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NEWS TAGGED EAST ASIA
Thursday 25 July 2024
TSMC to break ground for German fab at year-end 2024, sources say
TSMC is expected to break ground on its new wafer fab in Germany around the end of 2024, with volume production to begin by the end of 2027, according to sources at semiconductor...
Thursday 25 July 2024
TSMC fab in Germany faces challenges for profitability
TSMC's German wafer fab will confront three major barriers to profitability: labor unions, high costs, and a limited workforce.
Wednesday 24 July 2024
Kishida calls for more money to develop domestic chip sector
Prime Minister Fumio Kishida's administration is drafting legislation to propel further investment in chipmaking capacity at home.
Wednesday 24 July 2024
BOE's B16 OLED commitment boosts South Korean suppliers, Wonik to receive increased orders
Chinese panel manufacturer BOE has recently announced the construction of its 8.6G IT OLED production line, known as B16. This development has significantly benefited numerous South...
Wednesday 24 July 2024
SK Group megamerger to reshape Asia's energy landscape
SK Group, one of South Korea's largest conglomerates, is on the cusp of a monumental transformation. As the merger between SK Innovation (SKI) and SK E&S reaches its final phase,...
Wednesday 24 July 2024
IC packaging will be more important than foundry, says YMTC chairman
Chen Nanxiang, chairman of Chinese memory company Yangtze Memory Technology Corp (YMTC), recently said during an interview with China Global Television Network (CGTN) that he expects...
Wednesday 24 July 2024
Inspur refutes Nvidia B20 collaboration reports amid H20 export restriction warnings by analysts
Inspur, a Chinese server manufacturer, recently denied a Reuters report, stating it has no collaboration with Nvidia on designing a B20 AI chip based on the Blackwell architecture...
Wednesday 24 July 2024
Samsung unveils the ultra-thin Galaxy Z Fold6 Slim to compete with Chinese rivals
Samsung Electronics, fresh off its July 2024 launch of new foldable phones, is gearing up to introduce a sleeker, more lightweight model: the Galaxy...
Wednesday 24 July 2024
SDC 8.6G OLED investment fuels South Korea panel equipment import surge
South Korea's imports of panel manufacturing equipment soared tenfold in the first half of 2024 compared to the same period in 2023, reaching approximately US$315 million. This dramatic...
Wednesday 24 July 2024
Who will benefit from a potential tariff war on chips?
With Taiwan Semiconductor Manufacturing Company (TSMC) chairman C. C. Wei promising to carry through overseas expansion plans regardless of the next US President, those securing TSMC's...
Wednesday 24 July 2024
Sharp acquires communication patents from Foxconn subsidiary to boost wireless tech portfolio
Sharp has made a strategic move to enhance its mobile device wireless communication technology by acquiring communication patents from Foxconn. This acquisition aims to strengthen...
Wednesday 24 July 2024
Samsung HBM3 and HBM3E still pending Nvidia quality tests
Korean media reports said Samsung Electronics's 4-generation high bandwidth memory product (HBM3) has been validated and has started mass production. However, industry sources only...
Wednesday 24 July 2024
TSMC said to adopt larger glass substrates for FOPLP
Glass substrates have become a critical strategic element in fan-out panel level packaging (FOPLP), a technology that TSMC and various backend houses are developing. Because of that,...
Tuesday 23 July 2024
ASML looks to expand staff in Japan thanks to rising local EUV demand
As Japan prepares to import its first-ever EUV lithography systems, ASML, the sole technology provider, plans to boost its local workforce significantly.
Tuesday 23 July 2024
YMTC head expects explosive chip demand in China amid US restrictions
A senior executive from a leading China-based NAND flash provider expressed optimism about the explosive growth potential of the Chinese semiconductor market, attributing this surge...