OSAT leader ASE expects to enjoy a particularly strong first quarter of 2025, thanks to an influx of urgent orders for AI and PC applications. Advanced packaging is expected to drive...
In recent months, as the US has tightened its AI restrictions and unleashed disruptive tariff measures, many believe that TSMC will be the first to bear the brunt. However, after...
The global foundry industry concluded 2024 with a remarkable 22% growth compared to the previous year, marking a strong recovery and expansion phase after 2023. This growth was primarily...
The global political and economic landscape is characterized by volatility; nevertheless, sources within the semiconductor industry suggest that TSMC's expansion strategy for advanced...
TSMC CEO C.C. Wei has dismissed recent market speculation indicating Nvidia is cutting back its demand for Chip-on-Wafer-on-Substrate (CoWoS) packaging capacity.
During the inauguration ceremony of SPIL on January 16, Nvidia founder and CEO Jensen Huang stated that the Blackwell system has now fully entered production, which will gradually...
TSMC has maintained its equipment orders, despite market rumors regarding a decrease in demand for Chip-on-Wafer-on-Substrate (CoWoS) packaging from Nvidia. According to sources at...
TSMC is set to achieve new revenue and profit records in 2024, driven by strong AI orders, according to industry sources. The pure-play foundry continues to accelerate its advanced...
TSMC is leveraging strong demand for sub-7nm advanced processes and its exclusive CoWoS packaging services, emerging as the leading beneficiary of the AI boom in 2024. Despite a slow...
Broadcom's stellar performance and outlook have energized the ASIC market, prompting numerous companies to enter the AI chip arena. The industry sentiment has shifted from overwhelming...
According to industry sources, TSMC is working to integrate CoWoS and SiPh, seeking to launch co-packaged optics (CPO) in 2026 that may inject fresh momentum into the semiconductor...
TSMC announced at the Open Innovation Platform (OIP) Ecosystem Forum in Europe that its CoWoS packaging technology will achieve certification by 2027, introducing a version with 9x...
TSMC's CoWoS technology continues to scale, driven by strong demand from major clients such as Nvidia. Production capacity is projected to reach 75,000 units by 2025, with the persistent...
On November 8, news broke that China's 7nm chip manufacturing supply was cut off, prompting major foundries like TSMC and Samsung Foundry to remain silent. However, recent reports...
