Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful launch of the industry's first Universal Chiplet Interconnect Express (UCIe) PHY silicon, achieving...
Benefiting from strong demand for wafer carriers and photomask carriers from clients such as TSMC, Gudeng reported a consolidated revenue of approximately NT$456 million (US$13.9...
Market speculation about a slowdown in AI chip demand is mounting, with concerns fueled by scaled-back data center plans from major CPE manufacturers and downward revisions in CoWoS...
Supply chain sources indicate that TSMC's CoWoS capacity target for 2025 has been slightly adjusted downward, however, it is expected to rise consistently with the addition of new...
TSMC's silicon photonic (SiPh) co-packaged optics (CPO) technology is progressing swiftly, with recent market speculation suggesting that related production lines are expected to...
OSAT leader ASE expects to enjoy a particularly strong first quarter of 2025, thanks to an influx of urgent orders for AI and PC applications. Advanced packaging is expected to drive...
In recent months, as the US has tightened its AI restrictions and unleashed disruptive tariff measures, many believe that TSMC will be the first to bear the brunt. However, after...
The global foundry industry concluded 2024 with a remarkable 22% growth compared to the previous year, marking a strong recovery and expansion phase after 2023. This growth was primarily...
The global political and economic landscape is characterized by volatility; nevertheless, sources within the semiconductor industry suggest that TSMC's expansion strategy for advanced...
TSMC CEO C.C. Wei has dismissed recent market speculation indicating Nvidia is cutting back its demand for Chip-on-Wafer-on-Substrate (CoWoS) packaging capacity.
During the inauguration ceremony of SPIL on January 16, Nvidia founder and CEO Jensen Huang stated that the Blackwell system has now fully entered production, which will gradually...
TSMC has maintained its equipment orders, despite market rumors regarding a decrease in demand for Chip-on-Wafer-on-Substrate (CoWoS) packaging from Nvidia. According to sources at...
TSMC is set to achieve new revenue and profit records in 2024, driven by strong AI orders, according to industry sources. The pure-play foundry continues to accelerate its advanced...
TSMC is leveraging strong demand for sub-7nm advanced processes and its exclusive CoWoS packaging services, emerging as the leading beneficiary of the AI boom in 2024. Despite a slow...
