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Monday 24 August 2026
AI energy bottleneck is driving semiconductor materials innovation, says Applied Materials
Rising demand for artificial intelligence (AI) computing is driving a new wave of technological transformation in the semiconductor industry, while energy is emerging as the next bottleneck...
Monday 24 August 2026
Taiwan semiconductor materials team up to build local supply chain

Taiwan's semiconductor materials industry is entering a new window of opportunity as advanced semiconductor process and packaging technologies...

Monday 24 August 2026
India roundup: India's chip push moves beyond fabs as yield, supply chains and new technology become the next test
India's semiconductor strategy is entering a more demanding phase, shifting from attracting fabs and assembly plants toward building the capabilities needed to sustain them. From wafer...
Saturday 22 August 2026
Column: Lessons in supply chain resilience from China Huadian's power-compute coordination model
As AI develops rapidly, data centers are driving equally rapid growth in electricity demand. The stability of future energy supplies will directly determine whether AI computing capacity...
Saturday 22 August 2026
Manz Asia says yield is key to glass core mass production
As AI chips continue to grow in size, the shift in advanced packaging from 300 mm wafers to square panels is becoming clearer, driving parallel development of new packaging technologies...
Friday 21 August 2026
China chip equipment maker Piotech posts 1,324% profit surge, advanced deposition scales up
Piotech Inc. reported a sharp rise in first-half 2026 earnings, helped by stronger demand for semiconductor deposition equipment, wider adoption of new process tools and improving...
Friday 21 August 2026
Hiwin expands into CPO optical coupling process; 2H26 robotics revenue outlook brightens
Hiwin Technologies Chairman Eric Y. T. Chuo stated that the company has supplied samples of miniature ball screws and single-axis robots to co-packaged optics (CPO) vendors across...
Friday 21 August 2026
CoWoS boom lifts Taiwan semiconductor equipment makers, Bosch Rexroth targets 2027 volume growth
Bosch Rexroth, the industrial technology subsidiary of Bosch, showcased advanced semiconductor and smart manufacturing solutions at the 2026 Taipei International Industrial Automation...
Friday 21 August 2026
Charts: AI test demand drives broadest growth among Taiwan's chip equipment suppliers
Thirty-eight of 43 companies grew year to date at a median rate of 28.7% — the highest of any semiconductor sub-sector — with test handlers, sockets and probe cards recurring...
Thursday 20 August 2026
China reportedly delays germanium, quartz clearances, impacting Taiwan optics and aerospace suppliers
China has reportedly delayed customs clearance for critical materials — including germanium, quartz-based materials and neodymium magnets — since 2025, lengthening delivery...
Thursday 20 August 2026
AMEC profit jumps 300%: China chip equipment maker expands beyond etch with US$520M plan
Advanced Micro-Fabrication Equipment Inc. China (AMEC) posted a 300% surge in first-half 2026 profit and announced a CNY3.5 billion (US$520 million) capacity expansion, accelerating...
Thursday 20 August 2026
Jusung, PSK China sales plunge over 40% amid China's chip self-sufficiency drive

Jusung Engineering and PSK each lost more than 40% of their China revenue in 2025. The similarity ends there.

Thursday 20 August 2026
Nvidia, TSMC, chip gear makers ride AI boom into high-margin club
Strong AI demand is driving a wave of high profitability across the semiconductor supply chain, with equipment and materials suppliers increasingly joining a "high-margin club." Trailing...
Thursday 20 August 2026
Delta expands AI automation push into robotics, semiconductors, machinery

Delta Electronics outlined a broader AI strategy at the Taipei International Industrial Automation Exhibition on August 19, unveiling...

Thursday 20 August 2026
Samsung to break ground on KRW6 trillion Onyang HBM packaging plant in September
Samsung Electronics will break ground in September on a KRW6 trillion (approx. US$4.31 billion) HBM production and advanced-packaging facility at its Onyang campus in Asan, South Korea,...