As the AI computing race accelerates and semiconductor manufacturing capacity is increasingly redirected toward advanced memory, the memory industry is shifting from price-driven competition to a battle over resource allocation and supply security. The rapid expansion of high-bandwidth memory (HBM) production continues to consume advanced fabrication capacity, constraining the supply of conventional memory products and creating persistent shortages across the market. This concentration of high-end production has widened the supply-demand gap, driving the average selling prices of certain premium memory products to levels eight to ten times higher than previous norms

Rugged edge computing brand – Cincoze will showcase its latest embedded computing solutions at COMPUTEX Taipei 2026, from June 2–5 (Hall 2, Booth Q0401a). Cincoze will display its full range of edge computing solutions around the theme of "Smarter, Faster, More Reliable - Powered by Edge AI" encompassing the full spectrum of edge application environments in four dedicated zones, including DIN-Rail computers, industrial panel PCs and monitors, rugged embedded computers, and GPU embedded computers

Technology news, product launches and show highlights from the event attendees available for download (PDF).

Rapid evolution of High-Performance Computing (HPC) and artificial intelligence chips for Hyperscalers and tech giants continue pushing large sized silicon demands. As a core element of semiconductor value creation, advanced packaging technology is scaling the stacking of more computing cores, more high-bandwidth memory, as well as the adoption of modular chiplet integration to overcome physical boundaries. Leading semiconductor manufacturers are expanding package dimensions to unprecedented footprints, currently reaching sizes of 100, 120, with projections moving beyond 180 mm to support large-format AI-driven advanced packages.The semiconductor industry is responding and shifting toward solutions that combine large-scale mass production with large-format packaging capabilities. Square sized substrates offer a distinct area utilization advantage to accommodate more large-form-factor chips simultaneously by moving away from round wafers to large rectangular panels. This is improving cost efficiency and addressing the challenges of thermal warpage and high-density interconnects associated with massive AI packages.Glass substrates are emerging as a key technology for advancing panel-level packaging from pilot experiments to active equipment qualification and commercialization verification. Consequently, Redistribution Layer (RDL) wet process and ECD equipment has become a critical driver of this transition and a key step in glass substrate manu-facturing. Key production tools including Electrochemical Deposition (ECD), cleaning, developing, etching, and stripping are not only vital to glass core substrate manufacturing, but also central to achieving high yields and mass production capabilities in advanced packaging technologies such as fan-out panel-level packaging (FOPLP) and Chip-on-Panel-on-Substrate (CoPoS). The wet processing equipment has garnered significant market attention.Omni production platform supports cross-sized substrates in 310, 510 and 700mm panelManz Asia, has successfully delivered Omni 310 system, which is the world’s first $310\text{mm} \times 310\text{mm}$ ECD wet chemistry system in early 2026. The system uses an electrochemical deposition module as its core, combining wet processing tools including cleaning, developing, plating, etching, stripping, and dual mechanisms support for both spin and spray operation. This new platform addresses the adaption to varying rectangular substrates.At SEMICON Taiwan 2026, Manz Asia expanded its portfolio with the launch of the cross-sized Omni series production systems. Engineered for varying panel dimensions, packaging architectures, and strict process requirements, this series feature the Omni 310, Omni 510, and Omni 700 to deliver optimized panel-level packaging (PLP) solutions across 310mm, 510mm, and 700mm panel sizes to meet the requirements of advanced PLP technology roadmaps including FOPLP, CoPoS, and Glass core TGV manufacturing.Take early-move positioning for Glass Core substrate aiming to tackle Through-Glass Via challengesRapid advancements in CoPoS are driving the shift from organic substrates to Glass Core, with TGV metallization, seed-layer formation, and copper via filling emerging as key process challenges. The Omni Series RDL platform integrates glass surface modification, cleaning, electroless copper plating, and electroplating to enhance copper adhesion and enable reliable TGV metallization and filling. Major Benefits of Omni series include.High performance ECD technology: The system offers excellent capabilities for filling high-aspect-ratio through-vias. When combined with an optimized seed layer and specialized plating chemistry, this process enables void-free via filling, delivering a highly stable and critical solution for electroplating on glass carrier substrates.High-precision glass etching technology: Featuring robust glass micro-machining capabilities, this technology supports the processing of 0.4 mm glass substrates and the creation of $20\ \mu\text{m}$ micro-vias. It offers TGV process capabilities with aspect ratios of up to 1:20, providing a critical advantage for achieving deep, fine-featured vias. Therefore, the system addresses the challenges of high-density TGV designs and marks a milestone in establishing a mass-production platform for next-generation packaging architectures.Empowering Heterogeneous Integration with advanced RDL for High-Precision Multi-Layer InterconnectionWith 40 years of in-house R&D expertise in RDL processing, Manz Asia has developed extensive expertise across PCB, IC substrate, display panel, and semiconductor packaging applications, and is now building strong collaborations with global IDM and OSAT clients. By helping customers accelerate key process iterations and transition smoothly to mass production, Manz Asia plays an active role in the global RDL processing and panel-level packaging supply chain.Designed for next-generation advanced packaging technologies like CoPoS, FOPLP, and Glass Core TGV, the debut of the Omni series production systems helps customers accelerate their transition from R&D validation to mass production. To learn more about Manz Asia production systems and product offerings, please visit the booth M1248, 4th Floor, Hall 1, Nangang Exhibition Center at SEMICON Taiwan 2026. You can also view detail product information on the official website.

