DBS Group and Ant International signed a Memorandum of Understanding on November 13, 2025, that connects Singapore's PayLah! digital wallet to Alipay+'s global merchant network. The partnership connects PayLah! users to over 150 million payment points across more than 100 countries, representing one of the year's largest cross-border wallet integrations. The collaboration removes currency conversion friction and streamlines authorization for Singaporean consumers making international purchases.Singapore's digital infrastructure has expanded across fintech platforms, AI research facilities and smart-city systems. The country's regulated digital entertainment sector has grown in parallel, with platforms on the Singaporean online casinos list now providing substantial welcome bonuses, rapid withdrawal processing and extensive selections of real money gaming options. These developments reflect Singapore's broader push toward comprehensive digital services that operate within strict regulatory frameworks while maintaining high consumer standards.The DBS-Ant agreement goes beyond retail payments. Both parties confirmed they will explore near-instant remittance capabilities between DBS customers and Alipay+'s 1.8 billion user accounts. Current remittance systems in Asia typically require one to three business days for settlement, with fees that can reach 5-7% of transaction value. The proposed infrastructure could reduce settlement windows to seconds while lowering costs through direct wallet-to-wallet transfers that bypass traditional correspondent banking networks.DBS chief executive Piyush Gupta said the bank plans to embed financial services in daily activities instead of treating them as separate transactions. Ant International CEO Eric Jing said cross-border commerce in Southeast Asia has expanded faster than the payment systems that support it, and the partnership will close that gap.The Monetary Authority of Singapore has backed tokenization trials and distributed ledger experiments since 2022. Project Guardian and Project Orchid both tested programmable money and cross-border settlement on blockchain networks. DBS and Ant confirmed they will research blockchain-based tokenized deposits, a sign that Singapore's banks are preparing for scenarios where traditional systems work alongside decentralized technology.Singapore holds its spot as Southeast Asia's main financial hub through rules that push innovation forward but keep the system stable. Microsoft Research Asia set up its first Southeast Asian AI lab in Singapore in September 2025. Razer, which makes gaming hardware, said it will open an AI gaming development center in the city in October. Cloud providers and chip design companies did the same earlier this year, and created a setup where fintech, enterprise software, consumer electronics and digital services use shared infrastructure.The remittance component of the DBS-Ant partnership carries weight for regional labor markets. Remittance flows within Asia hit $280 billion in 2024, based on Asian Development Bank figures, and Singapore, Malaysia and the Gulf states sent most of those transfers. High transfer fees and slow settlement have limited what families can do with remitted funds, and people often wait several days before they can access money sent for urgent needs.The instant remittance system could change how small and medium-sized enterprises handle cross-border working capital if it scales up successfully. Companies with operations in several Southeast Asian markets keep different banking relationships in each country to process local payments, and this setup creates extra costs and makes operations more complicated. Direct wallet transfers would let businesses settle invoices and pay suppliers without duplicate treasury infrastructure.The partnership builds on existing QR code payment standards that Alipay+ has deployed across Asia. DBS will integrate these capabilities into PayLah!, which currently serves over three million users in Singapore. The bank has not disclosed specific timelines for the merchant network expansion or the remittance features, stating only that both will roll out in phases.

