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COMPUTEX
Thursday 2 July 2026
TEAMGROUP Showcases self-destruct SSD amid AI memory boom
As the AI computing race accelerates and semiconductor manufacturing capacity is increasingly redirected toward advanced memory, the memory industry is shifting from price-driven competition to a battle over resource allocation and supply security...
Thursday 11 June 2026
Cincoze to Showcase Comprehensive Edge AI Solutions at Computex 2026
Rugged edge computing brand – Cincoze will showcase its latest embedded computing solutions at COMPUTEX Taipei 2026, from June 2–5 (Hall 2, Booth Q0401a)...
Monday 19 May 2025
COMPUTEX's Special Issue
Technology news, product launches and show highlights from the event attendees available for download (PDF).
LATEST STORIES
Monday 19 October 2026
Breaking free from keyword constraints: How GeoGraph elevates job matching
Generative AI is rapidly transforming modern work environments and recruitment practices. Traditional search frameworks built solely around job titles, categories, and keywords are now facing unprecedented challenges...
Monday 19 October 2026
MKS' Atotech and ESI to Showcase Advanced PCB Solutions at TPCA 2026
MKS Inc. (NASDAQ: MKS), a global provider of enabling technologies that transform our world, today announced that its strategic brands Atotech, offering process chemicals, equipment, software and services, and ESI, providing laser systems, will showcase advanced manufacturing solutions for printed circuit boards (PCBs) and package substrates at TPCA Show 2026...
Thursday 15 October 2026
Samsung Semiconductor Highlights 400+ Layer Flash Powering Agentic AI
The 5th GMIF Innovation Summit (Global Memory Innovation Forum 2026;GMIF2026), co-hosted by the Shenzhen Memory Industry Association and the School of Integrated Circuits, Peking University, was recently successfully held in Shenzhen...
VIDEOS
SEMICON Exclusive Interview|Powering the AI Era: The Role of Advanced Materials
SEMICON Exclusive Interview|Enabling Mass Production of Silicon Photonics & CPO for AI
SEMICON Exclusive Interview|Syensqo Unboxed: FFKM, Galden & Sustainable Polymers
Straight from SEMICON 2026|ZEISS, Henkel, Tescan, and camLine
Straight from SEMICON 2026|PBA Systems, Rigaku, and ABB
COMPUTEX Exclusive|PEGATRON’s NVIDIA Rubin Racks & Physical AI Explained
MULTIMEDIA
K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
MOST-READ
7 DAYS NEWS
TSMC, Intel named as Musk's Terafab ambitions face reality check
GlobalFoundries wins US$2 billion TSMC interposer deal, closing a US packaging gap
Beyond 16 layers: HBM stacks test advanced packaging equipment makers
TSMC breaks silence on Musk's Terafab: Talks underway, but fab control non-negotiable
Nvidia unveils OOI CPO prototype for post-2028 AI needs
NXP lines up software-defined vehicles, industrial AI and data centers for double-digit growth in 2027
SK Hynix's Solidigm ties US$45B US NAND fab to Washington nod on China tool upgrade
SK Hynix's next bet goes beyond memory chips
CXMT reportedly prioritizes China demand, rejecting Apple's DRAM inquiry
India-based Spintronics AI weighs GaN chip fab in Madhya Pradesh
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