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NEWS TAGGED COOLING
Tuesday 1 October 2024
Status of liquid cooling solutions for AI servers

Introduction

Monday 30 September 2024
Rising AI server customization fuels supply chain tech upgrades
To meet the growing demand for computing power, cloud service providers are ramping up purchases of AI servers. However, suppliers in the electronic connection industry are finding...
Wednesday 25 September 2024
TSMC adopts SMC's chillers for 2nm trial production
Japan-based SMC has announced that it has shipped chillers to TSMC for the trial production of 2nm chips. SMC is launching chiller products specifically for advanced semiconductor...
Wednesday 25 September 2024
Taiwan's AI data center boom faces power bottleneck
The increasing power demands of AI data centers are prompting operators to expand carbon-free energy initiatives and advance liquid cooling technologies to enhance energy efficiency...
Wednesday 18 September 2024
Heraeus Electronics eyes crucial thermal management solutions as AI chip performance advances
Thermal management has become an increasingly critical issue as the computing performance of AI chips continues to advance. High temperatures not only lead to slower performance due...
Wednesday 18 September 2024
Huawei encounters difficulties with Kirin SoC performance breakthroughs
Huawei's recent Mate XT tri-fold smartphone launch has sparked curiosity about China's advancements in chip manufacturing. The company's reluctance to disclose chip details has left...
Friday 13 September 2024
Niching targets revenue boost from AI server cooling, substrates, and driver ICs
Niching Industrial, a Taiwan-based semiconductor materials and components distributor, has experienced a significant resurgence in orders for its three primary product lines –...
Friday 6 September 2024
Power consumption is main issue for AI development, says SK Hynix president Justin Kim
SEMICON Taiwan 2024 made its grand debut on the 4th. President of SK Hynix, Justin Kim, was invited to Taiwan and gave a keynote speech. He mentioned that to push AI technology towards...
Friday 6 September 2024
WinWay sees co-packaged optics ready for mass production by 2026
In the silicon photonics packaging and testing interface sector, WinWay Technology has intensified its efforts and anticipates that its co-packaged optics (CPO) product will be prepared...
Thursday 5 September 2024
Liquid-cooled charger and cable tech, 2024

Introduction

Wednesday 4 September 2024
Taiwanese manufacturers gain ground with Nvidia's move to liquid cooling
Nvidia's announcement that its Blackwell series will enter mass production in the fourth quarter signals a shift toward a new era in server cooling, transitioning from traditional...
Monday 2 September 2024
Jensen Huang's three assurances temporarily calm cooling factories
Nvidia's founder and CEO, Jensen Huang, revealed that the Blackwell chip will be mass-produced and delivered to clients in the last quarter of 2024. He also states that demands for...
Thursday 22 August 2024
xMEMS aims for 2025 production of groundbreaking cooling SoC with 3-pronged market entry strategy
US-based xMEMS Labs is set to deliver its newly unveiled XMC-2400 µCooling™, a single-chip (SoC) air-cooled all-silicon active cooling solution utilizing MEMS technology,...
Thursday 22 August 2024
AI server advancements propel liquid cooling innovation while fans remain essential
The emergence of AI servers is driving advancements in liquid cooling technology, yet fans remain crucial in both water and immersion cooling systems. The value of fans for NVL 72...
Thursday 22 August 2024
Kenmec expects sales recovery in 2H24
Kenmec Mechanical Engineering saw lower-than-expected performance in the first half of 2024 due to fluctuations in the economy and construction delays, even though the company had...