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Thursday 16 September 2021
Taiwan LCD driver IC suppliers say orders remain strong
Some Taiwan-based LCD driver IC suppliers have claimed their book-to-bill ratios remain above one with clear order visibility through the end of this year and even 2022, in response...
Wednesday 15 September 2021
Vanchip tapping Wi-Fi 6 RF FEM market
China-based Vanchip Technologies, a subsidiary of MediaTek, is partnering with IC distributor WPG and GaAs foundry Win Semiconductors to promote its Wi-Fi 6 RF front-end modules (RF...
Wednesday 15 September 2021
IC shortage and rising costs challenging notebook battery module makers
Shortages of upstream chips and components, and rising costs are challenging notebook battery makers, according to industry sources.
Wednesday 15 September 2021
TSMC forecast to post 24% revenue growth in 2021, says IC Insights
TSMC is forecast to see its revenue in the second half of this year grow 14% from the level in the first half, with revenue for all of 2021 set to represent a 24% on-year surge, according...
Tuesday 14 September 2021
DDI backend houses to strengthen high-end testing capacity expansions in 2022
Display driver IC backend specialists including Chipbond Technology and ChipMOS Technologies will remain focused on expanding high-end testing capacity in 2022 to satisfy growing...
Tuesday 14 September 2021
IC packaging materials distributors enjoy strong wire-bonding demand
IC packaging materials distributors continue to see strong demand for wire-bonding operations despite uncertainties facing sales of notebooks, handsets and other end-market devices...
Tuesday 14 September 2021
US chip vendors increasingly shift orders from China foundries
US chip vendors have increasingly shifted their orders away from China-based foundries to mitigate potential risks arising from the ongoing trade tensions between the US and China,...
Tuesday 14 September 2021
Notebook PCB makers still see challenges ahead despite strong demand
Notebook PCB specialists HannStar Board and Global Brands Manufacture (GBM) continue to see challenges arising from an overall IC shortage, despite brisk shipments prospects for the...
Tuesday 14 September 2021
SMIC to build additional, considerable 28nm and above process capacity
China's Semiconductor Manufacturing International (SMIC) will be expanding production capacity for 28nm and above process technologies by 2024, which will considerably boost its overall...
Monday 13 September 2021
China Big Fund stepping up investment in homegrown memory sector
More China-based memory makers will receive cash injections from the government, as China's National IC Industry Investment Fund (Big Fund) steps up its investment in the country's...
Friday 10 September 2021
Unimicron reports record August revenue
IC substrate and PCB maker Unimicron Technology enjoyed another month of record-high revenue in August, driven by robust orders and rising ASPs.
Thursday 9 September 2021
Highlights of the day: Taiwan IC vendors set to raise prices
Tight supply has pushed up foundry costs, fueling pressure on IC design clients. First-tier IC design houses are now...
Thursday 9 September 2021
UMC, VIS see revenue hit another record highs
Pure-play foundry United Microelectronics (UMC) saw its August revenue hit a record high for the fourth consecutive month, while revenue at fellow foundry company Vanguard International...
Thursday 9 September 2021
ESMT remains optimistic
Specialty DRAM IC design specialist Elite Semiconductor Memory Technology (ESMT) remains upbeat about its shipment prospects for the rest of this year, thanks to its diversified client...
Thursday 9 September 2021
Taiwan 1st-tier IC design houses poised to raise prices in 1Q22
With delivery lead times at TSMC extended to 4-5 months, Taiwan's first-tier IC design houses have notified customers about further price hikes for their chip solutions starting the...
Monday 11 June 2018
Winbond W25N01JW
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.