As the AI computing race accelerates and semiconductor manufacturing capacity is increasingly redirected toward advanced memory, the memory industry is shifting from price-driven competition to a battle over resource allocation and supply security. The rapid expansion of high-bandwidth memory (HBM) production continues to consume advanced fabrication capacity, constraining the supply of conventional memory products and creating persistent shortages across the market. This concentration of high-end production has widened the supply-demand gap, driving the average selling prices of certain premium memory products to levels eight to ten times higher than previous norms

Rugged edge computing brand – Cincoze will showcase its latest embedded computing solutions at COMPUTEX Taipei 2026, from June 2–5 (Hall 2, Booth Q0401a). Cincoze will display its full range of edge computing solutions around the theme of "Smarter, Faster, More Reliable - Powered by Edge AI" encompassing the full spectrum of edge application environments in four dedicated zones, including DIN-Rail computers, industrial panel PCs and monitors, rugged embedded computers, and GPU embedded computers

Technology news, product launches and show highlights from the event attendees available for download (PDF).

Keywave Technology is a fabless semiconductor company founded in December 2022 that specializes in radio frequency (RF) integrated circuit (IC) design and advanced radar sensing solutions. Capitalizing on the explosive growth of Edge AI and opportunities for technological innovation, the company builds ultra-low-power microwave radar chips, modules and spatial sensing devices to track multiple targets with centimeter-level precision spatial positioning applications.Keywave Technology currently business focuses primarily on the UK market, where it has achieved significant success in projects spanning lighting, energy-saving systems, HVAC optimization, and smart applications involving precise occupancy tracking, smart environmental sensing and human-machine interaction.Jenny Cheng, founder and CEO of Keywave, established an office in Zhubei as early as 2023 and marked a strategic expansion into Taiwan's core semiconductor and electronics ecosystem. Recognized strong growth of Taiwan’s electronics manufacturing and semiconductor market, she formally launched an "Asia Business Division" team in 2026 with over 20 members.Following collaboration and engagement with major Taiwanese electronics manufacturing, and OEM/ODMs, Keywave has developed two radar sensor product lines, operating at 5.8 GHz and 24 GHz targeting markets such as AI robotics, smart spaces, smart buildings, automation, and edge AI sensing. Through proof-of-concept (PoC) initiatives and product design, the Keywave R&D team has focused on applications requiring high-precision spatial sensing and trajectory tracking. These innovative products, characterized by high accuracy, rapid sensing capabilities, energy efficiency, and cost-effectiveness. Now these solutions are being officially introduced to Taiwan’s industrial internet of things (IoT) and automation sector, paving the way for new business opportunities.MP Kan, VP of Technology and CTO at Keywave, outlined the shortcomings of traditional microwave radar and infrared (PIR) sensing technologies. Benchmarked against radar devices from leading global analog integrated circuits (ICs) manufacturers, he identified the primary drawbacks of these existing solutions: false detections leading to unintended activations, a technical inability to detect motionless objects or resting human bodies, and issues regarding high costs and excessive power consumption.In contrast, Keywave KW007, the compact 5.8GHz ultra-low-power radar sensor, achieves exceptional efficiency by drawing only 30µA to 100µA of operating current, enabling continuous motion detection for years on a single AA battery depending on sensitivity and the selected detection distance.This exceptional energy efficiency relies on smart sensing algorithm with proprietary multi-dimensional "Space and Time" sensing technology. This approach differs from traditional radar designs, which utilize high-performance DSP chips and extensive memory, resulting in inflated costs and high power consumption.In June 2026, Kan was invited to France to attend the inaugural European Semiconductor FSNP Meetup. Held on June 4, 2026, at Château de Seguin near Bordeaux, this was an exclusive, invitation-only event for the semiconductor industry, co-hosted by the European chip R&D platform EuroCDP and Silicon Catalyst.EU. He presented this ultra-low-power microwave radar sensing technology based on time-and-space correlation algorithms. The technology’s key strength lies in its integration of proprietary "Spatial Intelligence" and trajectory tracking, enabling it to accurately distinguish actual human movement from environmental noise in dynamic settings. It currently supports a sensing range of up to 20 meters and effectively prevents false triggers caused by natural wind, indoor fans, vibrations, or environmental noise.By combining radar sensors with AI technology, Keywave KW307, a 24GHz human presence and occupancy sensing module, enables the development of advanced, intelligent applications capable of detecting not only people and objects but even micro-motions like typing, breathing, or minor gestures. Given the regulatory restrictions in EU’s General Data Protection Regulation (GDPR) and California's CCPA/CPRA regarding the major concerns of camera-based systems capturing real-person images or personal identifiers, Keywave’s radar sensors have secured a significant market advantage by measuring motion, distance, and velocity.These microwave radar sensors facilitate applications such as office occupancy monitoring, object trajectory analysis, and climate and lighting control, while integrating seamlessly with the Industrial IoT devices, robotics, and smart home sectors to rapidly expand the scope of smart use cases. Kan also revealed that the next-generation radar sensor currently under development aims to push detection boundaries from a few hundred meters to several kilometers. This will explore the business potentials for deeper integration with drone and robotics applications to assist autonomous systems with spatial awareness and reliable presence detection in variable or low-light conditions.The most impressive technological breakthrough of Keywave Technology lies in its ability to achieve precise stationary presence detection and micro-motion tracking by analyzing the minute chest movements caused by breathing, even when a person is completely motionless. The current popular demonstration of Smart Spaces include powering privacy-compliant occupancy tracking for automated lighting and optimized HVAC adjustments. There are more use cases in the industrial controlling and detecting systems.The company is currently actively forging partnerships across various sales channels, including IC distributors, ODM/OEM manufacturers, and system integrators. In addition to offering engineering evaluation kits, development boards and support to technical teams, Keywave is seeking strategic partners to collaborate closely on the co-design of new applications with hardware and software system integrators.For further viewing the ultra-low-power radar porducts of Keywave, the company will exhibit at Microelectronics UK 2026, taking place at ExCeL London on September 29–30, 2026. The showcasing booth stand is located at Stand G16, ExCeL London, Royal Victoria Dock. At Keywave, we have been working on exciting new developments designed to help our partners navigate complex engineering challenges, optimize performance, and drive innovation. Visiting our booth will give you an exclusive look at our latest product demonstrations, upcoming technology roadmap, and a chance to speak directly with our technical experts.Credit:Keywave TechnologyKeywave radar sensor accurately tracks and records the movement trajectories of individuals.Credit:Keywave Technology

