming, and high-resolution rendering.Project K10 DDR5 - 10,000 MT/s Overclocking FlagshipBuilding on the success of the Turbojet series, AGI reveals Project K10 DDR5 memory, achieving an impressive 10,000 MT/s with optimized latency and a 24GB x2 high-capacity configuration. The aluminum heatsink and a fluid-cut design with a dynamic RGB light bar enhance both cooling performance and visual aesthetics, delivering an exceptionally smooth overclocking experience for gamers.Comprehensive Mobile Storage: High Speed x Durability x Capacity in One LineupAGI presents three new portable SSDs designed around mobility, high-speed transmission, and rugged durability. The AGI ED158 uses a cap-less sliding connector that plugs directly into smartphones for 4K ProRes recording and instant backup with zero cables needed, enabling intuitive and efficient mobile creation. The AGI ED268 features IP55 water- and dust-resistance, 2-meter drop protection, and 20 Gb/s transfer speeds, offering the ideal balance between durability and performance. The AGI ED368 adopts the latest USB4 Gen3 x2 interface, reaching up to 40 Gb/s with an outdoor-grade reinforced enclosure suited for field production, on-the-go editing, and professional imaging teams.AGI Technology invites attendees to visit Bellini 2001B to experience the power of its next-generation storage innovations. Additional products and accessories will be showcased, with AGI engineers available for technical discussions on the future of high-speed computing and storage.

As energy consumption in AI servers and data centers rapidly increases, High Voltage Direct Current (HVDC) has emerged as a key direction for next-generation power system. Traditional AC/DC multi-stage architectures suffer significant conversion losses, limiting overall efficiency to around 85%, prompting the industry to accelerate its transition toward 800V (or ±400V) HVDC systems.In response, GaNrich Semiconductor Corporation (GaNrich) announced it will launch its 1200V High-Voltage GaN (HV GaN) product series by the end of 2025. Built on GaNrich's proprietary GaN on Sapphire platform, the series features low Rds(on), high breakdown voltage, and outstanding efficiency. It is designed for data-center power management, AI server power modules, and emerging HVDC systems.As the first global supplier offering pin-to-pin GaN replacement solutions, GaNrich enables its 1200V GaN FETs to directly replace SiC devices. Under high-frequency HVDC input operation, switching loss is reduced by 30%, gate-drive loss by 90%, and auxiliary power size by 50%. On the output side, GaNrich's 100V GaN offers more than 50% lower on-resistance compared with equivalent Si MOSFETs, offering a clear efficiency advantage.In the medium-voltage sector, GaNrich started mass production in Q3 of its 100–200V, 1–10 mΩ MV GaN product line-up, available in multiple double-sided-cooling RQFN and DFN packages. The newly launched RQFN 5×6 device achieves leading TCR (temperature coefficient resistance) performance, delivering superior high-temperature current capability versus competing GaN and SGT MOSFET devices. Applications include HVDC power supplies, power bricks, drones, industrial automation, and robotics.According to NVIDIA's published 800V HVDC white paper, GaN/SiC device typically follow three topologies combinations in HVDC system: 1200V+100/40V, 650V + 100/40V, and 200/150V+40V. GaNrich is currently the world's only supplier capable of delivering all device combinations through a unified product portfolio. Building on extensive expertise in GaN chip design, packaging, and system module integration, GaNrich provides a comprehensive voltage range from medium to high voltage, offering high-efficiency and miniaturized power-conversion solutions that accelerate the real-world adoption of GaN in HVDC and power system applications.

Robust computational capabilities are fueling the rapid evolution of artificial intelligence (AI) applications. The rise of large language models (LLMs) such as ChatGPT-5 has triggered a surge in global data center investments, accelerating the expansion of Taiwan's semiconductor and server industries. Today, the production, assembly, and outsourcing of AI servers have become key benchmarks for industry and technology leaders aiming to lead in global AI innovation. As high-density CPU and GPU architectures continue to advance, the demand for next-generation cooling technologies has intensified dramatically.In an exclusive interview on "Thermal Solutions Powering the AI Era" with host Ashley Chu on IC Radio Broadcasting, Ricky Yu, Deputy Manager at T-Global Technology, and Director Chris Chuang discussed how rapid advancements in AI-integrated electronic devices are reshaping thermal design. They emphasized that thermal management-critical for improving heat dissipation efficiency-has emerged as one of the most pressing engineering challenges in the AI era. Currently, the industry is witnessing a significant transition from traditional air-cooling approaches to liquid-cooling systems in the design of thermal modules for advanced processors.The thermal design power (TDP) of processor cooling modules initially started at around 800 W and rose to 1,200 W by 2024, following updated thermal specifications. Today, TDP levels have reached 2,300 W, marking a steep upward trend. The cooling module market is thriving, and Chuang predicts that specifications may soon exceed 5,000 W, and could potentially approach 10,000 W in the near future - an unprecedented leap in thermal design requirements.Currently, three primary cooling methods dominate thermal management: air cooling, liquid cooling, and immersion cooling. Among these, air and liquid cooling remain the mainstream technologies, utilizing a variety of materials to absorb and dissipate heat efficiently.Immersion cooling, on the other hand, represents a promising frontier in heat dissipation. This approach submerges entire servers in electrically insulating fluids to achieve maximum thermal efficiency. While it delivers superior performance, its high cost and complex system integration continue to pose challenges, and the technology remains under active development and validation.As AI computing power continues its exponential growth, the demand for high-performance, reliable, and sustainable thermal solutions will only intensify. Companies like T-Global Technology are at the forefront of this transformation-bridging the gap between innovation and practicality, and empowering the world’s transition into the high-efficiency, high-density era of intelligent computing.PCM Development Exacerbates Heat Dissipation Challenges in AI EraYu notes that only a handful of technology giants - particularly those engaged in large language model (LLM) training - exhibit such extraordinary energy consumption in the development of advanced AI technologies. In contrast, small and medium-sized enterprises, as well as general consumers, tend to prioritize thermal solutions that balance performance and cost for their specific applications. Recognizing this market need, T-Global Technology is actively expanding its presence in this growing segment.To meet evolving thermal challenges, T-Global continues to invest in cutting-edge materials and technologies for product research and development. These include liquid metal, metal heat sinks, aluminum silicon carbide (AlSiC), and indium sheets - materials engineered to enhance heat dissipation and conductivity. The company is also advancing the design and manufacturing of solid-state heat sinks, metal modules, and cooling fans, ensuring customers receive more comprehensive and efficient thermal solutions across diverse applications.In recent years, T-Global has also integrated phase-change materials (PCMs) into new product lines. These materials, initially solid and easy to assemble, transition to a liquid state when exposed to heat, enabling efficient heat absorption and transfer. This liquid-metal-based cooling approach, already adopted in high-end gaming PCs and consoles, has emerged as a new technological highlight in advanced thermal design.To address the common issues of material overflow and cost associated with liquid metal, T-Global has developed an innovative containment design that effectively prevents leakage and corrosion - two factors that could otherwise compromise system stability and longevity. This advancement underscores the company's ongoing commitment to developing safer, more reliable, and performance-driven thermal technologies for the AI generation.Actively Enhance Global Synchronous Service Operations and Customer CollaborationIn parallel with the advancement of emerging technologies, Ricky Yu analyzed real-world customer use cases to identify their most pressing challenges. One key issue arises when clients face space constraints in computer rooms or data centers. To accommodate greater cooling demands, they often seek to upgrade thermal performance using existing equipment and infrastructure, rather than complete system overhauls.For instance, when power consumption requirements rise from 200W to 500W and even 1,000W, customers look for solutions that enhance cooling efficiency without disrupting the surrounding environment. This shift has redefined T-Global's role - transforming the company from a traditional supplier of complete cooling modules into a consultative partner that collaborates closely with clients to develop tailored, high-efficiency solutions.Global Expansion and Manufacturing ExcellenceTo meet growing international demand and the globalization of supply chains, T-Global Technology has intensified its manufacturing and operational investments. The company has established a network of zero-time consultants in China, Japan, and other overseas markets, ensuring 24/7, 365-day global support and synchronized operations.At the same time, T-Global continues to expand its overseas manufacturing base in Vietnam while scaling up production capabilities at its Taiwan headquarters. By leveraging its vertically integrated strengths in research, design, and manufacturing, T-Global is well-positioned to seize the opportunities emerging from the AI era's rapid growth - delivering agile, high-performance, and globally supported thermal solutions to customers worldwide.

Taiwan has a dense tunnel network that is rarely observed elsewhere, notably along its long-distance routes, due to the fact that it possesses a significant proportion of mountainous terrain, and its road infrastructure includes multiple tunnels that navigate various elevations. Due to their enclosed nature, accidents in tunnels can easily result in casualties.HiPower Solution Group has developed an intelligent platform named Incident Information Detection System (IID) utilizing ASUS IoT solutions and technology services. This platform utilizes AI technology to detect anomalies in tunnels in real time, significantly improving the effectiveness of early warning and emergency response.The challenge: Human limits on constant vigilanceReal-time monitoring and alert systems are required in tunnels, which are classified as high-risk zones on a global scale. However, conventional tunnel monitoring methods are impeded by human limitations. Tunnels several kilometers long have a large number of cameras, making real-time anomaly detection challenging. Control-center personnel must monitor hundreds of video streams simultaneously, as emphasized by HiPower CEO Roger Hung.The solution: AI-powered detection and edge computingIn response, HiPower has developed IID, a multifunctional intelligent monitoring system that utilizes AI technology. This solution automatically filters potential anomalies from a vast video feed by integrating HiPower's proprietary AI engine with an ASUS server situated in the data center. Empirical operating data indicate that the system's detection accuracy is approximately 98% and reaches 100% under stable conditions.The substantial efficacy of HiPower's IID system, according to Hung, is not solely attributed to its AI capabilities and specialized expertise, but also to the technological competencies of its hardware partner. In this solution, HiPower implemented the ASUS IoT EBS-4U700 industrial-grade edge computing server as its core computing platform. The simultaneous processing of numerous high-resolution camera streams is made possible by the support of numerous high-end GPU cards on this high-performance server. An advanced cooling design and other military-grade components are designed to satisfy the rigorous requirements of tunnel environments, ensuring reliable performance and uninterrupted operation.The EBS-4U700 industrial-grade edge computing server features an NVIDIA GeForce RTX 4090 Ti GPU, delivering robust AI inference capabilities. It can simultaneously assess multiple high-resolution video streams in real time, ensuring that AI models can identify and analyze events within milliseconds. The significant GPU memory capacity enables the loading of complex deep learning models, significantly enhancing recognition accuracy and processing speed.ASUS IoT provides comprehensive technical support services in addition to hardware. These services include BIOS optimization for AI computing requirements, meticulous adjustment of operating system compatibility, and an intelligent GPU resource allocation system to optimize the integration of AI software and hardware. Its modular and scalable design allows flexible deployment for tunnels of different sizes, supports various industrial communication protocols, and integrates seamlessly with existing systems.The outcome: Proven reliability and broader applicationsHung disclosed that numerous tunnels in Taiwan have implemented HiPower's IID system as their management platform. HiPower's AI detection system is highly adaptable and has been implemented in a variety of applications, including the detection of unauthorized personnel on campus during non-class hours, monitoring whether heavy vehicles follow designated routes within ports and harbors, and the use of thermal imaging cameras to identify abnormal smoke and temperature increases in containers carrying hazardous chemicals.Hung observed that security management applications are transitioning from fundamental "general-purpose" auxiliary functions to "professional-level" integrated systems as AI technology advances. The necessity of continuous monitoring and instantaneous decision-making through AI systems is becoming increasingly apparent.HiPower will continue to collaborate with ASUS IoT and the wider ASUS group to revolutionize infrastructure security management. The partnership will expand to other critical areas beyond tunnels, using AI to provide real-time monitoring and early warnings, enhancing public safety.System Architecture Diagram. ASUS

Seoul, October 1, 2025 - SK Group announced today that SK Chairman Chey Tae-won and OpenAI CEO Sam Altman met at SK headquarters in Seoul to sign a Letter of Intent (LOI) and a Memorandum of Understanding (MOU) to develop an AI Data Center in South Korea as part of the Stargate project.Chairman Chey Tae-won stated, "We are honored to participate as a core partner in the Stargate project, aimed at building future global AI infrastructure. By leveraging SK's integrated AI infrastructure capabilities from memory semiconductors to data centers, we will actively contribute to global AI infrastructure innovation and strengthen Korea's AI competitiveness at a national level."SK hynix signed a Letter of Intent (LOI) with OpenAI to supply High Bandwidth Memory (HBM) for the construction of a global AI data center under the Stargate project. The signing of the LOI reflects recognition of SK hynix's technological leadership and supply capability in AI-optimized semiconductor memory, as the company ranked no.1 worldwide in DRAM revenue in the first half of this year. SK hynix will establish a production system capable of promptly meeting OpenAI's HBM demand for up to 900,000 DRAM wafers per month. It is more than double the current HBM industry capacity, underscoring the immense semiconductor demand driven by the Stargate project.Through this partnership, SK hynix will actively support OpenAI's GPU procurement strategy, while the two companies have agreed to further expand their collaboration. Specific supply volumes and arrangements will be determined through further discussions as the project moves forward.SK Telecom signed an MOU with OpenAI to collaborate on building the AI Data Center in the southwest region of Korea as part of 'Stargate Korea.' Leveraging its solid experience in data center construction and operation, SK Telecom and OpenAI will jointly develop next-generation computing and data center solutions. They will also explore various AI service use cases for consumers and enterprises.This government-backed collaboration signifies SK Group's strategic alliance with OpenAI and is expected to contribute positively to the development of Korea's AI ecosystem by combining SK's accumulated technology and infrastructure with the synergy of global cooperation. SK's involvement in the Stargate project is anticipated to solidify the AI economic alliance between South Korea and the United States. Korea's strengths in manufacturing and telecommunications complement the U.S.'s leadership in AI technology, forming a mutually beneficial and globally influential partnership.Since 2023, Chairman Chey and CEO Altman have built a mutual trust through multiple meetings, sharing a consensus on future directions in semiconductors, data centers, and other fields. They have discussed the development of dedicated semiconductors and infrastructure to cope with the global surge in AI training and inference workloads. They have discussed innovative joint development of next-generation AI infrastructure, including new memory-computing architectures to overcome hardware bottlenecks for AI models."Korea has the vision, technology, talent, and infrastructure to lead globally in AI," OpenAI CEO Altman said. "We're proud to partner with SK hynix as part of our Stargate initiative, supporting Korea's leadership in AI and contributing to its continued success.""This partnership marks the official beginning of comprehensive technological innovation cooperation spanning from chip development to data center construction and operation," SK Chairman Chey Tae-won added. "We are confident this collaboration will set a new paradigm in the global AI landscape and significantly advance the AI industry's future."Meanwhile, SK Group is advancing its portfolio by positioning AI as a key growth driver and strengthening alliances with global technology leaders. In August, the company held the groundbreaking ceremony for the SK Ulsan AI Data Center, reinforcing collaboration with global partners and reaffirming its commitment to AI innovation.Sam Altman, OpenAI CEO(left) and SK Group Chairman Chey Tae-won (right). SK hynix

SK hynix announced today that it has begun supplying its high-performance mobile NAND solution ZUFS 4.1 to customers, marking the world’s first mass production of this solution.The solution's adoption in the latest smartphones reinforces SK hynix's technological excellence in the global market. ZUFS 4.1 will enhance smartphones’ powerful on-device AI capabilities, offering users an innovative experience.SK hynix successfully completed the qualification process for the solution in June this year through close collaboration with customers. In July, the company began mass production and started supplying the product.ZUFS, or Zoned UFS, is an extended specification of UFS that applies Zoned Storage technology, which stores data in different zones based on its usage and characteristics.When installed in a smartphone, ZUFS 4.1 enhances the operation speed of the operating system (OS) and improves data management efficiency. As a result, it mitigates read performance degradation over extended use by more than four times compared to conventional UFS, enabling a 45% reduction in app launch times. Unlike conventional UFS, which writes new data by overwriting existing data, ZUFS 4.1 writes data sequentially. This data storage method has resulted in a 47% reduction in AI app launch times.These performance characteristics position ZUFS 4.1 as an optimal solution for today's mobile environment, where on-device AI and large-scale data processing are essential.In addition, SK hynix has significantly enhanced the error-handling capabilities of ZUFS 4.1 compared to version 4.0 developed in May 2024. By detecting errors with greater precision and clearly communicating the necessary corrective actions to the central processing unit, the latest solution is expected to significantly improve system reliability and recovery performance.“ZUFS 4.1, which we have successfully begun to supply, is the first solution developed and mass-produced through collaboration aimed at optimizing Android OS and storage devices. Looking ahead, its applications are expected to expand,” said Justin Kim, President & Head of AI Infra at SK hynix.“We will continue to supply NAND solutions that meet customer needs in a timely manner, while strengthening partnerships with global companies to strengthen our competitive edge in the AI memory sector.”Credit: SK Hynix