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Monday 31 August 2026
Nvidia takes US$3.5 billion of MediaTek's record US$3.9 billion convertible bond
MediaTek has completed pricing on US$3.9 billion of overseas convertible bonds, more than NT$120 billion and what the company says is the largest overseas CB ever issued in Taiwan's...
Monday 31 August 2026
Agentrys, agentic chip design startup backed by MediaTek, raises US$24.5M in funding
Chip design company Agentrys announced last week that it raised US$24.5 million in funding from backers including MediaTek. It is one among an emerging crop of startups using agentic...
Monday 31 August 2026
Shanghai's 15th Five-Year Plan bets on chips, AI, advanced packaging
On August 26, the Shanghai municipal government released its 15th Five-Year Plan for the Development of Strategic Emerging Industries, setting a target for added value in strategic...
Monday 31 August 2026
Weekly news roundup: US pressures Korea chip investment, MediaTek wins Google TPU, Apple debuts 2nm M6
Semiconductor investment, AI chips, advanced packaging and data center infrastructure dominated the week, with South Korea facing US pressure, India scaling chip manufacturing, and...
Monday 31 August 2026
India roundup: India broadens semiconductor and AI ambitions across manufacturing, design, materials and data centers
India's semiconductor ambitions are expanding from packaging and testing to chip design, materials, mobile devices and data centers. New investments by CG Power, Infineon, Foxconn,...
Monday 31 August 2026
Podcast highlights: Xiaomi's 3nm chip cap, HBM in Malaysia, and Nvidia's margin tradeoff
Can Xiaomi's in-house chip reach 2nm? Is HBM rerouting to Malaysia TSMC giving Intel a pass? Can Nvidia hold a 75% gross margin or protect market share? Ahead of Apple's September...
Saturday 29 August 2026
Research Insight: Humanoid robots near mass production as suppliers face precision, ramp-up test
Research Insight: Humanoid robots near mass production as suppliers face precision and ramp-up test
Friday 28 August 2026
Samsung diverges from TSMC on FOPLP: retains 415×510mm panel size, targets 2028 mass production
Samsung Electronics' packaging technology lead, Lee Hee-seok, outlined the company's advanced semiconductor packaging roadmap at Advanced Semiconductor Packaging & Chiplet Show...
Thursday 27 August 2026
Synopsys lifts 3QFY26 sales, raises full-year outlook
Synopsys, a leading electronic design automation (EDA) company, reported stronger-than-expected fiscal third-quarter results for the 2026 fiscal year (3QFY26) as the AI boom drove...
Thursday 27 August 2026
Apple sets September 9 event for foldable iPhone and iPhone 18 Pro debut
Apple said it will hold its fall product launch event on September 9 at 10 a.m. Pacific timei. The presentation, titled "Surprise and shine," will be hosted by the new chief executive...
Thursday 27 August 2026
Beijing's AI4Chip plan puts AI to work on EDA, fabs, advanced packaging
Beijing is extending artificial intelligence deeper into semiconductor production, targeting chip design, wafer fabrication, packaging, testing, equipment, and materials under what...
Wednesday 26 August 2026
South Korea, US clash over reactor choice in US$350B nuclear deal
South Korea and the United States are at odds over which reactor design to build — and who runs the project — in the nuclear power component of Seoul's US investment package,...
Wednesday 26 August 2026
Hot Chips 2026: Samsung advances LPDDR5X-PIM as HBM costs mount
At Hot Chips 2026, Samsung Electronics moved processing-in-memory (PIM) closer to practical deployment, presenting what it described as the industry's first LPDDR-based PIM device...
Wednesday 26 August 2026
Google's TPU v10 turns multi-vendor, deepening MediaTek's ASIC role
Google's expanding list of TPU partners has sparked widespread industry discussion, centering on whether current IC design suppliers Broadcom and MediaTek will see their orders imp...