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    China expands OLED capacity, challenging South Korea in IT and automotive display markets
    23min ago
    NEWS TAGGED GLASS SUBSTRATE
    Wednesday 9 September 2026
    LG Innotek tackles glass substrate microcrack issue as 2028 production race heats up

    LG Innotek is applying internally developed artificial intelligence to semiconductor glass substrate manufacturing, targeting microcracks,...

    Wednesday 9 September 2026
    SDC, LGD target advanced glass packaging
    As glass substrates emerge as a next-generation semiconductor packaging material, they have become the centerpiece of the display industry's cross-sector transformation. Although South...
    Wednesday 2 September 2026
    Innovative Solutions for Fabricating High-Performance AI Multichip Packaging Using Glass Substrates

    Interested in knowing how to solve the microcrack problem in through-glass via (TGV) fabrication? Interested in knowing how to supply 1,000 Watts, 1 Volt and 1,000 Amperes...

    Tuesday 1 September 2026
    Samsung Electro-Mechanics takes glass substrates to Semicon Taiwan
    As AI packages grow larger, the next substrate battleground is rapidly extending from traditional organic materials to glass. Samsung Electro-Mechanics (SEMCO) will make its first...
    Monday 24 August 2026
    Advanced packaging substrates hit limits; ceramic cores rise to challenge glass materials
    As hardware demands for artificial intelligence continue to surge, beyond increased size and complexity in chip packaging, advanced packaging substrates face mounting challenges: larger...
    Monday 24 August 2026
    iCometrue to Showcase Glass-Based AI Multichip Packaging Solutions at SEMICON Taiwan 2026

    Interested in solving microcrack issues in through-glass via (TGV) fabrication? Want to learn how to supply 1,000 Watts, 1 Volt and 1,000 Amperes electricity to semiconductor...

    Friday 14 August 2026
    Samsung Electro-Mechanics glass substrate plan slips, with mass production now seen after 2028
    Samsung Electro-Mechanics has again delayed its semiconductor glass substrate commercialization schedule after a prototype reportedly failed a customer's reliability review. The setback...
    Thursday 6 August 2026
    FOPLP leads production as CoPoS advances glass packaging
    AI chip computing power is rising rapidly, pushing advanced packaging toward larger form factors, higher bandwidth, and greater integration. Traditional Ajinomoto build-up film (ABF)...
    Monday 3 August 2026
    Samsung Electro-Mechanics deepens AI supply-chain bet with new contracts, eyes glass substrate production in 2027
    Samsung Electro-Mechanics used its second-quarter earnings call to signal that its bet on AI infrastructure is paying off and about to get bigger, pointing to a run of long-term supply...
    Friday 31 July 2026
    Semco reportedly expands SoulBrain partnership to advance glass substrate materials for AI chip packaging

    Samsung Electro-Mechanics (Semco) is broadening its collaboration with South Korean materials supplier SoulBrain beyond glass substrate...

    Wednesday 29 July 2026
    China's glass substrate supply chain takes shape for AI chip packaging
    Intel's recent memorandum of understanding with Lens Technology to collaborate on through-glass via (TGV) advanced packaging has been widely viewed as an important step towards the...
    Saturday 25 July 2026
    Intel, China-based Lens Technology partner to explore glass substrate semiconductor packaging
    Intel Corporation and Lens Technology have announced a strategic collaboration to explore the development of advanced semiconductor packaging technologies using glass substrates. The...
    Friday 24 July 2026
    TGV still faces technical barriers; CoPoS commercialization not likely until 2030

    Introduction

    Saturday 18 July 2026
    JNTC-TOPPAN glass substrate push signals AI packaging supply-chain shift
    As AI accelerators and high-bandwidth memory (HBM) packages grow larger and more complex, substrate technology is becoming a new constraint in advanced packaging. Organic substrates...
    Friday 10 July 2026
    E&R Engineering advances glass substrate pilot production to 2H27
    E&R Engineering says AI demand and faster-than-expected glass substrate adoption are tightening equipment supply and advancing investment plans across Asia and the US. For global...
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    Research_DB
    BIZ FOCUS
    Sep 9, 08:00
    IDA Partners with Taiwan's Semiconductor Industry to Advance Global Talent Strategy
    Tuesday 8 September 2026
    Shining a Light on the Precision Behind AI and Data Infrastructure
    Wednesday 2 September 2026
    World Diamond Technology accelerates mass production of 300 mm diamond wafers
    Wednesday 2 September 2026
    Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
    Semicon_TW