Rapid evolution of High-Performance Computing (HPC) and artificial intelligence chips for Hyperscalers and tech giants continue pushing large sized silicon demands. As a core element of semiconductor value creation, advanced packaging technology is scaling the stacking of more computing cores, more high-bandwidth memory, as well as the adoption of modular chiplet integration to overcome physical boundaries. Leading semiconductor manufacturers are expanding package dimensions to unprecedented footprints, currently reaching sizes of 100, 120, with projections moving beyond 180 mm to support large-format AI-driven advanced packages.The semiconductor industry is responding and shifting toward solutions that combine large-scale mass production with large-format packaging capabilities. Square sized substrates offer a distinct area utilization advantage to accommodate more large-form-factor chips simultaneously by moving away from round wafers to large rectangular panels. This is improving cost efficiency and addressing the challenges of thermal warpage and high-density interconnects associated with massive AI packages.Glass substrates are emerging as a key technology for advancing panel-level packaging from pilot experiments to active equipment qualification and commercialization verification. Consequently, Redistribution Layer (RDL) wet process and ECD equipment has become a critical driver of this transition and a key step in glass substrate manu-facturing. Key production tools including Electrochemical Deposition (ECD), cleaning, developing, etching, and stripping are not only vital to glass core substrate manufacturing, but also central to achieving high yields and mass production capabilities in advanced packaging technologies such as fan-out panel-level packaging (FOPLP) and Chip-on-Panel-on-Substrate (CoPoS). The wet processing equipment has garnered significant market attention.Omni production platform supports cross-sized substrates in 310, 510 and 700mm panelManz Asia, has successfully delivered Omni 310 system, which is the world’s first $310\text{mm} \times 310\text{mm}$ ECD wet chemistry system in early 2026. The system uses an electrochemical deposition module as its core, combining wet processing tools including cleaning, developing, plating, etching, stripping, and dual mechanisms support for both spin and spray operation. This new platform addresses the adaption to varying rectangular substrates.At SEMICON Taiwan 2026, Manz Asia expanded its portfolio with the launch of the cross-sized Omni series production systems. Engineered for varying panel dimensions, packaging architectures, and strict process requirements, this series feature the Omni 310, Omni 510, and Omni 700 to deliver optimized panel-level packaging (PLP) solutions across 310mm, 510mm, and 700mm panel sizes to meet the requirements of advanced PLP technology roadmaps including FOPLP, CoPoS, and Glass core TGV manufacturing.Take early-move positioning for Glass Core substrate aiming to tackle Through-Glass Via challengesRapid advancements in CoPoS are driving the shift from organic substrates to Glass Core, with TGV metallization, seed-layer formation, and copper via filling emerging as key process challenges. The Omni Series RDL platform integrates glass surface modification, cleaning, electroless copper plating, and electroplating to enhance copper adhesion and enable reliable TGV metallization and filling. Major Benefits of Omni series include.High performance ECD technology: The system offers excellent capabilities for filling high-aspect-ratio through-vias. When combined with an optimized seed layer and specialized plating chemistry, this process enables void-free via filling, delivering a highly stable and critical solution for electroplating on glass carrier substrates.High-precision glass etching technology: Featuring robust glass micro-machining capabilities, this technology supports the processing of 0.4 mm glass substrates and the creation of $20\ \mu\text{m}$ micro-vias. It offers TGV process capabilities with aspect ratios of up to 1:20, providing a critical advantage for achieving deep, fine-featured vias. Therefore, the system addresses the challenges of high-density TGV designs and marks a milestone in establishing a mass-production platform for next-generation packaging architectures.Empowering Heterogeneous Integration with advanced RDL for High-Precision Multi-Layer InterconnectionWith 40 years of in-house R&D expertise in RDL processing, Manz Asia has developed extensive expertise across PCB, IC substrate, display panel, and semiconductor packaging applications, and is now building strong collaborations with global IDM and OSAT clients. By helping customers accelerate key process iterations and transition smoothly to mass production, Manz Asia plays an active role in the global RDL processing and panel-level packaging supply chain.Designed for next-generation advanced packaging technologies like CoPoS, FOPLP, and Glass Core TGV, the debut of the Omni series production systems helps customers accelerate their transition from R&D validation to mass production. To learn more about Manz Asia production systems and product offerings, please visit the booth M1248, 4th Floor, Hall 1, Nangang Exhibition Center at SEMICON Taiwan 2026. You can also view detail product information on the official website.

