South Korea's largest conglomerates are pouring resources into glass substrates, a next-generation semiconductor packaging material that promises better thermal stability and power...
Samsung Electronics has been in active discussions with Samsung Electro-Mechanics (Semco), Japan's Ibiden, and Shinko Electric Industries regarding collaboration on semiconductor...
Samsung Electro-Mechanics (Semco) is reportedly in supply talks with several Big Tech companies, two years after moving into glass substrates. Seen as a next-generation breakthrough...
Samsung Electro-Mechanics is reportedly set to supply advanced semiconductor glass substrates to Broadcom. The move comes as Broadcom, a key chip supplier for tech giants like Google...
LG Electronics is aggressively entering the advanced semiconductor packaging equipment market to meet the surging demand driven by AI. The company plans to gradually localize production...
Tongtai and Contrel are focusing on the convergence of semiconductors and PCBs in advanced TGV packaging. Taiwanese companies aim to lead in this area, as Tongtai seeks profitability...
China's glass substrate through glass via (TGV) industry has made significant progress, with companies pushing innovations from materials to mass production. Despite challenges in...
Intel has confirmed to South Korean media that it will proceed with its semiconductor glass substrate commercialization plans as originally outlined, dismissing reports of potential...
Alliance Material, a semiconductor materials company, reported a surge in revenue in August 2025, reaching NT$67.93 million (US$2.23 million), a 15.84% increase from July and nearly...
Innolux regards fan-out panel-level packaging (FOPLP) as a major strategic transformation, but its mass production schedule has been repeatedly delayed. During this process, high-level...
Intel is reportedly preparing to license its glass core substrate (GCS) technology, reversing course from its earlier plan to commercialize the technology in-house. The pivot could...
Intel is grappling with accelerating staff departures as CEO Pat Gelsinger pushes through sweeping restructuring efforts and cancels projects championed by his predecessor. The financially...
Leading US glass substrate manufacturer Corning stated that China is the only market outside of the US that has deployed all five of its major business segments. Corning's accumulated...
BOE Technology chairman Chen Yanshun revealed at the 2025 BOE Investor Day that the company will pivot toward glass substrate packaging and perovskite solar cell (PSC) technology...
