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Monday 17 January 2022
Semi content in electronic systems reaches record high in 2021, says IC Insights
Semiconductor content in electronic systems reached 33.2% last year, surpassing the previous record high set in 2018, according to IC Insights.
Friday 14 January 2022
Niching expects IC packaging materials growth momentum to continue in 2022
Niching Industrial, a Taiwan-based distributor of IC packaging materials, is upbeat about demand for its packaging and testing product lines in 2022 as it plans to cut into the third-generation...
Thursday 13 January 2022
ESMT sees bullish NOR flash prices
NOR flash contract prices are poised to stay flat sequentially in the first quarter of 2022 and will rise through the third quarter, according to MC Chang, president for memory IC...
Thursday 13 January 2022
PMIC demand to stay strong, crunch to persist in 2022
Taiwan-based power management IC suppliers will continue to embrace strong demand in 2022, but their on-year sales growth rates will depend largely on the foundry support they are...
Thursday 13 January 2022
Global IDMs placing emphasis on ADAS IC
Global IDMs have been actively exploring advanced driver assistance systems (ADAS) ICs despite limited business opportunities in the autonomous driving market currently due to government...
Wednesday 12 January 2022
Supply of server PWM IC, network chips stays tight
The supply of server-use power management ICs, and network and communication chips remains tight, with the chip shortages likely to start easing as early as the second half of this...
Tuesday 11 January 2022
Industry watch: The benchmarks and opportunities of the IC design industry
Founded in 1997, MediaTek originated from the UMC Group which was founded in the 1980s. The management team has witnessed the wonderful era "from micrometer to sub-microns" in Taiwan...
Tuesday 11 January 2022
Taiwan fabless chipmakers see limited impact from power outage at Hua Hong fabs
A recent power outage at Hua Hong Semiconductor's wafer fabs located at the Zhangjiang Hi-Tech Park, Shanghai has so far had a limited impact on Taiwan-based fabless chipmakers' deliveries,...
Tuesday 11 January 2022
Taiwan III-V IC makers gearing up for robust RF, PA demand
Taiwan-based gallium arsenide (GaAs) foundries including Win Semiconductors and Advanced Wireless Semiconductor (AWSC), and epi-wafer suppliers such as Visual Photonics Epitaxy Company...
Monday 10 January 2022
Advantest introduces new testing solutions for next-gen IC, high-end CIS
Japan-based semiconductor testing equipment supplier Advantest is introducing new testing solutions for next-generation memory, NAND flash and high-end CMOS image sensors (CIS) as...
Monday 10 January 2022
Semiconductor sales to grow 11% in 2022, says IC Insights
Total semiconductor sales are forecast to grow 11% and reach a record-high US$680.6 billion in 2022, after climbing 25% in 2021, according to IC Insights.
Friday 7 January 2022
Notebook peripheral IC specialists report strong sales for 2021
Notebook IC design specialists particularly those engaged in peripheral chips including touchscreen controllers and high-speed interface chips have reported impressive sales results...
Friday 7 January 2022
Networking chip specialist Realtek posts record 2021 revenue
Networking IC company Realtek Semiconductor saw its annual revenue top NT$100 billion (US$3.61 billion) for the first time in 2021, and is expected to pursue further revenue gains...
Thursday 6 January 2022
Taiwan OSAT, test interface vendors upbeat about demand for new processors
Taiwan-based OSATs and IC test interface solution providers are upbeat about demand for new processors unveiled by vendors including AMD and Nvidia for the next couple of years, according...
Thursday 6 January 2022
Specialty DRAM prices soon to stop falling
DDR3 and other specialty DRAM prices are expected to stop falling and begin to rise as early as between the end of the first quarter and the second quarter, according to industry...
Monday 11 June 2018
Winbond W25N01JW
Winbond Electronics' W25N01JW is a high-performance, 1.8V serial NAND flash memory IC delivering a data-transfer rate of 83MB/s via a quad serial peripheral interface (QSPI). The new high-performance serial NAND technology also supports a two-chip dual quad interface which gives a maximum data transfer rate of 166MB/s. The Winbond 1.8V W25N01JW chip can replace SPI NOR flash memory in automotive applications, such as data storage for instrument clusters or the center information displays (CIDs), the company indicated. This is important for automotive OEMs because the adoption of more sophisticated graphics displays in the instrument cluster, and larger display sizes of seven inches and above in the CID, is increasing system memory requirements to capacities of 1Gbit and higher, the company continued. At these capacities, serial NAND flash has a markedly lower unit cost than that of SPI NOR flash, and occupies a smaller board area per megabit of storage capacity. The W25N01JW also meets strict automotive requirements for quality and reliability, Winbond noted. Built with single-level sell (SLC) memory technology, and implementing 1-bit error correction code (ECC) on all read and write operations, it complies with the endurance, retention and quality requirements of the AEC-Q100 standard and relevant JEDEC specs. The W25N01JW is available for sampling today in a capacity of 1Gbit. A two-chip implementation in dual-quad I/O mode provides 2Gbits of memory capacity and a maximum data transfer rate of 166MB/s. The chip is available in industrial grade and in an extended-temperature automotive grade version operating at up to 105-degrees C.