CONNECT WITH US
NEWS TAGGED EUV
Wednesday 23 April 2025
ASML pulls plug on South Korea site—Samsung insists joint R&D still alive
Samsung Electronics and ASML have scrapped plans to build a joint research and development (R&D) center in Hwaseong, Gyeonggi Province, and are now devising a new collaboration...
Monday 21 April 2025
Samsung faces delays in 1c DRAM development, raising concerns over HBM4 timeline

Samsung Electronics is encountering delays in the development of its next-generation 1c DRAM chips, according to sources familiar with...

Thursday 17 April 2025
ASML to pass tariff costs to US customers, gain three High NA EUV customers
After disclosing that it would discontinue quarterly order reporting starting in the second quarter of 2025, ASML executives highlighted in their latest earnings call that tariff...
Wednesday 16 April 2025
ASML delivers 46% YoY revenue growth in 1Q, flags margin pressure ahead
ASML, the global leader in semiconductor lithography systems, posted a strong year-over-year revenue gain for the first quarter of 2025, alongside its highest gross margin in over...
Tuesday 8 April 2025
Rapidus in talks with 50 potential US clients as challenges to serving Chinese market persist
Rapidus, a Japanese semiconductor firm aiming to mass-produce 2nm chips, commenced partial trial production at its facility on April 1, 2025. According to Rapidus president Atsuyoshi...
Monday 31 March 2025
Japan injects US$5.4 billion into Rapidus, eyes US$660 million in private funding for 2nm chip rollout
Japan's Ministry of Economy, Trade and Industry (METI) said on March 31, 2025, it will provide up to JPY802.5 billion (US$5.4 billion) in fresh funding to Rapidus, a domestic startup...
Monday 31 March 2025
Weekly news roundup: Semiconductor business like DeepSeek may emerge in China; Intel Japan chair defends Gelsinger strategies
These are the most-read DIGITIMES Asia stories from the week of March 24 – March 29.
Friday 28 March 2025
SiCarrier bets on DUV for 5nm chips as SMIC's yield stalls at one-third of TSMC's
As US export controls tighten on advanced semiconductor technologies, Shenzhen-based SiCarrier unveiled new 5nm-capable fabrication tools at SEMICON China 2025. The company claims...
Tuesday 25 March 2025
SiCarrier rolls out 5 chip tools at SEMICON China 2025, challenging AMAT, TEL
SEMICON China 2025 opens on March 26 in Shanghai, bringing together global and domestic semiconductor equipment makers. One surprise standout: Shenzhen SiCarrier Technologies, a previously...
Tuesday 18 March 2025
Samsung races to close 2nm gap: first High-NA EUV deployed at Hwaseong
Samsung Electronics reportedly deployed its first high-NA Extreme Ultraviolet (EUV) lithography machine at its Hwaseong Campus in early March. The move represents a key step in Samsung's...
Monday 17 March 2025
Weekly news roundup: China's EUV breakthrough and Chinese lawmakers' proposal for anonymous semiconductor purchases
These are the most-read DIGITIMES Asia stories from the week of March 10 – March 15.
Friday 14 March 2025
Micron leads sixth-generation DRAM samples, but EUV strategy could determine future DRAM race
In late February, Micron announced it had shipped samples of its sixth-generation DRAM (1γ DRAM), becoming the first in the industry to do so. However, its design and manufacturing...
Wednesday 12 March 2025
ASML and imec sign partnership to boost sub-2nm R&D in Europe
According to a press release on its website, ASML and imec have entered into a new five-year strategic partnership agreement aimed at advancing semiconductor research and promoting...
Tuesday 11 March 2025
China's EUV breakthrough: Huawei, SMIC reportedly advancing LDP lithography, eye 3Q25 trial, 2026 rollout
China is advancing in extreme ultraviolet (EUV) lithography, with a domestically developed system undergoing testing at Huawei's Dongguan facility, according to XFastest...
Tuesday 11 March 2025
Former TSMC R&D VP spearheads breakthrough sub-1nm EUV academic research
Burn-Jeng Lin, the former VP of R&D at TSMC, is leading a team at a university in Taiwan focused on advancing subnanometer EUV research.