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COMPUTEX
Thursday 2 July 2026
TEAMGROUP Showcases self-destruct SSD amid AI memory boom
As the AI computing race accelerates and semiconductor manufacturing capacity is increasingly redirected toward advanced memory, the memory industry is shifting from price-driven competition to a battle over resource allocation and supply security...
Thursday 11 June 2026
Cincoze to Showcase Comprehensive Edge AI Solutions at Computex 2026
Rugged edge computing brand – Cincoze will showcase its latest embedded computing solutions at COMPUTEX Taipei 2026, from June 2–5 (Hall 2, Booth Q0401a)...
Monday 19 May 2025
COMPUTEX's Special Issue
Technology news, product launches and show highlights from the event attendees available for download (PDF).
LATEST STORIES
Monday 14 September 2026
Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
As AI-driven high-performance computing (HPC) and chip-to-chip optical interconnects continue to see rapid growth, Hauman Technologies, a leader in test and measurement solutions, has introduced a breakthrough GHz-class, massively parallel bandwidth testing technology in collaboration with AUO Corporation...
Friday 11 September 2026
DAS Expands in Taiwan and Unveils World First at SEMICON
DAS Environmental Experts continues to expand its capabilities in Taiwan and is presenting another new product at SEMICON Taiwan...
Friday 11 September 2026
Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
Toward Technologies, Inc. concluded its participation in SEMICON Taiwan 2026, held from September 2 to 4 at Taipei Nangang Exhibition Center Hall 1. Under the theme "RELAY, REDEFINED.," the company showcased a broader switching technology portfolio at booth K3168 and demonstrated its transition from a traditional relay supplier to an advanced switching solution partner.
VIDEOS
SEMICON Exclusive Interview|Powering the AI Era: The Role of Advanced Materials
SEMICON Exclusive Interview|Enabling Mass Production of Silicon Photonics & CPO for AI
SEMICON Exclusive Interview|Syensqo Unboxed: FFKM, Galden & Sustainable Polymers
Straight from SEMICON 2026|ZEISS, Henkel, Tescan, and camLine
Straight from SEMICON 2026|PBA Systems, Rigaku, and ABB
COMPUTEX Exclusive|PEGATRON’s NVIDIA Rubin Racks & Physical AI Explained
MULTIMEDIA
K-Safety Expo 2026: Safety, rewired, AI takes the front line at the edge of Busan blue
MOST-READ
7 DAYS NEWS
Google TPU pays back investment in 1 year, creating upside for MediaTek, Broadcom ASIC revenues
ASML lines up Intel, TSMC and Samsung behind 12-inch masks — TSMC alone sets a timeline
TSMC 3nm, 2nm, and CoWoS stay tight as AWS, MediaTek, TPU shift capacity
Musk's Memphis move puts xAI at the center of his empire
SK Hynix touts up to 5.15x inference gains with custom HBM
Meta's Muse faces security scrutiny over macOS zero-day, human-agent test
Weekly news roundup: China gains ground in memory and AI hardware as supply stays tight
Beyond ASML: China rethinks EUV race with light-source strategy
Apple keeps iPhone Duo in China, exposing limits of India's phone supply chain
South Korea's HBM-linked exports surge as Taiwan, Malaysia emerge as high-value destinations
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