 AGI Technology, a leading memory brand from Taiwan, announced that it will participate in CES 2026 from January 6 to 9 in Las Vegas at The Venetian Resort, Level 2, Bellini 2001B, where it will debut its complete lineup of next-generation high-speed storage solutions. Under the theme "Powering What's Next with AGI Innovation," AGI will showcase breakthrough technologies across extreme overclocking, high-speed transmission, and rugged mobile storage to address the surging demands of AI computing, ultra-high-resolution content workflows, and multi-task creative environments.AGI's Next-Generation Storage Portfolio DebutsProject S10 Gen5 SSD - 6nm Controller, 11,000 MB/s PerformanceAGI introduces its new flagship Project S10 Gen5 SSD featuring TSMC's 6nm controller, delivering significantly enhanced efficiency and effectively addressing the thermal challenges common in Gen5 devices under extended heavy workloads. With PCIe Gen5 x4, the drive reaches speeds of 11,000 MB/s, offering a dramatic bandwidth upgrade over Gen4. Combined with its low-power controller and high-efficiency cooling module, the S10 provides sustained, stable performance for AI datasets, AAA gaming, and high-resolution rendering.Project K10 DDR5 - 10,000 MT/s Overclocking FlagshipBuilding on the success of the Turbojet series, AGI reveals Project K10 DDR5 memory, achieving an impressive 10,000 MT/s with optimized latency and a 24GB x2 high-capacity configuration. The aluminum heatsink and a fluid-cut design with a dynamic RGB light bar enhance both cooling performance and visual aesthetics, delivering an exceptionally smooth overclocking experience for gamers.Comprehensive Mobile Storage: High Speed x Durability x Capacity in One LineupAGI presents three new portable SSDs designed around mobility, high-speed transmission, and rugged durability. The AGI ED158 uses a cap-less sliding connector that plugs directly into smartphones for 4K ProRes recording and instant backup with zero cables needed, enabling intuitive and efficient mobile creation. The AGI ED268 features IP55 water- and dust-resistance, 2-meter drop protection, and 20 Gb/s transfer speeds, offering the ideal balance between durability and performance. The AGI ED368 adopts the latest USB4 Gen3 x2 interface, reaching up to 40 Gb/s with an outdoor-grade reinforced enclosure suited for field production, on-the-go editing, and professional imaging teams.AGI Technology invites attendees to visit Bellini 2001B to experience the power of its next-generation storage innovations. Additional products and accessories will be showcased, with AGI engineers available for technical discussions on the future of high-speed computing and storage.

As energy consumption in AI servers and data centers rapidly increases, High Voltage Direct Current (HVDC) has emerged as a key direction for next-generation power system. Traditional AC/DC multi-stage architectures suffer significant conversion losses, limiting overall efficiency to around 85%, prompting the industry to accelerate its transition toward 800V (or ±400V) HVDC systems.In response, GaNrich Semiconductor Corporation (GaNrich) announced it will launch its 1200V High-Voltage GaN (HV GaN) product series by the end of 2025. Built on GaNrich's proprietary GaN on Sapphire platform, the series features low Rds(on), high breakdown voltage, and outstanding efficiency. It is designed for data-center power management, AI server power modules, and emerging HVDC systems.As the first global supplier offering pin-to-pin GaN replacement solutions, GaNrich enables its 1200V GaN FETs to directly replace SiC devices. Under high-frequency HVDC input operation, switching loss is reduced by 30%, gate-drive loss by 90%, and auxiliary power size by 50%. On the output side, GaNrich's 100V GaN offers more than 50% lower on-resistance compared with equivalent Si MOSFETs, offering a clear efficiency advantage.In the medium-voltage sector, GaNrich started mass production in Q3 of its 100–200V, 1–10 mΩ MV GaN product line-up, available in multiple double-sided-cooling RQFN and DFN packages. The newly launched RQFN 5×6 device achieves leading TCR (temperature coefficient resistance) performance, delivering superior high-temperature current capability versus competing GaN and SGT MOSFET devices. Applications include HVDC power supplies, power bricks, drones, industrial automation, and robotics.According to NVIDIA's published 800V HVDC white paper, GaN/SiC device typically follow three topologies combinations in HVDC system: 1200V+100/40V, 650V + 100/40V, and 200/150V+40V. GaNrich is currently the world's only supplier capable of delivering all device combinations through a unified product portfolio. Building on extensive expertise in GaN chip design, packaging, and system module integration, GaNrich provides a comprehensive voltage range from medium to high voltage, offering high-efficiency and miniaturized power-conversion solutions that accelerate the real-world adoption of GaN in HVDC and power system applications.

Robust computational capabilities are fueling the rapid evolution of artificial intelligence (AI) applications. The rise of large language models (LLMs) such as ChatGPT-5 has triggered a surge in global data center investments, accelerating the expansion of Taiwan's semiconductor and server industries. Today, the production, assembly, and outsourcing of AI servers have become key benchmarks for industry and technology leaders aiming to lead in global AI innovation. As high-density CPU and GPU architectures continue to advance, the demand for next-generation cooling technologies has intensified dramatically.In an exclusive interview on "Thermal Solutions Powering the AI Era" with host Ashley Chu on IC Radio Broadcasting, Ricky Yu, Deputy Manager at T-Global Technology, and Director Chris Chuang discussed how rapid advancements in AI-integrated electronic devices are reshaping thermal design. They emphasized that thermal management-critical for improving heat dissipation efficiency-has emerged as one of the most pressing engineering challenges in the AI era. Currently, the industry is witnessing a significant transition from traditional air-cooling approaches to liquid-cooling systems in the design of thermal modules for advanced processors.The thermal design power (TDP) of processor cooling modules initially started at around 800 W and rose to 1,200 W by 2024, following updated thermal specifications. Today, TDP levels have reached 2,300 W, marking a steep upward trend. The cooling module market is thriving, and Chuang predicts that specifications may soon exceed 5,000 W, and could potentially approach 10,000 W in the near future - an unprecedented leap in thermal design requirements.Currently, three primary cooling methods dominate thermal management: air cooling, liquid cooling, and immersion cooling. Among these, air and liquid cooling remain the mainstream technologies, utilizing a variety of materials to absorb and dissipate heat efficiently.Immersion cooling, on the other hand, represents a promising frontier in heat dissipation. This approach submerges entire servers in electrically insulating fluids to achieve maximum thermal efficiency. While it delivers superior performance, its high cost and complex system integration continue to pose challenges, and the technology remains under active development and validation.As AI computing power continues its exponential growth, the demand for high-performance, reliable, and sustainable thermal solutions will only intensify. Companies like T-Global Technology are at the forefront of this transformation-bridging the gap between innovation and practicality, and empowering the world’s transition into the high-efficiency, high-density era of intelligent computing.PCM Development Exacerbates Heat Dissipation Challenges in AI EraYu notes that only a handful of technology giants - particularly those engaged in large language model (LLM) training - exhibit such extraordinary energy consumption in the development of advanced AI technologies. In contrast, small and medium-sized enterprises, as well as general consumers, tend to prioritize thermal solutions that balance performance and cost for their specific applications. Recognizing this market need, T-Global Technology is actively expanding its presence in this growing segment.To meet evolving thermal challenges, T-Global continues to invest in cutting-edge materials and technologies for product research and development. These include liquid metal, metal heat sinks, aluminum silicon carbide (AlSiC), and indium sheets - materials engineered to enhance heat dissipation and conductivity. The company is also advancing the design and manufacturing of solid-state heat sinks, metal modules, and cooling fans, ensuring customers receive more comprehensive and efficient thermal solutions across diverse applications.In recent years, T-Global has also integrated phase-change materials (PCMs) into new product lines. These materials, initially solid and easy to assemble, transition to a liquid state when exposed to heat, enabling efficient heat absorption and transfer. This liquid-metal-based cooling approach, already adopted in high-end gaming PCs and consoles, has emerged as a new technological highlight in advanced thermal design.To address the common issues of material overflow and cost associated with liquid metal, T-Global has developed an innovative containment design that effectively prevents leakage and corrosion - two factors that could otherwise compromise system stability and longevity. This advancement underscores the company's ongoing commitment to developing safer, more reliable, and performance-driven thermal technologies for the AI generation.Actively Enhance Global Synchronous Service Operations and Customer CollaborationIn parallel with the advancement of emerging technologies, Ricky Yu analyzed real-world customer use cases to identify their most pressing challenges. One key issue arises when clients face space constraints in computer rooms or data centers. To accommodate greater cooling demands, they often seek to upgrade thermal performance using existing equipment and infrastructure, rather than complete system overhauls.For instance, when power consumption requirements rise from 200W to 500W and even 1,000W, customers look for solutions that enhance cooling efficiency without disrupting the surrounding environment. This shift has redefined T-Global's role - transforming the company from a traditional supplier of complete cooling modules into a consultative partner that collaborates closely with clients to develop tailored, high-efficiency solutions.Global Expansion and Manufacturing ExcellenceTo meet growing international demand and the globalization of supply chains, T-Global Technology has intensified its manufacturing and operational investments. The company has established a network of zero-time consultants in China, Japan, and other overseas markets, ensuring 24/7, 365-day global support and synchronized operations.At the same time, T-Global continues to expand its overseas manufacturing base in Vietnam while scaling up production capabilities at its Taiwan headquarters. By leveraging its vertically integrated strengths in research, design, and manufacturing, T-Global is well-positioned to seize the opportunities emerging from the AI era's rapid growth - delivering agile, high-performance, and globally supported thermal solutions to customers worldwide.

Taiwan has a dense tunnel network that is rarely observed elsewhere, notably along its long-distance routes, due to the fact that it possesses a significant proportion of mountainous terrain, and its road infrastructure includes multiple tunnels that navigate various elevations. Due to their enclosed nature, accidents in tunnels can easily result in casualties.HiPower Solution Group has developed an intelligent platform named Incident Information Detection System (IID) utilizing ASUS IoT solutions and technology services. This platform utilizes AI technology to detect anomalies in tunnels in real time, significantly improving the effectiveness of early warning and emergency response.The challenge: Human limits on constant vigilanceReal-time monitoring and alert systems are required in tunnels, which are classified as high-risk zones on a global scale. However, conventional tunnel monitoring methods are impeded by human limitations. Tunnels several kilometers long have a large number of cameras, making real-time anomaly detection challenging. Control-center personnel must monitor hundreds of video streams simultaneously, as emphasized by HiPower CEO Roger Hung.The solution: AI-powered detection and edge computingIn response, HiPower has developed IID, a multifunctional intelligent monitoring system that utilizes AI technology. This solution automatically filters potential anomalies from a vast video feed by integrating HiPower's proprietary AI engine with an ASUS server situated in the data center. Empirical operating data indicate that the system's detection accuracy is approximately 98% and reaches 100% under stable conditions.The substantial efficacy of HiPower's IID system, according to Hung, is not solely attributed to its AI capabilities and specialized expertise, but also to the technological competencies of its hardware partner. In this solution, HiPower implemented the ASUS IoT EBS-4U700 industrial-grade edge computing server as its core computing platform. The simultaneous processing of numerous high-resolution camera streams is made possible by the support of numerous high-end GPU cards on this high-performance server. An advanced cooling design and other military-grade components are designed to satisfy the rigorous requirements of tunnel environments, ensuring reliable performance and uninterrupted operation.The EBS-4U700 industrial-grade edge computing server features an NVIDIA GeForce RTX 4090 Ti GPU, delivering robust AI inference capabilities. It can simultaneously assess multiple high-resolution video streams in real time, ensuring that AI models can identify and analyze events within milliseconds. The significant GPU memory capacity enables the loading of complex deep learning models, significantly enhancing recognition accuracy and processing speed.ASUS IoT provides comprehensive technical support services in addition to hardware. These services include BIOS optimization for AI computing requirements, meticulous adjustment of operating system compatibility, and an intelligent GPU resource allocation system to optimize the integration of AI software and hardware. Its modular and scalable design allows flexible deployment for tunnels of different sizes, supports various industrial communication protocols, and integrates seamlessly with existing systems.The outcome: Proven reliability and broader applicationsHung disclosed that numerous tunnels in Taiwan have implemented HiPower's IID system as their management platform. HiPower's AI detection system is highly adaptable and has been implemented in a variety of applications, including the detection of unauthorized personnel on campus during non-class hours, monitoring whether heavy vehicles follow designated routes within ports and harbors, and the use of thermal imaging cameras to identify abnormal smoke and temperature increases in containers carrying hazardous chemicals.Hung observed that security management applications are transitioning from fundamental "general-purpose" auxiliary functions to "professional-level" integrated systems as AI technology advances. The necessity of continuous monitoring and instantaneous decision-making through AI systems is becoming increasingly apparent.HiPower will continue to collaborate with ASUS IoT and the wider ASUS group to revolutionize infrastructure security management. The partnership will expand to other critical areas beyond tunnels, using AI to provide real-time monitoring and early warnings, enhancing public safety.System Architecture Diagram. ASUS

Seoul, October 1, 2025 - SK Group announced today that SK Chairman Chey Tae-won and OpenAI CEO Sam Altman met at SK headquarters in Seoul to sign a Letter of Intent (LOI) and a Memorandum of Understanding (MOU) to develop an AI Data Center in South Korea as part of the Stargate project.Chairman Chey Tae-won stated, "We are honored to participate as a core partner in the Stargate project, aimed at building future global AI infrastructure. By leveraging SK's integrated AI infrastructure capabilities from memory semiconductors to data centers, we will actively contribute to global AI infrastructure innovation and strengthen Korea's AI competitiveness at a national level."SK hynix signed a Letter of Intent (LOI) with OpenAI to supply High Bandwidth Memory (HBM) for the construction of a global AI data center under the Stargate project. The signing of the LOI reflects recognition of SK hynix's technological leadership and supply capability in AI-optimized semiconductor memory, as the company ranked no.1 worldwide in DRAM revenue in the first half of this year. SK hynix will establish a production system capable of promptly meeting OpenAI's HBM demand for up to 900,000 DRAM wafers per month. It is more than double the current HBM industry capacity, underscoring the immense semiconductor demand driven by the Stargate project.Through this partnership, SK hynix will actively support OpenAI's GPU procurement strategy, while the two companies have agreed to further expand their collaboration. Specific supply volumes and arrangements will be determined through further discussions as the project moves forward.SK Telecom signed an MOU with OpenAI to collaborate on building the AI Data Center in the southwest region of Korea as part of 'Stargate Korea.' Leveraging its solid experience in data center construction and operation, SK Telecom and OpenAI will jointly develop next-generation computing and data center solutions. They will also explore various AI service use cases for consumers and enterprises.This government-backed collaboration signifies SK Group's strategic alliance with OpenAI and is expected to contribute positively to the development of Korea's AI ecosystem by combining SK's accumulated technology and infrastructure with the synergy of global cooperation. SK's involvement in the Stargate project is anticipated to solidify the AI economic alliance between South Korea and the United States. Korea's strengths in manufacturing and telecommunications complement the U.S.'s leadership in AI technology, forming a mutually beneficial and globally influential partnership.Since 2023, Chairman Chey and CEO Altman have built a mutual trust through multiple meetings, sharing a consensus on future directions in semiconductors, data centers, and other fields. They have discussed the development of dedicated semiconductors and infrastructure to cope with the global surge in AI training and inference workloads. They have discussed innovative joint development of next-generation AI infrastructure, including new memory-computing architectures to overcome hardware bottlenecks for AI models."Korea has the vision, technology, talent, and infrastructure to lead globally in AI," OpenAI CEO Altman said. "We're proud to partner with SK hynix as part of our Stargate initiative, supporting Korea's leadership in AI and contributing to its continued success.""This partnership marks the official beginning of comprehensive technological innovation cooperation spanning from chip development to data center construction and operation," SK Chairman Chey Tae-won added. "We are confident this collaboration will set a new paradigm in the global AI landscape and significantly advance the AI industry's future."Meanwhile, SK Group is advancing its portfolio by positioning AI as a key growth driver and strengthening alliances with global technology leaders. In August, the company held the groundbreaking ceremony for the SK Ulsan AI Data Center, reinforcing collaboration with global partners and reaffirming its commitment to AI innovation.Sam Altman, OpenAI CEO(left) and SK Group Chairman Chey Tae-won (right). SK hynix

SK hynix announced today that it has begun supplying its high-performance mobile NAND solution ZUFS 4.1 to customers, marking the world’s first mass production of this solution.The solution's adoption in the latest smartphones reinforces SK hynix's technological excellence in the global market. ZUFS 4.1 will enhance smartphones’ powerful on-device AI capabilities, offering users an innovative experience.SK hynix successfully completed the qualification process for the solution in June this year through close collaboration with customers. In July, the company began mass production and started supplying the product.ZUFS, or Zoned UFS, is an extended specification of UFS that applies Zoned Storage technology, which stores data in different zones based on its usage and characteristics.When installed in a smartphone, ZUFS 4.1 enhances the operation speed of the operating system (OS) and improves data management efficiency. As a result, it mitigates read performance degradation over extended use by more than four times compared to conventional UFS, enabling a 45% reduction in app launch times. Unlike conventional UFS, which writes new data by overwriting existing data, ZUFS 4.1 writes data sequentially. This data storage method has resulted in a 47% reduction in AI app launch times.These performance characteristics position ZUFS 4.1 as an optimal solution for today's mobile environment, where on-device AI and large-scale data processing are essential.In addition, SK hynix has significantly enhanced the error-handling capabilities of ZUFS 4.1 compared to version 4.0 developed in May 2024. By detecting errors with greater precision and clearly communicating the necessary corrective actions to the central processing unit, the latest solution is expected to significantly improve system reliability and recovery performance.“ZUFS 4.1, which we have successfully begun to supply, is the first solution developed and mass-produced through collaboration aimed at optimizing Android OS and storage devices. Looking ahead, its applications are expected to expand,” said Justin Kim, President & Head of AI Infra at SK hynix.“We will continue to supply NAND solutions that meet customer needs in a timely manner, while strengthening partnerships with global companies to strengthen our competitive edge in the AI memory sector.”Credit: SK Hynix

In the wake of the AI and Electric Vehicle (EV) era, efficient power supply and conversion have become a critical battleground. For over a decade, 3S Silicon Tech has been deeply committed to developing high-reliability packaging equipment for power devices and modules. Over the past five years, the company's formic acid vacuum reflow oven has gained widespread acclaim from leading international IDMs and the world's largest OSATs. Its remarkable advantages—including low void rates, flux-free soldering, and post-solder cleaning-free processes—effectively resolve metal oxidation issues, establishing 3S as a leading brand for high-end power module reflow packaging.From data to prediction: AI empowers equipment3S Silicon Tech's core technology utilizes AI to build process behavior models, enabling equipment to learn from data, predict, and self-optimize. Through machine learning (ML), the system analyzes vast amounts of data from sources like MES, sales, and SQL databases to identify key process variables.This allows the equipment to learn from past experience and provide precise parameter recommendations, leading to:1. Precise process tuning: The AI model recommends optimal parameters for different product types, ensuring perfect soldering every time. For example, baseline models for heating elements in various temperature zones are established before the equipment leaves the factory. By continuously monitoring the heating elements, the AI uses predictive analysis to issue early warnings before a malfunction occurs, ensuring process stability, preventing unexpected downtime, and even predicting the lifespan of the heating element.2. Yield and quality optimization: AI analysis quantifies the interactive relationships between different parameters and variables. Using a correlation matrix model, it provides optimal parameter recommendations for power modules, effectively boosting yield and product reliability.3. Precise predictive profiling: This technology effectively prevents up to 99.99% of equipment failures, optimizing production efficiency, reducing downtime, and significantly lowering maintenance costs.Green sustainability: Achieving flux-free solderingBeyond intelligence, this new launch also emphasizes sustainability. 3S Silicon Tech's AI-empowered formic acid vacuum reflow oven features a unique flux-free soldering capability. This not only enables a clean and highly reliable soldering process without the need for post-solder cleaning, but also reduces waste by up to 99%, providing a dual benefit of environmental protection and cost control for businesses.3S Silicon Tech sincerely invites you to SEMICON Taiwan 20253S Silicon Tech's AI-empowered formic acid reflow oven offers semiconductor manufacturers a highly efficient and easily implementable solution. This technology is specifically designed to address customers' void rate concerns, clearly demonstrating the immense application value of AI in semiconductor manufacturing. It further helps companies achieve a comprehensive upgrade in yield stability, predictive analysis, and maintenance optimization.3S Silicon Tech cordially invites all industry professionals and partners to visit our Booth Q5338 at Hall 2 of the Nangang Exhibition Center during SEMICON Taiwan from September 10-12, 2025. Come experience our cutting-edge AI and formic acid reflow oven technology and witness the journey toward smart, optimized manufacturing. For more information, please visit the 3S Silicon Tech Official Website.

The age of AI greatly boosts Semiconductor manufacturing demands in advanced packaging. As packaging complexity increases (more I/O, smaller bump pitches, higher density), making the integration of nano-precision platforms and thermal stabilization in Semiconductor automation a strategic investment.PBA Systems will debut its latest nano-precision dual gantry platform series and metrology stage series designed for CoWoS and smart manufacturing requirements, to be showcased in the 2025 SEMICON Taiwan exhibition, located at Hall 2, 1st floor, Booth Q5536 in the Taipei Nangang Exhibition Center from Sep. 10th to Sep. 12th.For semiconductor advanced packaging technologyThe technology drivers of Heterogeneous Integration Architectures in Semiconductor advanced packaging involve different materials and bump density, and drive different process equipment requirements. From 2.5D to 3D development, semiconductor advanced Packaging may require different Die Attachment Processes, from high-speed, high-accuracy to thermal compressed and hybrid bonding. These processes require highly precise, custom-designed platforms for automation.PBA's latest dual gantry nano precision platform series offers high precision solutions for flip-chip bonding, thermo-compression bonding, and hybrid bonding. Its special dual-gantry architecture facilitates special simultaneous, multi-axis motion controls for high-speed die bonding and precision assembly applications, with less floor space requirements and high yield rates. PBA offers fast custom design services.Key advantages of PBA dual gantry series include:Nanometer-level assembly accuracy to boost high throughput and yield rates.Design with controllable suppression of thermal expansion minimizes yield loss.Scalability to support heterogeneous integration and next-generation chip architectures.Custom-designed High-speed, high-precision positioning to ensure both productivity and process stability.Flexible joint design, reduction of vibrations and resonance, improved accuracyPowered by PBA motors, an advancement from traditional ball-screw or belt motors, enjoyed low cogging force with anti-cogging features.In addition to offering fast custom design solutions, PBA also offers 250,000 square feet of contract manufacturing space for flexible manufacturing plans for worldwide system partners.PBA will also showcase its Z-Axis High-Precision Positioning Stage series at the upcoming SEMICON Taiwan show. This stage series offers ideal motion solutions for vertical movement in semiconductor automation with limited space and high-precision requirements, ideal for AOI inspection and PCB pick-and-place applications.Leader in nano-precision stage and gantry solutions for automationPBA Korea specializes in high-precision stage technologies. PBA Group further merged Korea SOONHAN Engineering, Korea's leading manufacturer of precision stage systems for 31 years, powering PBA Group to become one of the world's top precision stage experts that provide dynamic custom design and manufacturing services. PBA Systems is also a technology-capable partner of Mitsubishi Electric and Applied Materials. PBA group's contract OEM manufacturing experiences for many world-renowned semiconductor equipment partners in Asia also differentiate the group from regional local vendors.Meet the expert tech talkThe SEMICON Taiwan show will feature several advanced technical talk sessions in dedicated show floor booth sections. In the Smart Manufacturing Expo section, PBA will participate in the Expert Talk session on September 12, located at Talk Booth Q5356, 1F, Nan-Gang Exhibition Hall 2. PBA will be presenting the highly anticipated speech topic: PBA's Dual-Gantry Precision Platform Series for Semiconductor Advanced Packaging and Metrology Equipment. This is a rare opportunity for industry professionals to gain smart manufacturing insights directly from the expert—don't miss it.Global reach, local serviceHeadquartered in Singapore, PBA Group has R&D and sales offices in Singapore, Taiwan, South Korea, Japan, Malaysia, China, the United States, and Europe. The Taiwan branch offers a one-stop solution, providing everything from direct drive motors and modules to custom-integrated, high-precision platform systems. This ensures fast, flexible, and innovative smart manufacturing services for both local and international clients.For system partners with product customization or procurement inquiries, please contact.PBA released their latest Nano-Precision Dual Gantry Stage Platform Series for Heterogeneous Semiconductor Advanced Packaging and Metrology Equipment. To Be Debuted at the 2025 SEMICON Taiwan. PBA

