中文網
Taipei
Wed, Jul 6, 2022
21:31
partly cloudy
28°C
CONNECT WITH US
NEWS TAGGED IC
Wednesday 6 July 2022
Asia IC50: Can leading Taiwan-based substrate makers maintain momentum?
Unimicron Technology and Kinsus Interconnect Technology, two top ABF substrate manufacturers in Taiwan, were listed 28th and 30th in the Asia IC50 2022 ranking released by DIGITIMES...
Wednesday 6 July 2022
IC inspection labs to embrace strong 3Q22
Slowdowns in handsets and other consumer electronics areas have prompted brand device vendors to accelerate their pace of inventory correction, but the vendors and core chip suppliers...
Wednesday 6 July 2022
ESMT upbeat about customized SoC memory demand
Demand for customized SoC memory solutions remains relatively brisk compared to conventional memory chips, according to Elite Semiconductor Memory Technology (ESMT). The memory IC...
Wednesday 6 July 2022
Taiwan GaAs foundries to see fab utilization rates rise in 3Q22
GaAs foundries Win Semiconductors and Advanced Wireless Semiconductor (AWSC) are both expected to see their fab capacity utilization rates pick up in the third quarter of 2022, according...
Tuesday 5 July 2022
Nan Ya to boost automotive IC substrate sales in 2022
Nan Ya PCB is looking to grow its automotive IC substrate sales as a proportion of company revenue to over 10% in 2022, up from 7-8% in 2021, according to company sources.
Tuesday 5 July 2022
Asia IC50 interview with president Pei-Ing Lee: Nanya moves forward with in-house developed technology
Taiwan-based memory device maker Nanya Technology was ranked 18th in the recently released DIGITIMES 2022 Asia IC50 survey, assessing the performance of the top 50 semiconductor companies...
Tuesday 5 July 2022
IC design houses brace for weak 3Q22
IC design houses are bracing for a particularly weak third-quarter 2022 while also having difficulty negotiating lower foundry quotes, according to industry sources in Taiwan.
Monday 4 July 2022
Consumer IC packaging demand unlikely to rebound till 1Q23
Packaging demand for consumer electronics ICs including commodity MCUs, MOSFETs, lower-end logic ICs and power management ICs (PMICs) has contracted significantly amid lackluster...
Friday 1 July 2022
Asia IC50: China firms supercharged in revenue growth, thanks to chip crunch and government policy drive
Chinese companies in Asia IC50 2022 ranking attracted attention over their surprisingly high revenue growth in 2021, which are much higher than the growth of their peers in South...
Friday 1 July 2022
Xiaomi may renew mobile SoC development via new IC design JV
Chinese handset vendor Xiaomi recently has deepened its in-house chip development by investing in a new semiconductor company, sparking market speculation that Xiaomi may renew development...
Friday 1 July 2022
Global microprocessor sales to rise 12% in 2022, says IC Insights
Worldwide microprocessor sales are expected to maintain double-digit percentage growth in 2022, despite economic troubles brewing this year, according to IC Insights.
Thursday 30 June 2022
Asia IC50: Beginning of downturn or start of golden era?
DIGITIMES released the Asia IC50 2022 ranking on June 30 as the semiconductor industry is sailing into a sea of uncertainties. The stellar performance of semiconductor industry companies...
Thursday 30 June 2022
SEMI, Foxconn, UMC release Auto IC Master scheme to integrate ecosystem
SEMI, Foxconn Technology and UMC have jointly released the SEMI Auto IC Master program designed to provide complete automotive chip solutions through effective and close partnerships...
Thursday 30 June 2022
KYEC on track to post revenue growth in 2022
IC testing house King Yuan Electronics (KYEC) expects to post revenue growth in 2022, as strong demand for automotive and industrial chips will offset weakness in demand for consumer...
Wednesday 29 June 2022
Taiwan PMIC firms shift focus to non-consumer markets
Taiwan-based power management IC (PMIC) suppliers have shifted their focus away from the consumer electronics market, where their China-based peers are growing their presence, according...
Monday 11 June 2018
Winbond W25N01JW
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.