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Tuesday 28 April 2026
OpenAI eyes agentic AI phone but faces challenges beyond chip design
OpenAI's agentic AI phone could reshape mobile markets and supply chains by forcing incumbents to respond. Still, success depends on delivering both interface breakthroughs and competitive...
Tuesday 28 April 2026
Emerging supplier targets low-earth orbit satellite market with cryogenic high-frequency cables
An electronics components firm, U-leam, founded in September 2022, said it is targeting the low-earth orbit satellite market by supplying high-frequency connectors, cable assemblies,...
Tuesday 28 April 2026
Cadence signals strong start to 2026 as AI drives growth across EDA and IP

Cadence Design Systems reported a robust first quarter for 2026, underscoring how accelerating demand for AI is reshaping semiconductor...

Tuesday 28 April 2026
AI-driven demand and record backlog fuel Cadence's strong start to 2026
Cadence Design Systems reported a solid first quarter for 2026, with growth driven by accelerating AI demand and sustained customer investment in chip and system design tools.
Monday 27 April 2026
Samsung reportedly breaks 10nm barrier with first single-digit nanometer DRAM working die
Samsung Electronics has reportedly become the first company in the world to develop a single-digit nanometer-class 10a DRAM working die, using the prototype to fine-tune process conditions...
Monday 27 April 2026
HCL-Foxconn JV taps Taiwan's CTCI to build India OSAT facility
The HCL-Foxconn joint venture has selected Taiwan-based engineering firm CTCI as the engineering, procurement, and construction (EPC) partner for its upcoming outsourced semiconductor...
Monday 27 April 2026
India roundup: Micron ramp, Dholera SEZ push India toward full-stack chip manufacturing

India is accelerating its semiconductor ambitions, from Micron Technology's Sanand ramp to new...

Monday 27 April 2026
Research insights: tendon-driven dexterous hands are key development factor as humanoids enter home market
While humanoid robots application remains a topic of debate, initial deployment is expected to be in structured environmental environments. However, there is large potential in the...
Monday 27 April 2026
Taiwan's NCSIST partners with Saronic to advance autonomous maritime capabilities

Taiwan's National Chung-Shan Institute of Science and Technology (NCSIST) said on April 24 that it has signed a memorandum of understanding...

Sunday 26 April 2026
BMW's color-changing car is no longer a concept — E Ink says it's ready for mass production
E-paper manufacturer E Ink stated that the BMW iX3 Flow Edition equipped with E Ink Prism technology was officially released at the Auto China 2026. This represents a major breakthrough...
Friday 24 April 2026
M31 and TSMC complete eUSB2V2 tapeout on N2P process
IP provider M31 has announced that its eUSB2V2 interface IP has completed tapeout on TSMC's N2P 2nm process. M31 CEO Scott Chang emphasized that 2nm interface IP must align closely...
Friday 24 April 2026
SMIC returns to advanced packaging, scales team to boost AI chip strategy

China's leading foundry, SMIC, is quietly recalibrating its strategy, moving beyond its long-standing focus on front-end wafer manufacturing...

Friday 24 April 2026
Intel says 18A yield improves as 14A advances to early customer engagement stage
Intel reported steady progress on its most advanced manufacturing technologies, saying its 18A process node is seeing meaningful yield improvements, while the next-generation 14A node...
Thursday 23 April 2026
SpaceX eyes GPU push as Tesla taps Samsung for chip upgrade

SpaceX is exploring in-house production of graphics processing units (GPUs) as it cites potential chip supply constraints, even as Tesla...

Thursday 23 April 2026
UN cyber mandates force global auto rethink
New UN rules requiring EU cars to adopt comprehensive cybersecurity systems from mid-2024 will reshape global automotive competitiveness, supply chains, and digital strategies. The...