At SEMICON Taiwan 2026 Booth T9116, SiliconAuto will showcase automotive-grade silicon solutions for Physical AI, developed through collaboration across Taiwan's world-leading semiconductor ecosystem. Visitors can experience live demonstrations of technologies designed to power future robotics and autonomous driving applications. The solutions are built on the XMotiv M3 microcontroller and high-performance computing (HPC) platforms used in intelligent vehicles and robots.Throughout the exhibition, the SiliconAuto team will be on hand to discuss practical approaches to Physical AI development. Topics range from semiconductor architecture and system design to multi-die integration and packaging. Visitors can also get hands-on with XMotiv M3 developer kits for robotic motion control, automotive body control, and safety orchestration.Automotive-Grade Silicon, Purpose-Built for Safe and Secure Physical AIExperience SiliconAuto technologies in action through three demonstrations, spanning robotics, autonomous driving, and high-performance computing. First of all, the XMotiv M3 as an ASIL-B Robotics Controller. In collaboration with Nexuni, a Taiwanese robotics developer focused on bringing AI-powered robots into practical, everyday applications, SiliconAuto is debuting a robotic motion control developer kit. XMotiv M3 controls dynamic stabilization through joint actuators. The demonstration highlights XMotiv M3's high-speed interface capabilities. These capabilities enable real-time control. ASIL-B compliance lays the safety and security foundation.Secondly, XMotiv M3 for Autonomous Driving. See how MCU XMotiv M3 works alongside ZF's I/O interface chip to support autonomous driving capabilities up to Level 4. This autonomous driving solution was first unveiled at Embedded World 2026 where it received the Embedded Award in the SoC/IP/IC Design category. The solution demonstrates XMotiv M3 performing safety orchestration, including system management and security functions.Moreover, the Physical AI Multi-Chiplet System. Get an exclusive preview of SiliconAuto's next-generation Physical AI inference solution. The solution is built on an automotive-grade high-performance computing (HPC) chiplet architecture, designed to meet the demanding requirements of future autonomous vehicles and advanced robotics platforms. The demonstration is powered by the SiliconPilot digital twin, which provides a pre-silicon model for validation and development.As Physical AI drives the emergence of autonomous vehicles and robots, SiliconAuto is helping customers bridge the gap between AI thinking and physical action. Through automotive-grade silicon solutions, built on XMotiv M3 microcontroller, high-performance computing (HPC) platforms, vehicle-to-everything connectivity solutions, and collaboration across Taiwan's world-leading semiconductor ecosystem, the company is enabling the next generation of safe and secure Physical AI systems. To know more about SiliconAuto, please visit during SEMICON Taiwan at Booth T9116, Level 7, TaiNEX Hall 2 or visit offcial webiste.