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Monday 18 July 2022
TSMC on track to develop InFO_3D tech for mobile device chips
TSMC is on track to develop InFO_3D technology for processing mobile device chips that are going slimmer and lighter, looking to further expand its 3D Fabric lineup and serve more...
Thursday 7 July 2022
GUC demonstrates world's first HBM3 PHY, controller, and CoWoS platform at 7.2Gbps
Global Unichip Corp. (GUC), the leader in Advanced ASIC, announced that they have silicon proved their 7.2 Gbps HBM3 solution, using SK hynix's first available HBM3 samples. The platform...
Tuesday 14 June 2022
TSMC runs CoWoS packaging lines at nearly full utilization
Robust AI and HPC processor orders have boosted TSMC's chip-on-wafer-on-substrate (CoWoS) packaging capacity utilization to nearly 100%, according to industry sources.
Tuesday 24 May 2022
Chiplet processing demand on the rise
While their consumer IC packaging business continues to slow down, Taiwan OSATs have received increasing inquiries about chiplet manufacturing solutions from clients in the US, China...
Friday 20 May 2022
TSMC to move CoWoS-L technology to commercial production in 2 years
TSMC's CoWoS-L is the latest CoWoS process variant, and is expected to kick off commercial production in 2023-2024, according to industry sources. The offering is designed to target...