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NEWS TAGGED IC DESIGN
Thursday 26 June 2025
Hardware falls behind as AI compute demand sparks new era for custom silicon
As the world shifts toward an "everything AI" paradigm, compute demands are rapidly outpacing hardware performance gains, ushering in what industry leaders are calling a golden decade...
Thursday 26 June 2025
Chip designers stay cautious on 3Q25 outlook despite resilient 2Q25 shipments
Taiwanese IC designers remain wary of third-quarter prospects despite stronger-than-expected second-quarter performance, as uncertainty over US tariff policies continues to cloud...
Thursday 26 June 2025
AMEC ships first Primo Menova tool as R&D investment surges 94%
Advanced Micro-Fabrication Equipment Inc., China (AMEC) has delivered the world's first Primo Menova 12-inch metal etching system to a top domestic IC design and manufacturing service...
Tuesday 24 June 2025
IC design sector 2Q25 operations remain stable amid currency volatility
As the second quarter of 2025 gradually comes to a close, Taiwan's IC design sector is facing the traditional off-season with a generally optimistic outlook. Industry players believe...
Tuesday 24 June 2025
South Korea's chip firms target Japan in bid to break global design bottleneck
South Korean semiconductor companies are making a concerted push into Japan, positioning themselves to capture opportunities in one of the world's most underpenetrated but promising...
Tuesday 24 June 2025
Samsung Electro-Mechanics begins silicon capacitor supply to Marvell Technology, marking entry into AI chip components
Samsung Electro-Mechanics has started supplying silicon capacitors to Marvell Technology, a leading US integrated circuit (IC) design company. This development marks Samsung Electro-Mechanics's...
Monday 23 June 2025
AI chip design seen in second inning, says Synopsys executive
At its annual SNUG Taiwan event this week, Synopsys Senior Vice President of IP Group John Koeter told DIGITIMES that if AI chip development were a baseball game, the industry...
Friday 20 June 2025
Wistron ITS enters chip design race with new semiconductor division
Wistron ITS (WITS), a subsidiary of the Wistron Group, has officially launched a new Semiconductor Business Unit, marking its strategic shift from traditional IT services toward integrated...
Thursday 19 June 2025
Taiwan advances passwordless tech for secure chip design environments
SYSTEX Corporation's subsidiary uniXecure has been appointed as the exclusive agent for AuthenTrend in Taiwan, marking a strategic move to promote passwordless authentication services...
Wednesday 18 June 2025
Taiwan foundries wind down 8-inch output as IC designers pivot
Taiwanese IC design houses report a steady reduction in 8-inch wafer capacity by local foundry partners. Several foundries are now urging clients to transition select products to...
Wednesday 11 June 2025
Nintendo’s Switch 2 ignites IC order boom for Taiwan’s design houses
Nintendo's highly anticipated Switch 2 has officially launched to an extremely enthusiastic response across Europe, the US, and Japan. Retail channels report being "highly optimistic"...
Tuesday 10 June 2025
Edge AI stalls, cloud AI soars: a new divide in Taiwan’s chip industry
Taiwan's IC design firms remain optimistic about the long-term trajectory of artificial intelligence (AI), but their outlook for the second half of 2025 has turned markedly cautious...
Monday 9 June 2025
Coincidence? EDA access quietly restored to some Chinese companies following Xi-Trump call
Following a direct high-level phone call between China and the US on the evening of June 5, 2025, Beijing time, subtle shifts have emerged in semiconductor and electronic design automation...
Monday 9 June 2025
India roundup: Ex-TI, Intel, AMD execs launch AI chip startups in India
Besides chipmaking, India is actively advancing its IC design capabilities. Apple continues to expand Tata Electronics' role in its global diversification push.
Tuesday 3 June 2025
US targets EDA exports as Xiaomi’s XRing O1 raises alarm over China’s IC design gains
Xiaomi has launched the XRing O1, claiming to use a 3nm process, while Huawei and Lenovo have successively introduced 5 nm-class chips. The fact that China can still bypass multiple...