Taipei, December 11, 2025: Dimerco Express Group ("Dimerco") has announced that it is strengthening its integrated, Asia-focused logistics solutions to help customers capture growth from AI and "Taiwan+, China+" manufacturing while managing risks from congestion, regulatory changes and shifting capacity

At COMPUTEX 2025, ASUS showcased its comprehensive AI infrastructure solutions, targeting the computing needs of data centers, edge computing, and a wide range of intelligent applications. With a robust product portfolio, ASUS brings to life the NVIDIA AI Factory vision, illustrating how AI will be deeply embedded into enterprise IT infrastructure. This evolution continues to drive forward applications and services that shape the future of AI and high-performance computing

Technology news, product launches and show highlights from the event attendees available for download (PDF).

As the global satellite communications industry rapidly advances toward a multi-orbit, multi-band architecture, the flexibility and scalability of ground terminal equipment have become core concerns for operators. Ultraband Technologies announced it will showcase its 16×16 Ku-band phased array module at the Taiwan Space Pavilion during Satellite 2026. Through a modular design philosophy, the company delivers more flexible and scalable terminal solutions for multi-orbit, multi-band satellite communications.Against the backdrop of multi-orbit, multi-frequency satellite networks gradually taking shape, ground terminal equipment must simultaneously support satellite systems operating across different orbits and frequency bands. However, when implementing multi-orbit, multi-frequency architectures, operators face the common challenge of rapidly escalating costs associated with mass production and large-scale deployment for terminals centered around phased array antennas. To address this need, Ultraband Technologies proposes a predictable and consistent ground terminal evolution strategy. This approach assists global satellite operators managing multiple satellite constellations in maintaining technological platform consistency while effectively addressing cost and performance challenges during mass production and deployment phases.Modular Stitching Architecture: Supports gradual expansion from UAV BLOS (Beyond Line of Sight) applications to large ground terminal equipment. Operators can enhance system capabilities through modular expansion, adapting to different orbital or frequency strategies and mission requirements without replacing the entire platform.Multi-Orbit, Multi-Band Switching Design: Collaborating with industry partners to enable a single terminal device to support multi-orbit and multi-band switching capabilities. This allows equipment to operate flexibly across different satellite orbits and frequency band systems, further reducing terminal SKU counts and lowering overall operational costs.Gallium Nitride (GaN) Technology: Integrating proprietary GaN design and process capabilities, this technology enhances signal output power while maintaining low power consumption and superior thermal performance. This ensures high stability and reliability for equipment operating in prolonged and all-weather environments.Ultraband Technologies'newly launched 16×16 Ku-band phased array module serves as a Proof of Concept (POC) and early testing platform, open for evaluation and validation by satellite operator technical teams and research institutions. Through real-world application testing, it assists industry partners in verifying the feasibility of antenna architecture design and field deployment processes prior to formal commercial deployment.For multi-orbit, multi-band operators, this signifies that phased array ground equipment is evolving from a high-performance technology demonstration into deployable, repeatably scalable, and operationally ready infrastructure, laying the foundation for the future large-scale development of satellite communication networks.In the drive toward seamless system implementation, Ultraband Technologies is collaborating with a strategic network of domestic and international partners - including Ubiqconn Technology - to leverage extensive expertise in ruggedized system integration and manufacturing.By introducing a cutting-edge Fast Calibration Mechanism, the collaboration effectively addresses the industry's mass production bottlenecks. This innovation significantly shortens calibration cycles for phased array systems during the manufacturing stage, ensuring superior batch consistency and drastically reducing system tuning costs for large-scale deployments.Ultraband Technologies will showcase the aforementioned phased array modules and related technological achievements during the Satellite 2026 exhibition, engaging in collaboration and exchange with global satellite operators, system integrators, and industry partners.Satellite 2026 Exhibition InformationExhibition Dates: March 23–26, 2026Venue: Walter E. Washington Convention CenterBooth Number: Taiwan Space Pavillion #2747Click here for more information.Ultraband

