News tagged equipment at DIGITIMES

NEWS TAGGED EQUIPMENT

Friday 27 February 2026

From equipment to talent, Japan moves to anchor India's chip expansion

Japan is planting its flag in India's semiconductor sector — and doing so fast. The market is projected to reach US$110 billion by 2030, and Japanese firms are racing to claim...

Thursday 26 February 2026

BizLink sees HPC and semiconductor revenue surpass 50% with AI data center upgrade wave

As generative AI drives rapid expansion in data centers and high-performance computing (HPC) infrastructure, the importance of interconnect technology is evolving from traditional...

Wednesday 25 February 2026

Unimicron's 4Q25 profit surpasses combined earnings of first 3 quarters; 2026 capex raised to NT$34 billion

Given the steady demand for AI and high-performance computing (HPC) chips, Unimicron stated that orders for IC substrates and PCBs have picked up. This has not only steadily increased...

Wednesday 25 February 2026

Sigurd invests NT$1.54B to acquire Unimicron's Hukou plant amid strong AI, ASIC demand

Taiwan's IC packaging and testing supply chain is accelerating expansion as Sigurd announced it will invest NT$1.54 billion (approx. US$49M) to purchase a factory in the Hukou Industrial...

Wednesday 25 February 2026

China targets fivefold jump in advanced chip output to fuel AI expansion

China is preparing a fivefold increase in domestic advanced logic chip output within one to two years to support its expanding AI computing infrastructure, according to people familiar...

Wednesday 25 February 2026

AI drives automation demand, industrial market set for gradual recovery

Following inventory corrections and demand adjustments in the global ICT industry from 2023 to 2025, the sector's economic landscape has shown clear divergence. AI server demand centered...

Monday 23 February 2026

Samsung brings forward P5 cleanroom timeline under 'Shell First' strategy

Samsung Electronics has accelerated cleanroom construction at its Pyeongtaek Fab 5 (P5), pushing forward capacity expansion for high-bandwidth memory and advanced-node semiconductor...

Saturday 21 February 2026

Tech sector braces for Trump's 10% tariff reset

Global technology supply chains are facing renewed uncertainty after US President Donald Trump announced a temporary 10% tariff on most...

Thursday 19 February 2026

DIGITIMES Insight: TSMC's swelling facilities budget signals a global capacity race

When chipmakers spend big, it is usually the machines that cost the most. Process equipment — the lithography tools, deposition systems, and etch chambers that define the bleeding...

Tuesday 17 February 2026

Samsung accelerates HBM hybrid bonding line to meet Nvidia demand

Samsung Electronics is reportedly accelerating preparations for next-generation high-bandwidth memory (HBM), moving to establish a hybrid bonding production line at its Cheonan campus...

Sunday 15 February 2026

CXMT races to scale up as yield gaps and export curbs bite

CXMT, a leading Chinese DRAM maker, is expanding aggressively but faces significant production and regulatory hurdles, ChosunBiz reported, citing industry sources. Despite...

Saturday 14 February 2026

HBM steals the show at SEMICON Korea despite Samsung, SK Hynix skipping the floor

Artificial intelligence-driven growth in the semiconductor industry has drawn increasing public attention. SEMICON Korea, organized by SEMI, continues to expand in scale. The 2026...

Friday 13 February 2026

Shihlin Electric expands in North America as orders extend to 2030

Shihlin Electric is entering 2026 with strong operating momentum, supported by accelerated contract releases under Taipower's grid resilience...

Friday 13 February 2026

TSMC and memory makers boost capex to offset China export restrictions impact

TSMC raised its 2026 capital expenditure forecast to US$52-56 billion, driving strong demand in the global semiconductor supply chain amid AI growth. Memory giants SK Hynix, Micron,...

Friday 13 February 2026

SK Hynix reportedly begins equipment orders for Cheongju HBM packaging line amid AI-driven capacity race

SK Hynix has started placing initial equipment orders to convert an idle Cheongju fab into a high-bandwidth memory (HBM) packaging and testing line, according to ET News,...

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Feb 9, 08:00

iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory

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RESEARCH INSIGHTS

Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook