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    NEWS TAGGED ASML
    Friday 4 September 2026
    China's EUV gap may stretch 10–15 years, but DUV gains test Western export controls
    China may remain 10–15 years away from developing domestic extreme ultraviolet (EUV) lithography, according to assessments from UBS and Zeiss, highlighting the technological...
    Tuesday 1 September 2026
    ASML says High NA EUV has reached its first high-volume logic product
    ASML told a SEMICON Taiwan audience that its High NA EUV platform has been used for a high-volume logic product for the first time, a threshold the company frames as the point at which...
    Friday 14 August 2026
    Musk hints at FEL light source for Terafab; ASML eyes FEL-EUV push
    After EVs, rockets, and humanoid robots, Elon Musk appears to be turning his attention to optimizing the chip manufacturing process. When he unveiled a US$16.8 billion initial investment...
    Monday 10 August 2026
    Weekly news roundup: AI infrastructure race spans HBM, DRAM, EMIB, optical transceivers and next-gen lithography
    AI infrastructure, memory supply, advanced packaging and US-China tech restrictions led this week's industry agenda. Below are the most-read DIGITIMES stories from the week...
    Monday 3 August 2026
    Inversion Semiconductor targets ASML with particle-accelerator X-ray lithography
    Inversion Semiconductor is developing a particle-accelerator lithography platform that it says could deliver shorter wavelengths, higher throughput and denser chips than today's extreme...
    Monday 3 August 2026
    xLight bets on EUV light source, eyes ASML deal
    The semiconductor industry is grappling with a supply-demand imbalance as AI-driven demand for advanced-node chips outpaces global capacity by several times, pushing up fab utilization...
    Monday 3 August 2026
    Pat Gelsinger joins xLight in bid to bring TSMC into US-made lithography project
    US semiconductor policy is moving deeper into the most critical layers of advanced chipmaking, with former Intel chief executive Pat Gelsinger again emerging as a central figure. After...
    Thursday 30 July 2026
    China's DUV shock: the secretive Aishengna rattles ASML with US$1B state backing

    China's immersion DUV lithography programme has brought a little-known state-backed company into focus. Shanghai Aishengna Electronic...

    Wednesday 29 July 2026
    China's first home-grown immersion DUV production reveals real test beyond prototypes
    China has begun producing domestically developed immersion deep-ultraviolet (DUV) lithography machines, moving a critical semiconductor-equipment programme beyond prototypes and towards...
    Tuesday 28 July 2026
    China reportedly starts making homegrown DUV chipmaking tools; threatens ASML's stranglehold on semiconductor equipment
    China has begun manufacturing domestically developed immersion deep ultraviolet lithography machines, a potential turning point in its effort to build a self-sufficient semiconductor...
    Tuesday 28 July 2026
    Zeiss races to break ASML's EUV optics bottleneck for the AI chip boom
    Zeiss Semiconductor Manufacturing Technology is expanding production capacity in Germany to relieve a critical constraint on ASML's lithography output, with AI data center investment...
    Friday 24 July 2026
    German chip suppliers deepen ties with Samsung, SK Hynix

    Germany's Merck KGaA, TRUMPF and ZEISS are deepening their ties with South Korea's semiconductor industry amid large-scale investment...

    Friday 24 July 2026
    Trumpf builds EUV moat with 40 years of chip tech
    AI demand is continuing to drive global semiconductor investment, lifting the importance of extreme ultraviolet (EUV) lithography once again. Trumpf, the German laser maker and key...
    Thursday 23 July 2026
    Intel 18A adopts High-NA EUV in dual-certification push
    Intel Foundry has moved high numerical aperture (High-NA) EUV lithography into production on its Intel 18A process, with ASML confirming in a recent press release that Intel is using...
    Wednesday 22 July 2026
    Albany NanoTech Complex acquires ASML High NA EUV tools for chip research
    Parts of ASML's next-generation high numerical aperture (High NA) extreme ultraviolet (EUV) machine have arrived in New York state, where they will be used for chipmaking R&D....
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    BIZ FOCUS
    Sep 2, 08:22
    World Diamond Technology accelerates mass production of 300 mm diamond wafers
    Wednesday 2 September 2026
    Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
    Wednesday 2 September 2026
    Innovative Solutions for Fabricating High-Performance AI Multichip Packaging Using Glass Substrates
    Wednesday 2 September 2026
    8 September Hsinchu seminar: Silicon photonics driving AI chains
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