EDOM Technology (TWSE: 3048), Asia's best solutions partner, will participate in NVIDIA GTC for the third consecutive year under the theme "From AI to Action: Physical AI in Motion." Together with ecosystem partners, EDOM will showcase its latest AI computing platforms, key components, and system integration capabilities. At Booth #242, EDOM will present physical AI and robotics solutions powered by NVIDIA Jetson hardware and software resources, demonstrating how AI technologies are being developed and deployed across diverse fields such as smart healthcare, vision recognition, and speech understanding. The showcase will highlight EDOM's capability to connect the AI ecosystem and accelerate industry innovation through integrated solutions.During the GTC exhibition, EDOM Technology plans to demonstrate several innovative applications that combine physical AI with edge computing. With the introduction of the NVIDIA Jetson Thor, AI inference and control architectures can now be integrated into a single system, providing a high-performance computing foundation for real-time closed-loop control and multimodal sensing, and accelerating the real-world deployment of multimodal intelligent robots.In the robot interaction showcase, EDOM collaborates with Algoltek to present "Dexterous Hand AI."Powered by 4D AI Vision technology and vision-action models, the system can recognize and predict audience hand gestures in real time and respond accordingly. This demonstration highlights low-latency AI inference and instant feedback, while also presenting a complete Sim-to-Real workflow, from virtual simulation to physical deployment. EDOM also partners with Nexuni to present "AI Workforce: Embodied Intelligence." Built on the NVIDIA Thor platform, the system enables dual-arm robot manipulation through few-shot learning. The demonstration shows a service robot performing household tasks, including object recognition, grasping, and fabric folding. Because fabric is a highly deformable material, handling it requires complex visual perception, state estimation, and coordinated dual-arm control. By leveraging Jetson Thor's edge AI inference and real-time dynamic path correction, the system continuously adjusts its movements during the folding process, improving task success rate and operational stability. This highlights the potential of physical AI in smart manufacturing, human-robot collaboration, and service robotics.In the area of enterprise AI and smart biotech applications, EDOM collaborates with Avalanche Computing to showcase the "Secure Offline Generative AI" platform. Combining enterprise-grade private LLMs with real-time speech intelligence, the platform runs on the NVIDIA Jetson edge platform, enabling low-latency offline speech recognition and semantic analysis. This allows generative AI to deliver real-time interaction within highly secure enterprise environments. EDOM is also working with CyteSi to present the "Software-Defined High-Throughput Wet Lab," an AI-driven laboratory automation platform. CyteSi's EWOD (Electrowetting-on-Dielectric) technology digitally controls micro-droplets with precision, supporting workflows such as NGS sample preparation, drug discovery, and synthetic biology research. The system uses NVIDIA Jetson as its edge computing core, integrating biochips from Japan Display Inc. (JDI) with real-time image analysis capabilities to provide an intuitive user interface and highly efficient experimental workflow, advancing AI adoption in smart biotech research and automated laboratories.In addition, EDOM will showcase the "NVIDIA Jetson Thor Peripheral Ecosystem," integrating a range of EDOM-certified peripheral components, including high-speed storage, Wi-Fi 6/6E and 5G communication modules, GMSL and MIPI cameras, 10G high-speed networking, sensors, camera modules, and high-speed I/O interfaces. This ecosystem helps developers rapidly build next-generation robotics and physical AI systems. Through comprehensive hardware integration and platform support, EDOM assists robotics developers in accelerating product design, deployment, and mass production, further expanding the physical AI and Jetson Thor ecosystem.Jeffrey Yu, CEO of EDOM Technology, stated, "The key to physical AI lies not only in computing performance, but in comprehensive hardware–software integration and ecosystem collaboration. Through NVIDIA's Three-Computer architecture and the Jetson Thor platform, we help customers build scalable, production-ready, end-to-end AI solutions - from model training and simulation validation to edge deployment." He further noted that EDOM is not just a hardware supplier, but is committed to integrating peripheral modules, AI software frameworks, and partner resources to help enterprises accelerate the adoption of AI and robotics technologies.EDOM Technology invites industry professionals, developers, and partners to visit Booth #242. Attendees are also welcome to check out the in-person session featuring Wilson Yen, Product Director at EDOM. The talk explores how EDOM leverages NVIDIA "Three Computers" architecture to help enterprises transform AI models into real-world applications, covering key domains such as computer vision, robotics, and edge AI. Participants are encouraged to add this session to their personal GTC schedule to experience firsthand the innovation of physical AI in action, and to explore the future of intelligent robotics and edge AI. Register now through EDOM's dedicated link to enjoy special GTC Conference registration offers. 

SK hynix Inc. (or "the company", www.skhynix.com) announced today that it is participating in GTC 2026, held from March 16 to 19 in San Jose, California. NVIDIA GTC is the global AI conference where business leaders and developers gather to share the latest breakthroughs and future trends in AI and accelerated computing.SK hynix memory solutions are designed to minimize data bottlenecks and maximize performance for both AI training and inference in NVIDIA AI infrastructure. Through its participation in GTC 2026, the company plans to demonstrate its competitive edge in memory technology - the core infrastructure of the AI era.Under the theme 'Spotlight on AI Memory,' SK hynix will feature an exhibition space dedicated to the AI memory technologies and solutions. The booth will consist of three main areas: the NVIDIA Collaboration Zone, the Product Portfolio Zone, and the Event Zone. The exhibition is designed around interactive content to provide visitors with an intuitive understanding of AI memory technology.The NVIDIA Collaboration Zone, located at the entrance, is the centerpiece of the exhibition, highlighting the synergy between SK hynix and NVIDIA. The company will display the memory configuration mounted on GPU-based AI accelerators through physical models and actual hardware, focusing on the actual application of SK hynix's memory products such as HBM4, HBM3E, and SOCAMM2 designed for NVIDIA AI platforms.Notably, the company will showcase a liquid-cooled eSSD developed in collaboration with NVIDIA, along with an NVIDIA DGX Spark, desktop AI supercomputer equipped with SK hynix's LPDDR5X.In the Product Portfolio Zone, visitors can view a comprehensive lineup of memory products engineered for the AI era. This includes the infrastructure-essential HBM4 and HBM3E, as well as high-capacity server DRAM modules, LPDDR6, GDDR7, eSSD, and Automotive Solutions.An interactive environment allows visitors to use joysticks to select products and view specific features and use cases on-screen, enabling them to explore and understand the technology at their own pace.The Event Zone offers a hands-on experience with an 'HBM 16-High Stacking Game.' By virtually stacking memory chips, participants can gain insight into the TSV (Through Silicon Via) process and high-stack packaging technology, fostering a deeper understanding of how high-performance AI semiconductors are manufactured.Throughout GTC 2026, SK hynix plans to explore future collaboration strategies aligned with current global AI trends. Key executives, including SK Chairman Chey Tae-won and SK hynix CEO Kwak Noh-jung, will meet with global tech giants to share insights on AI evolution and infrastructure shifts while discussing long-term strategic partnerships.The company will also host technical sessions to discuss the future of AI-driven manufacturing and the pivotal role of memory technology in achieving high-performance AI.SK hynix highlighted that as AI technology evolves, memory is transcending its role as a mere component to become a core element that determines the architecture and performance of the entire AI infrastructure. By applying its memory expertise across the entire AI spectrum - from data centers to on-device applications - the company aims to shape the future of AI alongside its global partners.HBM-GPU model shows SK hynix and NVIDIA AI collaboration. Credit: SK hynixSOCAMM2 and HBM4 on NVIDIA Vera Rubin Superchip. Credit: SK hynix