ChangXin Memory Technologies has signed a long-term DRAM supply agreement with Tencent Holdings valued at more than CNY20 billion (approx...
Kyocera is committing JPY650 billion (approx. US$4 billion) to its components businesses through fiscal 2031, as AI data center investment...
Taiwan's Hsinchu Science Park is still attracting semiconductor service companies even as major foundries run short of land, underscoring...
Samsung Electronics is slowing its investment schedule for 1d DRAM, the seventh-generation 10nm-class DRAM node, as a sharp surge in...
China's AI chip race is pushing the semiconductor bottleneck into advanced packaging and testing, where HPC, HBM, Chiplets and domestic...
Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean...
SK Hynix is racing to complete the first cleanroom at its massive Yongin Semiconductor Cluster in Gyeonggi Province, South Korea, by...
