While consumer electronics demand is experiencing a sluggish recovery, major Chinese MCU suppliers have redirected their attention to automotive and white household appliances, according...
TSMC is expected to break ground on its new wafer fab in Germany around the end of 2024, with volume production to begin by the end of 2027, according to sources at semiconductor...
Chinese panel manufacturer BOE has recently announced the construction of its 8.6G IT OLED production line, known as B16. This development has significantly benefited numerous South...
SK Group, one of South Korea's largest conglomerates, is on the cusp of a monumental transformation. As the merger between SK Innovation (SKI) and SK E&S reaches its final phase,...
Chen Nanxiang, chairman of Chinese memory company Yangtze Memory Technology Corp (YMTC), recently said during an interview with China Global Television Network (CGTN) that he expects...
Inspur, a Chinese server manufacturer, recently denied a Reuters report, stating it has no collaboration with Nvidia on designing a B20 AI chip based on the Blackwell architecture...
Samsung Electronics, fresh off its July 2024 launch of new foldable phones, is gearing up to introduce a sleeker, more lightweight model: the Galaxy...
South Korea's imports of panel manufacturing equipment soared tenfold in the first half of 2024 compared to the same period in 2023, reaching approximately US$315 million. This dramatic...
With Taiwan Semiconductor Manufacturing Company (TSMC) chairman C. C. Wei promising to carry through overseas expansion plans regardless of the next US President, those securing TSMC's...
Sharp has made a strategic move to enhance its mobile device wireless communication technology by acquiring communication patents from Foxconn. This acquisition aims to strengthen...
Korean media reports said Samsung Electronics's 4-generation high bandwidth memory product (HBM3) has been validated and has started mass production. However, industry sources only...
Glass substrates have become a critical strategic element in fan-out panel level packaging (FOPLP), a technology that TSMC and various backend houses are developing. Because of that,...
As Japan prepares to import its first-ever EUV lithography systems, ASML, the sole technology provider, plans to boost its local workforce significantly.
