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Wednesday 27 October 2021
TSMC intros N4P process
TSMC has introduced its N4P process, a performance-focused enhancement of the foundry's 5nm technology platform.
Thursday 21 October 2021
New MediaTek 5G modem chip built using TSMC 4nm process
MediaTek will enter volume shipments of its new-generation 5G modem based on the latest 3GPP 5G R16 standard in 2022, gearing up for a boom in demand for flagship 5G smartphones,...
Thursday 21 October 2021
IC design houses see clients increasingly reluctant to accept price hikes
Taiwan-based IC design houses, particularly those engaged in consumer ICs, have come under increasing pressure to maintain their quotes for 2022 as customers are more reluctant to...
Thursday 21 October 2021
Foundry quotes to rise at slower pace in 2022
Foundry quotes are expected to continue rising but at a slower pace in 2022, according to sources at Taiwan-based pure-play foundries.
Tuesday 19 October 2021
IC design houses join Foxconn EV ecosystem
Taiwan-based semiconductor suppliers MediaTek, Novatek, Realtek, Sunplus, ITE Tech, PixArt Imaging, Weltrend, Fitipower, NOVA, and Nuvoton have joined the Foxconn-led EV consortium,...
Tuesday 19 October 2021
IC design houses set to continue stockpiling specific chips
IC design houses intend to continue scaling up their inventory levels for specific chips or applications, despite a recent slowdown in end-market demand for consumer devices, according...
Friday 15 October 2021
Chipmakers gearing up for Wi-Fi 6/6E chip boom
Chipmakers including MediaTek, Qualcomm, and Broadcom are set to ramp up their output for Wi-Fi 6/6E chip solutions looking to embrace booming demand for such chips and increase their...
Wednesday 13 October 2021
Taiwan IC design houses combat rising wafer foundry costs
TSMC's plans to raise its foundry service quotes have caused a stir among its customers. Wafer foundry and packing/testing production capacity prices have been going up. The price...
Friday 8 October 2021
Egis board approves investments in three companies
The board of directors of Egis Technology, a Taiwan-based IC design house specializing in fingerprint sensors, has approved plans to make investments in three firms - PC peripheral...
Tuesday 5 October 2021
Chipmakers striving to cope with uneven inventories across different chips
Chipmakers have experienced a worsening shortage of power management ICs and other mature chips, while having relatively high inventories of handset application processors and other...
Friday 1 October 2021
Etron strikes deal for foundry capacity through 2023
Specialty DRAM design specialist Etron Technology has signed an agreement with Powerchip Semiconductor Manufacturing (PSMC) under which the foundry will provide it sufficient fab...
Monday 27 September 2021
Taiwan IC vendors poised to raise prices in 4Q21
Several Taiwan-based IC design houses are poised to raise their chip prices starting the fourth quarter of 2021 to reflect rising manufacturing costs, according to industry sources...
Friday 17 September 2021
Flexible AMOLED + On Cell design adopted for iPhone 13 series
Flexible AMOLED + On Cell display design is adopted for 5.4-inch iPhone 13 mini, 6.1-inch iPhone 13, 6.1-inch iPhone 13 Pro and 6.7-inch iPhone 13 Pro Max, according to industry so...
Friday 17 September 2021
MediaTek keen on enriching design talent pool
MediaTek has expanded its recruitment scale in Taiwan, looking to hire an additional over 2,000 design engineers to support its business expansion goals.
Friday 17 September 2021
GaN Systems strikes deal with BMW
GaN Systems has announced the signing of a comprehensive capacity agreement with BMW Group for GaN Systems' high-performance, automotive-grade GaN power transistors, which increase...
Tuesday 23 January 2018
Samsung 1ynm DDR4
Samsung Electronics has begun mass producing the second generation of 10nm-class (1y-nm), 8Gb DDR4 DRAM. For use in a wide range of next-generation computing systems, the new 8Gb DDR4 features the highest performance and energy efficiency for an 8Gb DRAM chip, as well as the smallest dimensions, Samsung said. Samsung's 2nd-generation 10nm-class 8Gb DDR4 features an approximate 30% productivity gain over the company's 1st-generation 10nm-class 8Gb DDR4. In addition, the new 8Gb DDR4's performance levels and energy efficiency have been improved about 10% and 15% respectively, thanks to the use of an advanced, proprietary circuit design technology. The new 8Gb DDR4 can operate at 3,600Mbps per pin, compared to 3,200Mbps of the company's 1x-nm 8Gb DDR4. To enable these achievements, Samsung has applied new technologies, without the use of an EUV process. The innovation here includes use of a high-sensitivity cell data sensing system and a progressive "air spacer" scheme. In the cells of Samsung's 2nd-generation 10nm-class DRAM, a newly devised data sensing system enables a more accurate determination of the data stored in each cell, which leads to a significant increase in the level of circuit integration and manufacturing productivity. Samsung has finished validating its 2nd-generation 10nm-class DDR4 modules with CPU manufacturers, and next plans to work closely with its global IT customers in the development of more efficient next-generation computing systems.