At SEMICON Taiwan 2026 Booth T9116, SiliconAuto will showcase automotive-grade silicon solutions for Physical AI, developed through collaboration across Taiwan's world-leading semiconductor ecosystem. Visitors can experience live demonstrations of technologies designed to power future robotics and autonomous driving applications. The solutions are built on the XMotiv M3 microcontroller and high-performance computing (HPC) platforms used in intelligent vehicles and robots.Throughout the exhibition, the SiliconAuto team will be on hand to discuss practical approaches to Physical AI development. Topics range from semiconductor architecture and system design to multi-die integration and packaging. Visitors can also get hands-on with XMotiv M3 developer kits for robotic motion control, automotive body control, and safety orchestration.Automotive-Grade Silicon, Purpose-Built for Safe and Secure Physical AIExperience SiliconAuto technologies in action through three demonstrations, spanning robotics, autonomous driving, and high-performance computing. First of all, the XMotiv M3 as an ASIL-B Robotics Controller. In collaboration with Nexuni, a Taiwanese robotics developer focused on bringing AI-powered robots into practical, everyday applications, SiliconAuto is debuting a robotic motion control developer kit. XMotiv M3 controls dynamic stabilization through joint actuators. The demonstration highlights XMotiv M3's high-speed interface capabilities. These capabilities enable real-time control. ASIL-B compliance lays the safety and security foundation.Secondly, XMotiv M3 for Autonomous Driving. See how MCU XMotiv M3 works alongside ZF's I/O interface chip to support autonomous driving capabilities up to Level 4. This autonomous driving solution was first unveiled at Embedded World 2026 where it received the Embedded Award in the SoC/IP/IC Design category. The solution demonstrates XMotiv M3 performing safety orchestration, including system management and security functions.Moreover, the Physical AI Multi-Chiplet System. Get an exclusive preview of SiliconAuto's next-generation Physical AI inference solution. The solution is built on an automotive-grade high-performance computing (HPC) chiplet architecture, designed to meet the demanding requirements of future autonomous vehicles and advanced robotics platforms. The demonstration is powered by the SiliconPilot digital twin, which provides a pre-silicon model for validation and development.As Physical AI drives the emergence of autonomous vehicles and robots, SiliconAuto is helping customers bridge the gap between AI thinking and physical action. Through automotive-grade silicon solutions, built on XMotiv M3 microcontroller, high-performance computing (HPC) platforms, vehicle-to-everything connectivity solutions, and collaboration across Taiwan's world-leading semiconductor ecosystem, the company is enabling the next generation of safe and secure Physical AI systems. To know more about SiliconAuto, please visit during SEMICON Taiwan at Booth T9116, Level 7, TaiNEX Hall 2 or visit offcial webiste. 

DAS Environmental Expert GmbH today announced the launch of ALCEA, a new secondary abatement solution for nitrogen oxide (NOx) emissions in semiconductor manufacturing. Installed downstream of NOx-generating waste gas treatment units, ALCEA can reduce NOx by up to 95 percent while its catalyst stage is integrated directly into the exhaust duct, minimizing additional floor space in the subfab. DAS Environmental Experts will present the new system at SEMICON Taiwan 2026 from September 2 to 4 at TaiNEX 1 and 2 in Taipei (Booth J2 | 346).New plasma-enhanced catalytic secondary abatement solution integrates into exhaust ducts to minimize subfab floor space and energy demand In semiconductor fabs, additional emission-control capacity competes for limited and costly subfab space. At the same time, manufacturers are seeking to reduce utility demand, maintenance requirements, and operational interruptions. ALCEA addresses these constraints through a highly integrated architecture: the catalyst unit is fitted into the exhaust duct rather than installed as a separate floor-standing treatment stage. The solution is designed for retrofitting into existing exhaust systems and for use downstream of different NOx-generating abatement technologies. "Fabs cannot treat emissions, energy use and space as separate challenges. With ALCEA, we place a high-performance secondary DeNOx stage where it creates the most value - directly in the existing exhaust path. The result is a retrofit-ready solution that reduces NOx by up to 95 percent while keeping the demand for floor space and utilities low. That is exactly the kind of practical innovation needed on the road to an emission-free subfab", says Guy Davies, Chief Business Development Officer, DAS Environmental Experts.？？Plasma-enhanced catalysis without special gas injectionALCEA is based on DAS Environmental Experts' proven plasma-enhanced Catalytic Technology. Reactive oxygen species are formed (ROS), which drive reactions on the catalyst surface. The process converts NOx into more highly oxidized, water-soluble nitrogen compounds that can subsequently be removed in a downstream central wet abatement system. The dry-oxidation process requires no injection of special gases and the catalysts are reusable. Depending on NOx concentration, prior treatment and plasma power, ALCEA handles volume flows of up to 5,000 standard liters per minute and achieves NOx reduction of up to 95 percent. Specified power consumption is up to 3.2 kW, depending on the NOx concentration. The system supports up to two catalyst ducts for dual systems or two individual local scrubbers. Process cooling water, reusable catalysts and a design geared toward low maintenance requirements and downtime support integration into ongoing fab operations.Developed in one of the world's leading semiconductor ecosystems, ALCEA was created in collaboration with Industrial Technology Research Institute (ITRI), Taiwan's premier applied-technology research institute. The DAS Environmental Experts engineering team in Taiwan played a central role in the development.The project combines applied research, local engineering expertise and proximity to semiconductor customers. It also represents a significant expansion of the company's waste gas treatment portfolio, adding a compact post-combustion DeNOx option for new and existing fab installations. The market launch at SEMICON Taiwan underscores the role of DAS Environmental Experts' regional teams in customer-oriented innovation and local value creation. Visitors can learn more about ALCEA and the company's wider portfolio for waste gas and wastewater treatment during SEMICON Taiwan 2026. For more information, please visit DAS Official Website and product detail page.