中文網
  • 繁體
  • 简体
    •
    Trending
    CONNECT WITH US
    Enflame enters public markets with Nvidia alternatives in its sights
    7min ago
    Huawei stakes out the AI optics rulebook with 7.2Tbps NPO
    10min ago
    AUO, Innolux accelerate shift from displays to AI, CPO, advanced packaging
    15min ago
    NEWS TAGGED EQUIPMENT
    Friday 11 September 2026
    China's DRAM supply chain clears another materials hurdle
    China's semiconductor localisation effort has reached another upstream materials milestone.​ Jiangsu Pacific Quartz Co. has secured qualification for high-purity quartz products...
    Friday 11 September 2026
    FCC closes a chip-level loophole while media debate another White House retreat

    A rule published in the Federal Register on September 11 pushes US communications supply-chain...

    Friday 11 September 2026
    Academia Sinica to open 8-inch quantum chip platform in September 2026

    Academia Sinica's Quantum Chip Fabrication Space (QC-Fab) in Tainan will open to external users at the end of September 2026, marking...

    Thursday 10 September 2026
    Nanoprinting lithography shifts from round to square, increasing waveguide output
    Nanoimprint technology is shifting from round to square substrates. Qingdao GermanLitho noted that this transition has become vital for volume manufacturing as the industry demands...
    Thursday 10 September 2026
    Foxsemicon hits record 2Q26 revenue on Thailand ramp-up
    Foxsemicon Integrated Technology (FITI) posted record consolidated revenue of NT$6.3 billion (approx. US$200.0 million) in the second quarter of 2026, up 13.3% quarter-over-quarter...
    Thursday 10 September 2026
    Hermes Testing ships membrane probe cards, targets SiPh and CPO
    Hermes Testing Solutions said its August revenue kept rising and topped NT$500 million for the first time, setting a new monthly record on steady growth in semiconductor test equipment...
    Thursday 10 September 2026
    AI semiconductor equipment boom redraws Taiwan IPC market: Edge AI, advanced packaging lift high-end demand
    AI and high-performance computing (HPC) demand is sustaining strong investment in advanced semiconductor processes, high-bandwidth memory (HBM), and advanced packaging, lifting the...
    Thursday 10 September 2026
    Wistron, Wiwynn hit record August revenue as board approves US$200 Million for US, Vietnam expansion
    Wistron and Wiwynn both posted record-high monthly revenue in August 2026 as shipments of artificial intelligence (AI) servers continue to expand. Both companies remain highly confident...
    Thursday 10 September 2026
    CIOE: Morphotonics draws on display background to break AR waveguide bottlenecks
    At the China International Optoelectronic Expo (CIOE), Morphotonics, a Netherlands-based nanoimprint lithography company, made the case that the quickest way to reach affordable AR...
    Thursday 10 September 2026
    Analysis: China chases EUV as chipmakers move to High-NA
    The extreme ultraviolet (EUV) lithography race is splitting into two tracks. Intel has moved High-NA EUV into production, Samsung Electronics and SK Hynix are targeting DRAM production...
    Thursday 10 September 2026
    SuperAlloy advances semiconductor aluminum certification
    SuperAlloy Industrial, a global automotive wheel supplier, reported August consolidated revenue of NT$550 million (approx. US$17.4 million), up 2.46% from a year earlier, and NT$5.052...
    Thursday 10 September 2026
    Hiwin supply deal with Semes points to deeper access in South Korea's memory equipment market
    Hiwin Technologies has signed a supply contract with Semes, Samsung Electronics' semiconductor equipment arm, for a single-axis positioning stage being tested in hybrid bonding equipment,...
    Wednesday 9 September 2026
    Enterprise AI spending gives Taiwan's Systex a new growth wing
    Systex reported consolidated revenue of NT$5.9 billion (approximately US$187 million) in August 2026, up 61.91% from NT$3.64 billion a year earlier. Revenue for the first eight months...
    Wednesday 9 September 2026
    Samsung turns to Japan for packaging edge, narrows HBM gap with SK Hynix

    Samsung Electronics has opened an advanced packaging research center in Yokohama, bringing development work closer to Japanese suppliers...

    Wednesday 9 September 2026
    Axcelis to build new Korea manufacturing site in US$35 million expansion
    Axcelis Technologies plans to invest US$35 million in a new semiconductor equipment manufacturing facility in Pyeongtaek, South Korea, a move that could help strengthen global chip...
    1/77 pages
    Research_DB
    BIZ FOCUS
    Sep 11, 08:00
    DAS Expands in Taiwan and Unveils World First at SEMICON
    Friday 11 September 2026
    Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
    Thursday 10 September 2026
    Stress, Sleep, and Lifestyle Balance: Perspectives from Traditional Chinese Medicine
    Wednesday 9 September 2026
    IDA Partners with Taiwan's Semiconductor Industry to Advance Global Talent Strategy
    Semicon_TW