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REALTIME NEWS
Analysis: Can Tesla's thruster-equipped Roadster hit public roads? US, China, EU regulations pose hurdles
Electric Vehicles
0min ago
Samsung Foundry targets automotive, edge AI chips with 8LPU+
Semiconductors
1min ago
AUO reshapes businesses with 'quasi-holding company' model
Displays
1min ago
UMC, AP Memory advance AI chip power delivery with validated DTC silicon capacitors for advanced packaging
Semiconductors
1min ago
Oppo targets premium smartphone growth with global Find X10 launch
Communications
2min ago
Taiwan, UK expand offshore wind, CCUS energy cooperation
Sustainability
2min ago
Lam Research sees WFE topping US$200 billion in 2027
Semiconductors
2min ago
PSMC eyes Taiwan, Japan, Singapore for 3D AI foundry expansion
Semiconductors
6min ago
Compal and Verda expand AI cloud infrastructure partnership
ICT
6min ago
Midea's Clivet targets AI cooling market with compressor redesign
ICT
6min ago
SK Hynix reportedly engages suppliers to bring 30% more efficient iHBM cooling to HBM5 production
Semiconductors
6min ago
AMEC ships first Primo Domingo selective etching system, targeting critical gaps in China's advanced 3D chipmaking
Semiconductors
12min ago
Nvidia’s DSX POD reshuffles supply chain structures
Tomorrow's Headlines
Oct 22, 18:19
AMEC delivers first high-selectivity etch tool for advanced 3D devices
Tomorrow's Headlines
Oct 22, 18:19
Commentary: Unitree valuation correction puts Physical AI commercialization to the test
Tomorrow's Headlines
Oct 22, 18:19
PSMC capacity shortage weighs on Jeju Semiconductor growth
Tomorrow's Headlines
Oct 22, 18:19
Analysis: Nvidia’s Vera CPU expands AI infrastructure challenge for Intel and AMD
Tomorrow's Headlines
Oct 22, 18:19
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COMPUTEX
Thursday 2 July 2026
TEAMGROUP Showcases self-destruct SSD amid AI memory boom
As the AI computing race accelerates and semiconductor manufacturing capacity is increasingly redirected toward advanced memory, the memory industry is shifting from price-driven competition to a battle over resource allocation and supply security...
Thursday 11 June 2026
Cincoze to Showcase Comprehensive Edge AI Solutions at Computex 2026
Rugged edge computing brand – Cincoze will showcase its latest embedded computing solutions at COMPUTEX Taipei 2026, from June 2–5 (Hall 2, Booth Q0401a)...
Monday 19 May 2025
COMPUTEX's Special Issue
Technology news, product launches and show highlights from the event attendees available for download (PDF).
LATEST STORIES
Wednesday 14 October 2026
GMIF 2026 Awards: Samsung, Sandisk, BIWIN, and Others Honored
The 5th GMIF Innovation Summit (Global Memory Innovation Forum 2026, GMIF2026) recently concluded at the Renaissance Shenzhen Bay Hotel, co-hosted by the Shenzhen Memory Industry Association (SMIA) and the School of Integrated Circuits, Peking University...
Wednesday 14 October 2026
Hybrid Copper Bonding - A Manufacturing Lever for The AI Era
The current growth cycle of the semiconductor industry is driven by the demand for logic and memory tied to artificial intelligence (AI), cloud infrastructure, and advanced electronics. This growth is expected to remain robust until 2026 and beyond. The Asia-Pacific region is one of the leading growth regions in this outlook.
Wednesday 14 October 2026
Practical Insights & Industry Ideas
How can AI become more powerful and, at the same time, more energy-efficient? How is the electronics industry adapting to new cyber resilience requirements? And what is driving the All Electric Society forward? electronica 2026 provides answers to these questions not only in the exhibition area of its 18 exhibition halls, but also through its extensive supporting program...
VIDEOS
SEMICON Exclusive Interview|Powering the AI Era: The Role of Advanced Materials
SEMICON Exclusive Interview|Enabling Mass Production of Silicon Photonics & CPO for AI
SEMICON Exclusive Interview|Syensqo Unboxed: FFKM, Galden & Sustainable Polymers
Straight from SEMICON 2026|ZEISS, Henkel, Tescan, and camLine
Straight from SEMICON 2026|PBA Systems, Rigaku, and ABB
COMPUTEX Exclusive|PEGATRON’s NVIDIA Rubin Racks & Physical AI Explained
MULTIMEDIA
K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
MOST-READ
7 DAYS NEWS
TSMC locks in 3-6% wafer out price hikes for 2027
TSMC, Intel named as Musk's Terafab ambitions face reality check
GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap
Beyond 16 layers: HBM stacks test advanced packaging equipment makers
TSMC breaks silence on Musk's Terafab: Talks underway, but fab control non-negotiable
Exclusive: Apple raises iPhone Duo shipment target 44% on strong preorders
Hyundai revamps lineup as Taiwan's hybrid car market enters two-year battle over powertrain systems
Micron skips 4F² for 3D DRAM as CXMT pushes ahead
Charts: Nvidia's China AI chip lead shrinks 80% as Huawei closes in
Samsung reportedly overhauls DRAM, NAND R&D incentives to retain talent and accelerate next-gen memory chips
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