C Sun Manufacturing is showcasing its advanced semiconductor, PCB, and panel-level packaging (PLP) equipment at Touch Taiwan 2025, emphasizing continued growth despite mounting concerns...
As a leader in advanced processes and the CoWoS and SoIC advanced packaging supply chain, Praise Victor Industrial (PVI) is benefited from the ongoing semiconductor expansion wave,...
Despite rumors of reduced orders for advanced packaging capacities, Taiwan Semiconductor Manufacturing Company (TSMC) is ramping up its advanced packaging capacity to meet the growing...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out the world's first HBM4 controller and PHY IP. This test chip was implemented...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful launch of the industry's first Universal Chiplet Interconnect Express (UCIe) PHY silicon, achieving...
Benefiting from strong demand for wafer carriers and photomask carriers from clients such as TSMC, Gudeng reported a consolidated revenue of approximately NT$456 million (US$13.9...
Market speculation about a slowdown in AI chip demand is mounting, with concerns fueled by scaled-back data center plans from major CPE manufacturers and downward revisions in CoWoS...
Supply chain sources indicate that TSMC's CoWoS capacity target for 2025 has been slightly adjusted downward, however, it is expected to rise consistently with the addition of new...
TSMC's silicon photonic (SiPh) co-packaged optics (CPO) technology is progressing swiftly, with recent market speculation suggesting that related production lines are expected to...
OSAT leader ASE expects to enjoy a particularly strong first quarter of 2025, thanks to an influx of urgent orders for AI and PC applications. Advanced packaging is expected to drive...
In recent months, as the US has tightened its AI restrictions and unleashed disruptive tariff measures, many believe that TSMC will be the first to bear the brunt. However, after...
The global foundry industry concluded 2024 with a remarkable 22% growth compared to the previous year, marking a strong recovery and expansion phase after 2023. This growth was primarily...
The global political and economic landscape is characterized by volatility; nevertheless, sources within the semiconductor industry suggest that TSMC's expansion strategy for advanced...
TSMC CEO C.C. Wei has dismissed recent market speculation indicating Nvidia is cutting back its demand for Chip-on-Wafer-on-Substrate (CoWoS) packaging capacity.