Chroma ATE Inc. will participate in SEMICON Taiwan 2025, presenting a full suite of breakthrough semiconductor test solutions. The showcase will focus on applications in AI chips, advanced packaging, high-performance computing (HPC), and AIoT—designed to meet the evolving demands of next-generation semiconductor testing.Advanced Packaging 3D Metrology Solutions - Chroma 7980/7981The Chroma 7980/7981 systems feature Chroma's patented BLiSTM technology, purpose-built for nanoscale critical dimension measurement. These systems incorporate application-optimized algorithms and user interfaces to deliver high-speed surface profiling and fast auto-focusing capabilities, along with large-area image stitching. They address key needs in advanced packaging processes such as TSV/VIA, RDL, probe mark inspection, overlay, and sub-micron surface profiling. Additionally, Chroma's inspection and in-situ AOI solutions, like the Chroma 7961, enable real-time defect detection and inline process quality control.AI-Driven Test Platform - Chroma 3680When hardware innovation meets AI-enhanced software, a new era of automated test equipment emerges.The Chroma 3680 platform is purpose-built to meet the demands of modern semiconductor testing, combining high-efficiency algorithms with a modular architecture to redefine flexibility and efficiency in test systems.This platform features a unified and intelligent system architecture that enables real-time, accurate test program conversion—reducing migration time and manpower by over 80%. It addresses key pain points such as poor portability of legacy test programs and time-consuming debugging processes, supporting diverse chip architectures with a concrete and effective solution.Chroma 3680 supports modular expansion to meet increasingly diverse future requirements, and can be equipped with the HDRF2 module for one-click activation of RF testing, greatly simplifying test setup. The overall platform is designed for high scalability and flexibility, enabling fast adaptation across different product lines, application needs, and test scales—streamlining both development and validation processes.Tri-Temp System-Level Test SolutionsChroma's 3100 and 3200 pick-and-place handler solutions, paired with the 31000R/31000K Series Temperature Forcing Systems, deliver a powerful, fully integrated platform to meet the unprecedented challenges of AI-era device testing.The advanced 3110, 3200, 3200-HD, 3210, and 3260 pick-and-place systems feature industry-leading SLT testing solutions, including a high-precision contact force system, CVOT (Chroma Virtual Operation Tools) for intelligent yield optimization, integrated device protection features, and a universal change kit design for fast, flexible device conversion. These systems ensure superior test quality through scalable architecture that integrates seamlessly into both engineering and high-volume production environments.The intelligent 31000R thermal solution provides a wide and stable temperature control range from –40°C to 150°C, with high-power dissipation capability up to 2,900 W. It features advanced thermal performance with direct phase-change cooling, intelligent power monitoring, and high-precision multi-zone control. This makes it ideal for AI, HPC, and thermally demanding automotive applications.SuperSizer Nano-Particle Monitoring SystemsPowered by advanced aerosol particle measurement technology, the SuperSizer system delivers precise monitoring of nano-sized particles ranging from 3 nm to 20 nm, overcoming the limitations of conventional optical systems, especially bubble interference.The SuperSizer II, V, VI, and VII generations have been widely adopted for real-time monitoring of critical wet chemicals such as CMP slurry, isopropyl alcohol (IPA), hydrogen peroxide/pure water, and ammonia solutions. The latest addition to the series, SuperSizer VIII, is purpose-built for hydrochloric acid monitoring—extending the system's capabilities into more aggressive chemistries.By enabling in-line and real-time particle detection, the SuperSizer platform helps minimize wafer defects, ensure chemical purity, and improve overall process yield.Visit Chroma at SEMICON Taiwan 2025From September 10–12, Chroma ATE will exhibit at SEMICON Taiwan 2025 at the Taipei Nangang Exhibition Center, Hall 1, 1F (Booth K2876).In addition to showcasing our wide-ranging portfolio of test solutions, Chroma will present at the Semiconductor Advanced Inspection and Metrology Forum. Our presentation "White-Light Interferometry Integration with Electromagnetic Simulation and Digital Light-Field Control for Advanced Packaging" will explore innovative applications of advanced packaging inspection and metrology technologies.Join us at SEMICON Taiwan 2025 and connect with our team to exchange insights on the future of test and innovation.Chroma ATE Inc. will participate in SEMICON Taiwan 2025, presenting a full suite of breakthrough semiconductor test solutions. The showcase will focus on applications in AI chips, advanced packaging, high-performance computing (HPC), and AIoT—designed to meet the evolving demands of next-generation semiconductor testing. Chroma ATE Inc.