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Tuesday 9 July 2024
Resonac forms alliance developing advanced packaging in US
A new semiconductor back-end process R&D alliance, US-JOINT, is set to launch in Silicon Valley in 2025. The alliance will focus on next-generation semiconductor packaging technologies...
Tuesday 9 July 2024
Samsung to make 2nm chips for Japan AI firm
Samsung Electronics has announced that it will provide turnkey semiconductor solutions using the 2-nanometer (nm) foundry process and the advanced 2.5D packaging technology Interposer-Cube...
Tuesday 9 July 2024
Japan invests in AI translation to boost ACGN export
The Japanese government's intellectual property export strategy, known as the "Cool Japan" strategy, proposed its latest amendment in 2024. It identified translation as the primary...
Tuesday 9 July 2024
EU tariff on Chinese EVs stirs industry waters, MG holds steady
The European Union's temporary tariff on Chinese electric vehicles (EVs) kicked in on the 5th, sparking varied reactions among automakers. Despite initial assurances from Chinese...
Tuesday 9 July 2024
Computing clusters with at least 10,000 GPUs become basic requirement for Chinese Gen-AI LLMs

The keen competition of large-language models (LLMs) is pushing various Generative AI operators in China to find alternatives to achieve higher computing power without...

Tuesday 9 July 2024
SoftBank to acquire British AI chip designer Graphcore for US $500 million
SoftBank offered to acquire Graphcore, which designs AI chips for data centers, for US$500 million. The deal is subject to review by the UK, while SoftBank's massive stake in Arm...
Tuesday 9 July 2024
Nvidia's H20 to go head-to-head with Chinese AI chips; procurement intent from major CSPs will be key
The rapid development of large language models (LLMs) in China has led to various development bottlenecks for AI, including complex computing power management, high training and inference...
Tuesday 9 July 2024
Samsung develops FOWLP-HPB packaging solution to curb mobile AP overheating
Samsung Electronics is reportedly developing a new packaging technology to address the overheating of mobile application processors (APs), which may be applied to its next-generation...
Tuesday 9 July 2024
Wafer Works ramps up cross-strait 12-inch production, eyes strong second half
Wafer Works, a veteran semiconductor silicon wafer foundry in China, made its debut on Shanghai's STAR Market in February 2024. Simultaneously, the company launched a major expansion...
Tuesday 9 July 2024
Chinese EVs accelerate global expansion despite trade barriers
China's electric vehicle (EV) industry is aggressively pushing into overseas markets, navigating trade barriers from Europe and the US designed to stall its progress. However, these...
Tuesday 9 July 2024
OmniVision expands automotive CIS market share
Onsemi and OmniVision are now in a tight race for leadership in the automotive CMOS image sensor (CIS) market, with conflicting reports from research firms about which company held...
Monday 8 July 2024
AI advances propel bipedal robots: Japan lags as US and China lead breakthroughs
While Japanese manufacturers have long been at the forefront of bipedal humanoid robot development, recent AI breakthroughs from the US and China's IT industry have propelled these...
Monday 8 July 2024
Samsung establishes HBM development team as first major change under new DS division head
Under the guidance of newly appointed head Young Hyun-Jun, Samsung Electronics' Semiconductor and Device Solutions (DS) division is reportedly enhancing its competitiveness in high-bandwidth...
Monday 8 July 2024
Taiwanese PA chip makers see strong demand from China and US
As the smartphone industry enters its peak shipment season in the second half of 2024, major brands are launching new devices. Taiwan's power amplifier (PA) chip supply chains, including...
Monday 8 July 2024
TSMC subsidiary JASM to double hiring for new chip factories in Japan
Japan Advanced Semiconductor Manufacturing (JASM), a subsidiary of Taiwan Semiconductor Manufacturing Company (TSMC), is set to significantly increase its workforce in spring 2025...
Holtek
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research