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    NEWS TAGGED ASML
    Friday 11 September 2026
    Samsung, SK Hynix eye 2028 High-NA DRAM rollout

    SK Hynix is targeting 2028 to apply High-NA extreme ultraviolet lithography to DRAM mass production and is considering joining an industry...

    Thursday 10 September 2026
    Analysis: China chases EUV as chipmakers move to High-NA
    The extreme ultraviolet (EUV) lithography race is splitting into two tracks. Intel has moved High-NA EUV into production, Samsung Electronics and SK Hynix are targeting DRAM production...
    Wednesday 9 September 2026
    Huawei orchestrates China's DUV lithography push to cut reliance on ASML
    Huawei is emerging as a central organiser of China's effort to build a domestic semiconductor equipment supply chain, backing critical lithography suppliers and helping connect them...
    Wednesday 9 September 2026
    Samsung-led EUR3B funding round nearly doubles Mistral's valuation
    French AI startup Mistral has raised EUR3 billion (US$3.5 billion) in a funding round led by Samsung Electronics, nearly doubling its valuation as the company seeks to strengthen its...
    Wednesday 9 September 2026
    ASML chooses Netherlands for major expansion after warning it could build abroad
    ASML's groundbreaking at Brainport Industries Campus North commits Europe's most valuable company to a build-out that could eventually hold up to 20,000 workplaces in a single Dutch...
    Tuesday 8 September 2026
    ASML lines up Intel, TSMC and Samsung behind 12-inch masks — TSMC alone sets a timeline
    ASML issued joint statements with Intel Foundry, TSMC and Samsung Electronics on September 8, converging the three leading-edge chipmakers on a transition from the semiconductor industry's...
    Friday 4 September 2026
    China's EUV gap may stretch 10–15 years, but DUV gains test Western export controls
    China may remain 10–15 years away from developing domestic extreme ultraviolet (EUV) lithography, according to assessments from UBS and Zeiss, highlighting the technological...
    Tuesday 1 September 2026
    ASML says High NA EUV has reached its first high-volume logic product
    ASML told a SEMICON Taiwan audience that its High NA EUV platform has been used for a high-volume logic product for the first time, a threshold the company frames as the point at which...
    Friday 14 August 2026
    Musk hints at FEL light source for Terafab; ASML eyes FEL-EUV push
    After EVs, rockets, and humanoid robots, Elon Musk appears to be turning his attention to optimizing the chip manufacturing process. When he unveiled a US$16.8 billion initial investment...
    Monday 10 August 2026
    Weekly news roundup: AI infrastructure race spans HBM, DRAM, EMIB, optical transceivers and next-gen lithography
    AI infrastructure, memory supply, advanced packaging and US-China tech restrictions led this week's industry agenda. Below are the most-read DIGITIMES stories from the week...
    Monday 3 August 2026
    Inversion Semiconductor targets ASML with particle-accelerator X-ray lithography
    Inversion Semiconductor is developing a particle-accelerator lithography platform that it says could deliver shorter wavelengths, higher throughput and denser chips than today's extreme...
    Monday 3 August 2026
    xLight bets on EUV light source, eyes ASML deal
    The semiconductor industry is grappling with a supply-demand imbalance as AI-driven demand for advanced-node chips outpaces global capacity by several times, pushing up fab utilization...
    Monday 3 August 2026
    Pat Gelsinger joins xLight in bid to bring TSMC into US-made lithography project
    US semiconductor policy is moving deeper into the most critical layers of advanced chipmaking, with former Intel chief executive Pat Gelsinger again emerging as a central figure. After...
    Thursday 30 July 2026
    China's DUV shock: the secretive Aishengna rattles ASML with US$1B state backing

    China's immersion DUV lithography programme has brought a little-known state-backed company into focus. Shanghai Aishengna Electronic...

    Wednesday 29 July 2026
    China's first home-grown immersion DUV production reveals real test beyond prototypes
    China has begun producing domestically developed immersion deep-ultraviolet (DUV) lithography machines, moving a critical semiconductor-equipment programme beyond prototypes and towards...
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    BIZ FOCUS
    Sep 11, 08:00
    DAS Expands in Taiwan and Unveils World First at SEMICON
    Friday 11 September 2026
    Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
    Thursday 10 September 2026
    Stress, Sleep, and Lifestyle Balance: Perspectives from Traditional Chinese Medicine
    Wednesday 9 September 2026
    IDA Partners with Taiwan's Semiconductor Industry to Advance Global Talent Strategy
    Semicon_TW