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    Commentary: China's EDA reckoning: geopolitics hits chip design tools
    6h 44min ago
    US EV strategic retreat sparks crisis as Chinese competion expands globally
    6h 48min ago
    South Korean IC design faces up to one-year packaging delays amid AI chip material shortages
    6h 48min ago
    Chinese TV brands surpass South Korean rivals with TCL nearing Samsung's market share
    6h 48min ago
    GPTC management shakeup raises concerns over TSMC, ASE, Micron orders
    6h 59min ago
    NEWS TAGGED EQUIPMENT
    Tuesday 10 February 2026
    Vanguard sees modest recovery as capacity use rises in early 2026

    Vanguard International Semiconductor (VIS) reported consolidated revenue of NT$4.01 billion (approx. US$127 million) in January 2026,...

    Tuesday 10 February 2026
    Analysis: Japan's supermajority reshapes Asia's semiconductor competition
    Japan's latest election is being read by global markets as a turning point in industrial policy, capital flows, and technology sovereignty across Asia — not a routine political...
    Monday 9 February 2026
    Sercomm eyes 2026 growth revival on WiFi 7 upgrade cycle
    Telecom broadband equipment maker Sercomm Corporation said on February 6, 2026, that its revenue for January 2026 reached NT$5.18 billion (US$164 million), up 32.9% from NT$3.9 billion...
    Monday 9 February 2026
    India's semiconductor push shifts focus under ISM 2.0 from fabs to design, equipment and IP
    According to The Economic Times, India's Electronics and IT Minister Ashwini Vaishnaw said India Semiconductor Mission (ISM) 2.0 will prioritise chip design companies and...
    Monday 9 February 2026
    TSMC supports Japan's advanced packaging plant construction
    TSMC chairman C.C. Wei recently visited Japan and appeared alongside Prime Minister Sanae Takaichi to jointly announce that Kumamoto Fab 2 will be upgraded from a 6nm to a 3nm process,...
    Monday 9 February 2026
    Musk flags manufacturing bottlenecks, floats 'TeraFab' as chip supply strains
    Elon Musk said the rapid expansion of artificial intelligence is running up against hard limits in global manufacturing capacity, as chip production, power equipment and industrial...
    Saturday 7 February 2026
    Nvidia CEO sees digital twins driving robot surge in next decade
    Nvidia CEO Jensen Huang recently highlighted that the next ten years will mark a critical period of accelerated development for robotics technology. He stated that the key to deploying...
    Friday 6 February 2026
    U-Power accelerates high-voltage charging stations amid rising EV high-power charging demand
    Electric vehicle (EV) charging company U-Power is targeting growing opportunities in the market, with chairman Bob Chen noting that the company has already installed roughly 60 charging...
    Friday 6 February 2026
    YMTC Phase III speeds Wuhan fab installations and domestic equipment deliveries
    China's semiconductor investment is once again converging in Wuhan. YMTC's Phase III fab has entered an intensive equipment installation phase, with key process tools steadily moving...
    Friday 6 February 2026
    Commentary: Why TSMC is upgrading Japan's Kumamoto fab from 6nm to 3nm
    TSMC has made a significant change in its process plan for the Kumamoto second fab, confirming an upgrade from the initially planned 6/7nm node to 3nm. This facility will become Japan's...
    Friday 6 February 2026
    Ventec sees surge in aerospace orders, posts strongest revenue in two years

    Ventec, a specialized manufacturer of copper-clad laminates (CCL), reported that consolidated revenue for January 2026 surpassed NT$400...

    Friday 6 February 2026
    Taiwan LED equipment maker FitTech wins arbitration, recovers NT$1.49b from China's Sanan
    The arbitration ruling has been issued in an equipment contract dispute between Taiwan-based LED equipment supplier FitTech and China's leading LED manufacturer Sanan Optoelectronics...
    Thursday 5 February 2026
    Skytech delivers self-made PLP equipment, eyes record 2026 growth
    As advanced packaging technologies continue to evolve toward larger sizes and panel formats, Skytech CEO George Yi stated that in response to the key process requirements of next-generation...
    Thursday 5 February 2026
    TSMC goes all-in on Japan: Kumamoto Fab 2 upgraded to 3nm powerhouse
    TSMC has formulated a plan to mass-produce advanced 3nm chips in Kumamoto Prefecture, marking an unprecedented move within Japan. The company has notified the Japanese government of...
    Thursday 5 February 2026
    Texas Instruments to reshore Silicon Labs production in US$7.5 billion wireless play
    Texas Instruments (TI) has announced that it has reached an agreement to acquire chip designer Silicon Laboratories for approximately US$7.5 billion, marking the largest deal for TI...
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    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
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    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook