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Monday 20 July 2026
Merck ramps up AI semiconductor materials push as Level Up nears completion

AI is redrawing the rules of semiconductor competition, pushing materials suppliers beyond simple chemical inputs and toward integrated...

Monday 20 July 2026
Networking demand remains resilient, but component shortages threaten shipment schedules

AI data center expansion and high-speed network upgrades continue to support demand for networking equipment. However, as the industry...

Monday 20 July 2026
CXMT's US$4B IPO fuels DRAM capacity race toward 350,000 wafers a month

Chinese DRAM maker ChangXin Memory Technologies (CXMT) is accelerating construction and technology upgrades across its manufacturing...

Monday 20 July 2026
Hanmi Semiconductor speeds up HBM tool output and plants US flag as equipment shortage looms
South Korea's Hanmi Semiconductor is racing to expand output of the bonding equipment that global memory and foundry makers rely on to build high-bandwidth memory (HBM), warning that...
Monday 20 July 2026
India roundup: India deepens semiconductor and AI ambitions as local ecosystem expands beyond fabs and assembly
India is broadening its technology strategy from attracting chip factories to building semiconductor equipment, materials, AI capabilities, supply chains and trade partnerships as...
Sunday 19 July 2026
ASML supplier Trumpf says South Korea EUV demand is growing faster than Taiwan's
High-NA EUV lithography is becoming the semiconductor equipment industry's next major battleground as demand rises for more advanced chips used in artificial intelligence, high-performance...
Saturday 18 July 2026
EU clears €659 million in German subsidies for four chip plants
The European Commission has approved EUR659 million in German state aid for four semiconductor facilities, a move that could affect supply chains used in cars, industrial equipment,...
Saturday 18 July 2026
As AI expands nanotech, Samsung fortifies ecosystem and LG pivots to chip equipment
Nanotechnology is increasingly seen as a key enabler in the AI era, with competition broadening from semiconductors, manufacturing to home appliances. At Nano Korea 2026 held in Goyang,...
Saturday 18 July 2026
Trumpf recalibrates strategy as Chinese competition heats up in semiconductors, machine tools

Global suppliers are facing tougher competition as China's semiconductor and machine tool industries expand quickly, with implications...

Friday 17 July 2026
Laser Tek says AI demand is driving orders, but parts shortages are delaying shipments
Taiwanese laser processing equipment maker Laser Tek said that artificial intelligence(AI)-led investment in advanced packaging, testing, and passive components is boosting orders...
Friday 17 July 2026
South Korean suppliers ramp up hybrid bonding R&D beyond HBM5
As high-bandwidth memory (HBM) stacks add more layers, requirements for chip-to-chip bonding accuracy and signal transmission efficiency are becoming more demanding.
Friday 17 July 2026
Cica-Huntek opens Arizona plant to support advanced chip manufacturing in the US
Cica-Huntek Chemical Technology said on July 16 that its subsidiary facility in Phoenix, Arizona, had been completed and officially opened after about US$8 million in investment. The...
Thursday 16 July 2026
Hanmi, Hanwha clash in court over HBM equipment patents
Hanmi Semiconductor and Hanwha Semitech clashed in a Seoul courtroom over patents covering thermocompression bonders, or TC bonders, critical equipment used to stack DRAM chips vertically...
Thursday 16 July 2026
Commentary: CXMT IPO binds China's DRAM supply chain into one ecosystem

CXMT's STAR Market IPO has become more than a fundraising exercise. The strategic placement roster shows how China's largest DRAM maker...

Thursday 16 July 2026
CXMT's US$8.5 billion IPO signals China's accelerating challenge to global memory leaders
CXMT's Shanghai debut could reshape global memory markets by speeding China's push into advanced DRAM and HBM, while highlighting how US export controls are altering the industry's...