Taipei, December 11, 2025: Dimerco Express Group ("Dimerco") has announced that it is strengthening its integrated, Asia-focused logistics solutions to help customers capture growth from AI and "Taiwan+, China+" manufacturing while managing risks from congestion, regulatory changes and shifting capacity

At COMPUTEX 2025, ASUS showcased its comprehensive AI infrastructure solutions, targeting the computing needs of data centers, edge computing, and a wide range of intelligent applications. With a robust product portfolio, ASUS brings to life the NVIDIA AI Factory vision, illustrating how AI will be deeply embedded into enterprise IT infrastructure. This evolution continues to drive forward applications and services that shape the future of AI and high-performance computing

Technology news, product launches and show highlights from the event attendees available for download (PDF).

As global AI computing platforms continue to evolve toward higher density, increased power demands, and rack-scale integration, Chenbro unveiled its latest AI server chassis solutions at NVIDIA GTC 2026. The showcase features the NVIDIA MGX 1U Compute Tray for NVIDIA Vera Rubin NVL72 systems, along with a comprehensive product portfolio based on NVIDIA MGX architecture, demonstrating Chenbros integrated capabilities spanning system design, thermal optimization, and rack-level deployment.Building on its close integrations with the NVIDIA ecosystem, Chenbro presented multiple server chassis solutions designed in alignment with NVIDIA reference architectures and the NVIDIA MGX architecture. These solutions address high-density computing, liquid cooling technologies, and enterprise-grade deployment requirements, enabling cloud service providers(CSPs) and enterprise data centers to accelerate AI infrastructure deployment.NVIDIA MGX 1U Compute Tray for NVIDIA Vera Rubin NVL72- A New Standard for High-Density AI ComputingAs next-generation AI training and inference workloads continue to scale rapidly, data centers face increasing demands for space efficiency and advanced thermal design. At NVIDIA GTC 2026, Chenbro highlights the NVIDIA MGX 1U Compute Tray for Vera Rubin NVL72, engineered with optimized mechanical design and airflow management to deliver high-density computing within a 1U footprint. The solution is tailored for large-scale model training and high-performance inference applications.Chenbro also showcases:NVIDIA MGX 1U for NVIDIA GB200 NVL4, supporting high-performance inference and flexible deployment.NVIDIA MGX 2U Vera Server Chassis, offering enhanced scalability and enterprise-level integration options.Together, these solutions demonstrate Chenbro's system integration expertise under the NVIDIA MGX architecture framework.NVIDIA MGX Rack- Advancing from System Integration to Rack-Scale DeploymentAs AI infrastructure expands from individual systems to rack-scale environments, Chenbro highlights its integration capabilities based on NVIDIA MGX architecture. The company leverages its strengths in mechanical design and mass production to support the deployment of high-density AI computing environments in modern data centers.By closely aligning with NVIDIA reference architectures and the broader NVIDIA MGX ecosystem, Chenbro enables customers to extend from system-level builds to rack-level integration, accelerating scalable AI infrastructure deployment.NVIDIA MGX 6U Liquid-Cooled Server Chassis- Liquid Cooling for High-Power AI PlatformsIn response to power consumption and energy efficiency requirements for AI platforms, Chenbro presents the NVIDIA MGX 6U Liquid-Cooled Server Chassis. Designed to support high-power liquid-cooled deployment architectures, the solution enhances thermal efficiency and improves data center power usage effectiveness (PUE) through optimized mechanical and fluid management design, ensuring stable operations for next-generation AI data centers.Additional showcased solutions include:NVIDIA MGX 4U Air-Cooled Server Chassis and NVIDIA MGX 2U Short-Depth Server Chassis.These offerings provide flexible deployment options for enterprise server rooms and diverse application scenarios.Strengthening Global Footprint and AI Infrastructure CapabilitiesChenbro CEO Corona Chen stated that as AI applications continue to expand, market demand for high-density computing, liquid cooling, and rack-scale integration capabilities is rapidly increasing. Chenbro will continue deepening its collaboration within the ecosystem, strengthening its integrated R&D and manufacturing capabilities to help customers accelerate the adoption of next-generation AI platforms.                                                      With its global manufacturing footprint and localized service capabilities, Chenbro is committed to supporting diverse deployment needs across AI, HPC, and data center applications—driving sustained operational growth and industry competitiveness.At GTC 2026, Chenbro not only presents its product portfolio but is supporting NVIDIA AI platforms from system integration and thermal optimization to rack-scale deployment, enabling scalable AI infrastructure development worldwide.Chenbro supports diverse AI, HPC, and data center deployment needs. Credit: Chenbro

NEXCOM, A leading global provider of industrial computing and automation technology, is coming to Embedded World in Nuremberg (booth 3/341) with ambitious goals. With the help of European partners, the company aims to further expand its AI presence in edge applications, including automation, rugged mobile computing, safety-oriented robotics, smart cities, on-premises GPT, and industrial cybersecurity."As robots increasingly become the primary physical carriers for AI capabilities, NEXCOM is committed to accelerating their adoption across various industries," explains CEO Clement Lin, who will be attending Embedded World himself. "At Embedded World 2026, we will be presenting, among other things, a comprehensive range of safety-certified industrial robotics solutions in collaboration with the German robotics innovators. These solutions are specifically designed for smart factories, service robots, automotive manufacturing, and logistics."NEXCOM Robotic Solutions: Building a Safety-Oriented Foundation for Physical AIThe integration of physical AI into industrial environments requires rigorous and comprehensive safety certification for every component, from joint actuators and control motors to safety sensors, to ensure safe human-machine collaboration. As the central architect of the intelligent machine ecosystem, NEXCOM Robotic Solutions offers a robust motion control platform integrated with joint drive modules and safety software from European partner Synapticon. These solutions enable developers to significantly shorten development cycles while achieving the highest safety standards for robots used in manufacturing, logistics, and automated services."Over the past 34 years, NEXCOM has gradually evolved into one of the world's leading providers of robotics, IoT, and Industry 4.0 solutions. NEXCOM's extensive portfolio and long-standing experience in the global market perfectly complement the innovations developed by our team in Europe," reports Simon Fischinger, CEO at Synapticon. "Especially in the field of AI-based robotics, enormous opportunities are emerging as leading providers opt for open standards, enabling them to collaborate efficiently with partners."To further accelerate the deployment of safe and flexible robotic applications, NEXCOM is also collaborating with Botfellows, a German high-tech robotics startup specializing in safety-driven automation solutions. Botfellows focuses on enabling flexible and efficient robotic applications through software-defined safety architectures and intuitive robot programming."Physical AI will only scale if robotics becomes significantly easier and safer to deploy," says Dr. Mohamad Bdiwi, CEO of Botfellows. "Our collaboration with NEXCOM and Synapticon demonstrates how the combination of edge AI computing, advanced motion control, and software-defined safety enables a new generation of flexible robotic systems for smart factories and logistics."Embedded World 2026 Highlight: Unlocking the Potential of SD Edge ComputingUnder the motto "Unleashing the Genius of SD Edge Computing," NEXCOM's presentation is divided into two main areas: AIoT solutions and AI computing. The exhibition demonstrates the enormous potential of Software-Defined Edge Computing (SDEC) using real-world implementations of Edge AI and Physical AI in global AIoT infrastructures.Key product highlights include:NDiS B340: A rugged edge computing computer specifically designed for the demanding requirements of smart healthcare.APPC 160/210 C21: Industrial touch computers for high-performance AI applications in smart factories.IP67 AI edge telematics: Innovative, rugged solutions for challenging outdoor and vehicle environments.NEXCOM remains committed to accelerating the practical implementation of intelligent applications. From high-performance AI computing platforms and physical AI to comprehensive AIoT operating frameworks, NEXCOM delivers innovative products that empower the next generation of AI-driven businesses and improve people's lives.NEXCOM at Embedded World 2026NEXCOM invites trade show visitors to discover the future of autonomous innovation at its booth (4/341) in Nuremberg. Those interested can experience firsthand how NEXCOM's software-defined solutions are transforming the landscape of industrial automation and edge intelligence.For more information, please visit.

In Taiwan's older urban neighborhoods, five- or six-story walk-ups are common. For elderly residents living with chronic conditions such as diabetes, even a routine hospital visit can become a grueling physical ordeal - often requiring the assistance of family members or caregivers. This simple yet often overlooked reality became the catalyst for a major innovation in AI-powered healthcare.A group of international Ph.D. students at Taipei Medical University (TMU), known as the TSY-AI Team, set out to address this pain point. Their goal was clear: to bring diagnostics directly into people's homes. This result is a disposable, AI-integrated biosensor system capable of measuring blood glucose and pH levels with just a drop or two of blood - and delivering results in under 10 minutes, all without the need to leave the house. This groundbreaking platform recently earned the team the Bronze Medal at the 2025 Best AI Awards, hosted by Taiwan's Ministry of Economic Affairs. "We're not just building a chip. We're building a full platform," says Asaduzzaman, the team's representative and a Ph.D. candidate from Bangladesh. "Something that supports long-term chronic care while reducing unnecessary hospital visists.”At the core of the platform is the 3DISFETCHIP, a three-dimensional ion-sensitive field-effect transistor (3D ISFET) engineered to capture biochemical data from just minimal blood samples. The chip, housed in a disposable microfluidic chamber, connects to a mobile app that displays blood glucose and pH results within 10 minutes.But the innovation doesn't stop there. The system also incorporates AI-powered image recognition, enabling patients to photograph wounds - such as diabetic foot ulcers - and receive real-time analysis of healing progress. Over time, this feature allows doctors to remotely track wound recovery without requiring in-person visits."I saw the announcement for the Best AI Award in the newspaper," recalls Asaduzzaman. "We had just finished the core development work for our biosensor and thought - why not apply?""But for us, it wasn't about the competition," he adds. "It was about sharing our idea with Taiwan's AI and healthcare communities. We wanted to show students, researchers, and industry leaders that AI medical devices can be both simple and impactful."The response from the event was overwhelming. Visitors from the medical device industry expressed surprise at the product's affordability and ease of use. Some even opened conversations about future partnerships.With product development progressing, the TSY-AI Team is now evaluating Taiwan as a long-term base for commercialization."Taiwan has world-class semiconductor capabilities, and the startup ecosystem here is extremely welcoming," Asaduzzaman explains. "We've spoken with major players like Wistron, as well as smaller chip manufacturers, all of whomare very open to supporting medical AI solutions like ours."In addition to hardware partnerships, the team has also initiated collaboration with local hospitals. They have completed preliminary testing with animal models and controlled human samples, and are currently preparing to apply forInstitutional Review Board approval. Clinical trials are planned with Taipei Medical University Hospital and Shuang Ho Hospital.While the current system focuses on glucose and pH monitoring, the team is actively expanding its biomarker detection capabilities. Plans are underway to incorporate inflammation markers, HbA1c, and early indicators of infection - all from the same minimal blood sample."We want to turn this into a multi-analyte health platform that gives both patients and doctors a comprehensive view of physical conditions from home," says Asaduzzaman. "I believe the future of medical diagnostics is home-based. Patients shouldn't need to visit hospitals every week just to monitor chronic conditions. They should be able to do it easily, safely, affordably, and accurately from home."TSY-AI Team won the Broze Award  in the International Group IC Design Category at the 2025 Best AI Awards. If you have innovation would like to present, 2026 Best AI Awards with global tracks open for both AI Applications and IC Design, students and companies worldwide can compete for the grand prize of up to USD 30,000 (NTD 1,000,000). The deadline is March 16, 5:00pm (GMT+8). For more details, please follow official Linkedin for the lastest updates.