TSMC CEO C.C. Wei has dismissed recent market speculation indicating Nvidia is cutting back its demand for Chip-on-Wafer-on-Substrate (CoWoS) packaging capacity.
During the inauguration ceremony of SPIL on January 16, Nvidia founder and CEO Jensen Huang stated that the Blackwell system has now fully entered production, which will gradually...
TSMC has maintained its equipment orders, despite market rumors regarding a decrease in demand for Chip-on-Wafer-on-Substrate (CoWoS) packaging from Nvidia. According to sources at...
TSMC is set to achieve new revenue and profit records in 2024, driven by strong AI orders, according to industry sources. The pure-play foundry continues to accelerate its advanced...
TSMC is leveraging strong demand for sub-7nm advanced processes and its exclusive CoWoS packaging services, emerging as the leading beneficiary of the AI boom in 2024. Despite a slow...
Broadcom's stellar performance and outlook have energized the ASIC market, prompting numerous companies to enter the AI chip arena. The industry sentiment has shifted from overwhelming...
According to industry sources, TSMC is working to integrate CoWoS and SiPh, seeking to launch co-packaged optics (CPO) in 2026 that may inject fresh momentum into the semiconductor...
TSMC announced at the Open Innovation Platform (OIP) Ecosystem Forum in Europe that its CoWoS packaging technology will achieve certification by 2027, introducing a version with 9x...
TSMC's CoWoS technology continues to scale, driven by strong demand from major clients such as Nvidia. Production capacity is projected to reach 75,000 units by 2025, with the persistent...
On November 8, news broke that China's 7nm chip manufacturing supply was cut off, prompting major foundries like TSMC and Samsung Foundry to remain silent. However, recent reports...
TSMC plans to more than double its CoWoS packaging production capacity to meet the surging AI server demand in 2025. Industry sources indicate that Nvidia will consume up to 60% of...
TSMC is strategically developing a dedicated supply chain cluster on 30 hectares (300,000 square meters) of land in Southern Taiwan Science Park (STSP) to strengthen its advanced...
Taiwanese semiconductor equipment manufacturers working with TSMC are benefiting significantly from its orders, with eight of them reporting gross margins of 40-60% in the second...
Driven by rising demand for chip-on-wafer-on-substrate (CoWoS) and other advanced packaging equipment, Taiwan-based semiconductor automation and wet process equipment maker Grand...
