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NEWS TAGGED ANTENNA
Thursday 24 June 2021
ASP of SLP mainboards for new iPhones to stay flat
PCB makers in the supply chain of iPhones are expected to see only limited growth in ASPs this year due to insignificant specs upgrades in SLP (substrate-like PCB) mainboards for...
Tuesday 22 June 2021
BT substrate supply may fall short of demand in 2H21
The supply of BT substrates is likely to fall short of demand in the second half of this year, but the shortage will be less severe than that of ABF substrates, according to industry...
Monday 21 June 2021
CCL demand for 5G base stations may gain momentum in Europe, US in 2022
CCL demand for 5G base station applications in the US and Europe are not expected to take off until 2022 at the earliest, according to industry sources.
Wednesday 16 June 2021
Zhen Ding, Flexium see strong 2Q21 on non-handset FPCB shipments
Taiwan's flexible PCB (FPCB) suppliers Zhen Ding Technology and Flexium Interconnect are expected to post robust sales for second-quarter 2021, mainly bolstered by shipments to Apple...
Wednesday 2 June 2021
AiP, 3D IC packaging increasingly adopted for 5G mmWave, HPC chips
With more mmWave-capable and HPC chip designs being developed, AiP, 3D stacking and other advanced packaging technologies will be increasingly needed for commercial applications,...
Wednesday 26 May 2021
Taiwan PCB supply chain warming up for new iPhones
Taiwan PCB and CCL makers in the supply chain of Apple smartphones are gearing up production for new iPhones, with delivery schedules returning to pre-pandemic timeframes, according...
Tuesday 25 May 2021
Taiwan testing houses gearing up for AiP, 3nm chips
Taiwan-based IC testing houses including King Yuan Electronics (KYEC), Sigurd Microelectronics and Ardentec have all kicked off R&D for more advanced 3nm-made chips, while also...
Tuesday 11 May 2021
Antenna supply chain gearing up for 5G mmWave AiP modules
Smartphone-use antenna makers are gearing up for a likely boom in demand for 5G AiP (antenna in package) modules that they expect will be triggered by Apple's release of new mmWave-enabled...
Thursday 29 April 2021
Flexium reportedly to volume ship LCP antennas for new iPhones in 2H21
Flexible PCB maker Flexium Interconnect is set to start volume shipments of LCP (liquid crystal polymer) antenna boards for new iPhones in the second half of the year, which will...
Friday 23 April 2021
ASE lands FC-AiP orders for new iPad Pro
ASE Technology Holding will see its FC-AiP (antenna in package) business receive a significant boost in the months ahead as the company and its EMS subsidiary Universal Scientific...
Monday 19 April 2021
Apple may adopt in-house developed dual-band AiP for new iPhones, say sources
Apple is stepping up development its own dual-band 5G AiP (antenna in package) module, which, along with Qualcomm's solutions, may be featured in its next-generation iPhones, according...
Friday 9 April 2021
AiP substrates in growing demand for new mmWave iPhones in 2021
IC substrate makers in Apple's iPhone supply chain are aggressively bracing for production of BT-based AiP (antenna in package) substrates expecting a surge in demand for new iPhones...
Friday 9 April 2021
FCCL makers see sharp 1Q21 revenue growths on non-handset demand
Taiwan-based FCCL manufacturers including Taiflex Scientific and Asia Electronic Material (AEM) have posted strong on-year revenue increases for the first quarter of 2021 thanks to...
Friday 26 February 2021
Taiwan PCB makers to embrace bright prospects for 2021
Taiwan-based PCB makers are expected to see their combined output value grow further in 2021, driven by strong demand for IC substrates, HDI boards and flexible PCBs, according to...
Monday 22 February 2021
Chipmakers placing extra orders for BT substrates amid tight supply
As supply of high-end BT substrates has turned tight in the first quarter of 2021, major chipmakers including Qualcomm and MediaTek are moving aggressively to secure more capacity...