中文網
  • 繁體
  • 简体
    •
  • My account
  • Sign in
  • Sign up
    •
    Trending
    CONNECT WITH US
    Chinese private satellite firms accelerate IPOs, boosting financial space applications
    11h 39min ago
    Commrntary: TCL and Lenovo upgrade global strategies after CES 2026
    11h 40min ago
    Shift in supply chain dynamics challenges China's NPI dominance
    11h 40min ago
    SAS chair warn challenges ahead forTaiwan-US industries, unveils new wafer and green energy strategy
    11h 40min ago
    Taiwanese firms prepare for silicon photonics CPO packaging opportunities amid AI data center growth
    11h 40min ago
    Inventec secures Google TPU server L10 orders, marking milestone for Taiwan ODMs
    11h 40min ago
    NEWS TAGGED EQUIPMENT
    Wednesday 21 January 2026
    Samsung reportedly exploring ASMPT for TCB supply
    Samsung Electronics is reportedly diversifying its supply chain for thermal compression bonders (TCB), a critical tool in high-bandwidth memory (HBM) production, by engaging Singapore-based...
    Wednesday 21 January 2026
    Fortune Electric, Nan Ya target opportunities in import-oriented US transformer market
    The US urgently needs to upgrade its aging grid infrastructure amid surging demand from large-scale AI computing, yet its domestic production capacity for heavy electrical equipment...
    Wednesday 21 January 2026
    Jabil invests in semiconductor power systems, expanding chipmaking footprint
    Jabil Inc., the global manufacturing and supply-chain services company, said on Tuesday that it had made a strategic minority investment in Eagle Harbor Technologies, a Seattle-based...
    Wednesday 21 January 2026
    China's semiconductor equipment leaders push HBM autonomy as US tightens restrictions
    US export restrictions on advanced semiconductor equipment to China have become the biggest obstacle to China's domestic production of high-bandwidth memory (HBM). It has been reported...
    Tuesday 20 January 2026
    Advantest faces three standardization challenges in shift-left testing
    The silicon photonics (SiPh) and common packaged optics (CPO) solutions supply chains are emerging this year. Japanese testing equipment maker Advantest says that although optical...
    Tuesday 20 January 2026
    ASM International reports stronger orders as China's demand rebounds

    ASM International said it posted stronger-than-expected preliminary results for the fourth quarter of 2025, buoyed by a rebound in demand...

    Tuesday 20 January 2026
    Samsung reportedly to test EUV tools at Taylor fab in March
    Samsung Electronics will reportedly begin test operations of extreme ultraviolet lithography equipment at its Taylor, Texas, fabrication plant in March, ahead of full operations planned...
    Tuesday 20 January 2026
    Eternal Precision secures position in AI with glass substrate, panel-level packaging equipment
    Eternal Precision Mechanics (EPM), a subsidiary of Eternal Materials, made its official market debut on January 16, listing shares at an underwriting price of NT$125 (approx. US$3....
    Monday 19 January 2026
    Advantest ATE lead times remain tight as AI and memory markets expand
    As demand strengthens in markets such as GPUs and high-bandwidth memory (HBM), Japan-based Advantest said orders for semiconductor automated test equipment (ATE) remain stable, with...
    Sunday 18 January 2026
    SK Hynix reportedly completes 1a DRAM upgrade at Wuxi plant in China

    SK Hynix has reportedly finished converting its key DRAM production facility in Wuxi, China, to the fourth-generation 1a process. The...

    Saturday 17 January 2026
    Internal memo reveals Micron has locked in PSMC HBM capacity through prepayment

    Powerchip Semiconductor Manufacturing Corporation (PSMC) has provided new details on its planned sale of the Tongluo P5 fabrication plant...

    Saturday 17 January 2026
    Canon eyes 2027 inkjet wafer planarization launch

    Canon said on January 13 that it has developed a new wafer planarization technology designed to uniformly smooth surface irregularities...

    Friday 16 January 2026
    Honlynn pivots to cloud, cybersecurity, and AI as TPEx debut nears
    Honlynn, a subsidiary of Abico Group, will be listed on the Taipei Exchange's Emerging Stock Board on January 16, 2026, marking a strategic inflection point as the company pivots from...
    Thursday 15 January 2026
    ASML CEO claims China's EUV lags by 8 gen ahead of 4Q25 earnings
    ASML, the Dutch semiconductor equipment leader and exclusive supplier of EUV lithography systems, is set to release its fourth-quarter 2025 and full-year financial results on January...
    Thursday 15 January 2026
    Aurotek posts record revenue in December 2025 and full-year results amid strong demand
    Aurotek Corp. reported historic revenue figures for December 2025 and the full year, driven by growth in smart manufacturing, automation equipment, and robotics. The company recorded...
    1/52 pages
    Research Report Database
    BIZ FOCUS
    Jan 6, 16:39
    MSI Unveils Full Lineup of AI Products at CES 2026
    Tuesday 6 January 2026
    SK hynix Showcases Next Generation AI Memory Innovation at CES 2026
    Tuesday 6 January 2026
    DEEPX Unveils Vision as a Physical AI Infrastructure Company at CES 2026
    Tuesday 6 January 2026
    Skyted's Sound Bubble at CES 2026
    marketing
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook