As the AI computing race accelerates and semiconductor manufacturing capacity is increasingly redirected toward advanced memory, the memory industry is shifting from price-driven competition to a battle over resource allocation and supply security. The rapid expansion of high-bandwidth memory (HBM) production continues to consume advanced fabrication capacity, constraining the supply of conventional memory products and creating persistent shortages across the market. This concentration of high-end production has widened the supply-demand gap, driving the average selling prices of certain premium memory products to levels eight to ten times higher than previous norms

Rugged edge computing brand – Cincoze will showcase its latest embedded computing solutions at COMPUTEX Taipei 2026, from June 2–5 (Hall 2, Booth Q0401a). Cincoze will display its full range of edge computing solutions around the theme of "Smarter, Faster, More Reliable - Powered by Edge AI" encompassing the full spectrum of edge application environments in four dedicated zones, including DIN-Rail computers, industrial panel PCs and monitors, rugged embedded computers, and GPU embedded computers

Technology news, product launches and show highlights from the event attendees available for download (PDF).

LITEON Technology is actively capitalizing on the AI boom by restructuring its data center infrastructure around megawatt-scale power, rack and liquid cooling. The company has developed high-density 800 VDC power architectures and advanced cooling systems to support massive, next-generation AI accelerators.At COMPUTEX 2026, LITEON hosted the "AI Summit Panel" on the opening day, themed "Powering the AI-driven Future: Scaling AI Across Architecture, Systems, and Infrastructure." Moderated by Colley Hwang, Chairman of DIGITIMES, the Panel brought together industry leaders from NVIDIA, Infineon and GIGABYTE to examine how AI is reshaping the technology landscape. The discussion highlighted how rapid AI adoption is driving structural changes brought across the ecosystem, particularly in data center infrastructure and power demand. As AI scales, power availability and efficiency are becoming central considerations, with AI factories emerging as a defining paradigm in the next phase of industry development.Hwang opened by noting that AI has become a key driver of global productivity growth and is expected to generate trillions of dollars in economic value. As a result, infrastructure and deployment models are being fundamentally reshaped, with data centers rapidly evolving into AI factories. In this transition, the availability and reliability of energy have emerged as critical enablers of large-scale deployment, elevating power and cooling from supporting functions to core elements of system architecture.More than just chips, AI revolution requires huge energyNVIDIA Senior Director, HPC and AI Hyperscale infrastructure Solutions, Dion Harris spoke first. He referenced NVIDIA CEO Jensen Huang's speech in the NVIDIA GTC Taipei held in the previous day, addressing the "five-layer cake" analogy to illustrate AI from being just a software tool into a vast, vertically integrated industrial system. At the very bottom of the cake is "energy". Before the AI can showcase real-time intelligence, the systems fundamentally rely on efficient and stable power supply."Building AI factories goes beyond compute-you have to power them, cool them, and run them reliably to truly monetize AI," said Dion Harris at NVIDIA. "Infrastructure and energy play a critical role in determining token cost and performance per watt. As Jensen Huang's‘five-layer cake’ illustrates, without strong foundational layers, higher-level innovation cannot scale. This is why ecosystem collaboration is essential."Harris further mentioned NVIDIA DSX platform as a blueprint for AI factory development, defining how next-generation infrastructure is designed, built and operated. Under this framework, AI factories are evolving to support rapidly growing token demand driven by today's AI applications. He emphasized that achieving optimal token cost and performance per watt ultimately relies on strong ecosystem collaboration, noting that partners like LITEON play a critical role in delivering the power, cooling, and operational capabilities required to support frontier and open-source AI workloads at scale.Dr. Sergio Rossi, Vice President of Application Marketing at AI and Power division of Infineon Technologies, noted that AI adoption accelerates, the key competitive bottleneck is shifting from compute to energy, especially in regions such as Europe where electricity availability has become increasingly constrained. That's the reasons why LITEON, NVIDIA, GIGABYTE and Infineon engage in collaboration to have several steps forward to make sure the design is using the right technology, architecture and solutions for securing AI development to use energy in the most efficient manner."Just improving energy efficiency by a few percentage points can translate into saving power at the scale of an entire city, highlighting how critical efficiency has become in AI data center development," said Dr. Serio Rossi.Rossi further highlighted that the AI ecosystem is facing three key complexities, including acceleration, with development cycles shortening from 30 months to 6 months; increasing architectural complexity driven by the adoption of 800 VDC in next-generation data centers; and rapid innovation in power technologies such as SiCs and GaNs to enhance energy efficiency. To address these challenges, he emphasized the importance of close ecosystem collaboration, where infrastructure stakeholders work together to anticipate future demand and align on technology roadmaps with partners such as Infineon at an early stage. This enables faster development cycles and accelerates innovation in power and infrastructure solutions for evolving AI requirements.Leo Wang, EMEA regional Product & Marketing Lead at Giga Computing, talked about how the company collaborates with industry leaders to advance AI performance through hardware innovation and liquid-cooled server solutions optimized for AI workloads. He noted that as AI infrastructure evolves, the focus is extending beyond server performance to broader data center challenges, particularly in power and thermal management.Wang added that maximizing the value generated from available energy is becoming a key industry priority, making close ecosystem collaboration essential. Leveraging Taiwan's strong supply chain and close engagement with global partners, this collaboration is helping to establish scalable deployment models and best practices for global AI adoption."We are now dealing with increasingly heterogeneous machines, from training systems to different AI applications, so power and space both need to be carefully managed, as all of these resources are limited," said Leo Wang at Giga Computing, "Everything comes down to how we build a proper data center and a proper environment to serve the server in a consistent way. It is no longer just about building servers, but about optimizing at the data center level to ensure power is allocated and utilized in an effective and efficient way."From Power to Infrastructure: Enabling the Next Phase of AI ScalingIn response to the energy and infrastructure challenges highlighted in the panel, LITEON showcased its integrated capabilities across power, mechanical, and thermal systems to support next-generation AI infrastructure at COMPUTEX 2026. LITEON debuts 800 VDC liquid-cooled power rack, alongside a comprehensive portfolio of solutions, including the 110kW power shelf for NVIDIA Vera Rubin NVL72 platforms and the 280kW in-rack CDU. Together, these offerings address the growing demand for high-density and energy-efficient AI infrastructure, demonstrating LITEON's ability to integrate power delivery, thermal management, and system design to support scalable AI deployment, and reinforcing its role as a key enabler in the evolution toward megawatt-scale AI data centers.

Nuvoton Technology Corporation announced that it has agreed to collaborate with Qualcomm Technologies, Inc. on system-on-chip (SoC) products primarily targeting tethered XR Glass applications. Through this collaboration, Nuvoton will combine its tethered XR Glass–optimized SoCs with Snapdragon XR platforms, and its software ecosystem to accelerate the development and deployment of tethered XR Glass applications and to support industry expansion.XR glasses are increasingly being adopted, particularly in industrial and enterprise fields, for use cases such as operational support, remote assistance, and information visualization. At the same time, achieving compact and lightweight designs, long battery life, and comfortable user experience remains a key challenge for broader market adoption.Nuvoton has been providing SoCs that balance the processing performance and low power consumption required for tethered XR Glass applications. Through this collaboration with Qualcomm Technologies, Nuvoton aims to create an environment that enables more device manufacturers and developers to more easily enter the tethered XR Glass industry.Qualcomm Technologies'newest XR platform, Snapdragon Reality Elite, combined with Nuvoton's SoC, enables a practical and scalable tethered optical see-through (OST) architecture that balances performance, power efficiency, and system flexibility. This configuration allows computing intensive XR workloads to remain on the tethered device while delivering high quality, low latency display and sensor data to lightweight glasses. Together, Snapdragon Reality Elite and Nuvoton’s SoC form a strong foundation for OEMs to accelerate time-to-market for tethered OST designs while maintaining a clear path for future system evolution.Key Collaboration AreasEvaluation of optimized tethered XR Glass configurations by combining Nuvoton's SoCs with Qualcomm Technologies' XR platforms and related technologies.Nuvoton positions its SoC as a key enabler of AI-driven tethered XR platforms. The SoC provides a scalable architecture that decouples application processors from display and sensor subsystems, including cameras and microphones.By abstracting complex interfaces, it helps device manufacturers accelerate time-to-market, reuse designs across product generations, and optimize system performance and power efficiency, particularly for smart glasses.In addition to tethered XR Glass applications, the SoC supports emerging use cases such as agentic AI experiences by simplifying system integration and enabling flexible system architectures. Within the XR ecosystem, Nuvoton works with Qualcomm Technologies, OEMs, and partners at a platform level, supporting the evolution of XR as a next-generation AI computing platform.Value Proposition and BenefitsThrough this collaboration, the adoption of Nuvoton's XR Glass SoCs is expected to deliver the following benefits:1.A comfortable user experience enabled by high-performance, low-power designs optimized for tethered XR Glass use cases. 2.Superior connectivity and access to a rich software ecosystem through compatibility with Qualcomm Technologies platforms. 3.Reduced development effort and shortened time-to-market. 4.Support for a wide range of applications, from industrial to enterprise use cases."This collaboration with Qualcomm Technologies represents an important step in expanding the applicability of our SoC solutions for tethered XR Glass and emerging AI-driven XR platforms." said Ken Su, Vice President of Cloud Security Business Group at Nuvoton Technology Corporation."By working together within the ecosystem, we aim to support our customers in bringing innovative smart glasses and next-generation devices to market more efficiently.""By working with Nuvoton to pair Snapdragon XR platforms with their optimized SoC, we aim to support lightweight optical see-through designs that balance performance, power efficiency and system flexibility. This collaboration builds toward the next phase of the XR ecosystem." Sahil Bansal, Senior Director, Product Management at Qualcomm Technologies remarked.For more information.

Rugged edge computing brand – Cincoze will participate in Automate 2026 in Chicago, USA, from June 22–25 (Booth #861). Under the theme of "Empowering Smart Automation with Edge AI," Cincoze will present its complete range of Edge AI computing and automation solutions across four dedicated zones, including DIN-Rail Computers, Industrial Panel PCs and Monitors, Rugged Embedded Computers, and GPU Embedded Computers.DIN-Rail Computers Zone: The Optimal Computing Platform for Smart Manufacturing and Machine VisionThe Machine Computing — MAGNET product line is engineered for machine vision and smart manufacturing. The flagship MD-3000 Series, winner of the 2026 iF Design Award, will be on display, showing its powerful computing performance, flexible expandability, compact form factor, and DIN-rail installation. In addition to wide temperature and wide voltage support and EN 61000-6-2/6-4 industrial environment EMC compliance, the MD-3000 Series is powered by Intel Core desktop-class CPUs and supports up to 96 GB of DDR5 memory and dual NVMe SSDs, effortlessly handling the high-speed image processing and large-scale data storage demands of machine vision. The modular scalable architecture supports 2-, 4-, or 6-slot expansion decks with a variety of I/O interfaces, PoE modules, M.2 slots, and storage options to meet diverse integration needs. At just 150 mm in height, the compact chassis mounts on DIN rails for flexible deployment in production-line control cabinets, overcoming the challenges of space-constrained installations.Industrial Panel PCs and Monitors Zone: Complete HMI Solutions for Modern Factory ApplicationsThe Display Computing — CRYSTAL product line offers nearly 250 configurations of industrial panel PCs and monitors, covering a wide range of computing performance levels, screen sizes, display ratios, and touch technologies for harsh indoor industrial environments, high-brightness outdoor settings, and open-frame equipment integration. The entire series supports a wide temperature range and a wide voltage input, and is waterproof and dustproof, making it the go-to choice for HMI solutions in demanding industrial environments. The newly launched CV-200 Series features a ≤ 3 mm ultra-slim bezel design that combines performance with aesthetics. Its 178° wide viewing angle, Full HD resolution, and anti-glare coating ensure crisp, clear visuals even in bright indoor lighting. IP66-rated front panel protection, paired with wet touch tracking technology and EN 61000-6-2/6-4 industrial environment EMC compliance, enables long-term, reliable operation in harsh environments, making it an outstanding intelligent management solution for automated factories.Rugged Embedded Computers Zone: Built for Complex and Demanding Industrial EnvironmentsThe Rugged Computing — DIAMOND product line features six product series, all carrying UL safety certification to meet stringent international safety requirements. They support a wide temperature range and a wide voltage input, with industrial-grade protection for high levels of ruggedness and reliability, ensuring worry-free deployment. Customers can select the right model based on desired performance, form factor, power consumption, and industry-specific certification requirements. The newest model, launched in 2026 and the highlight of the show, is the DX-1300 Series, a high-performance compact embedded computer. It supports the latest Intel Arrow Lake-S Core Ultra 200S processor and up to 6400 MHz DDR5 ECC memory, providing ample computing power for Edge AI applications and high-end image processing. Extensive I/O options and diverse expansion capabilities cover all application needs. The compact chassis, combined with a high-end processor and versatile expandability, makes it particularly well-suited for applications that demand high performance in space-constrained installations.GPU Embedded Computers Zone: Full Coverage for Every Edge AI Workload, from Light to HeavyThe GPU Computing — GOLD product line features three series designed to meet different tiers of AI application needs. The GJ Series is purpose-built for entry-level, Light AI applications, featuring NVIDIA Jetson SoM GPUs that deliver efficient AI acceleration with minimal power consumption. For mid-range AI workloads, the GM Series, which supports MXM GPU modules, is the recommended choice. On display is the award-winning GM-1100 Series, recipient of the 2025 Red Dot Design Award and the 2026 Taiwan Excellence Award, delivering outstanding computing performance in a compact chassis, combined with industrial-grade ruggedness and environmental resilience for autonomous mobility equipment, automotive, and image recognition applications. The GP Series excels at Heavy AI workloads, supporting Intel Core CPUs and up to two 300W full-length GPU cards. Three patented designs for expansion, thermal management, and vibration-resistant locking address key user pain points and help customers tackle the most complex and demanding Edge AI applications.