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NEWS TAGGED IC DESIGN, DISTRIBUTION
Tuesday 17 March 2026
Meta and Nebius reach US$27B deal for AI infrastructure capacity as data center computing demand soars
Nebius, a Dutch data center firm, announced a US$27 billion deal with Meta on March 16, 2026, to supply AI infrastructure capacity to the tech giant. The agreement comes as soaring...
Tuesday 17 March 2026
Samsung Electronics reports shifts in raw material costs and production output in fiscal 2025
Samsung Electronics has released comprehensive operational data for fiscal 2025, revealing a complex picture of shifting raw material costs and high production efficiency. Despite...
Tuesday 17 March 2026
How Nvidia and Taiwan's co-engineering pact is fueling a US$1 trillion token economy
The air inside the SAP Center carried more than just Silicon Valley anticipation. There was a distinct sense of historical gravity as Jensen Huang took the stage for GTC 2026.
Tuesday 17 March 2026
Intel joins GTC, eyes debut of co-developed x86 CPU with Nvidia
Intel has confirmed its participation in Nvidia's GTC conference starting on March 16, signaling a deepening collaboration between the two chip giants to co-develop custom x86 CPUs...
Tuesday 17 March 2026
Nvidia signals trillion dollar infrastructure shift at GTC 2026 keynote
During the GTC 2026 keynote, Nvidia CEO Jensen Huang detailed a massive shift toward agentic AI and specialized token factories. Huang projected at least a trillion dollars in infrastructure...
Tuesday 17 March 2026
Nvidia GTC 2026: The agentic AI era arrives via full-stack infrastructure, open models, and simulation blueprints
Nvidia CEO Jensen Huang declared the arrival of the "agentic AI inflection point" at the company's GTC 2026 conference, unveiling a vast ecosystem of hardware, software, and industrial...
Monday 16 March 2026
ASML layoffs stall, leaving workers in limbo
Dutch semiconductor equipment maker ASML announced in late January 2026 plans to cut 1,700 management positions — about 4% of its global workforce — primarily affecting...
Monday 16 March 2026
Sony CIS yield issue raises Apple supply risks, opens door for Samsung

Sony's core semiconductor business, CMOS image sensors (CIS), has reportedly encountered yield challenges in recent production. Industry...

Monday 16 March 2026
Taiwan IC design emerges as top choice amid US-China tensions, key lifeline for Europe
At Embedded World 2026, most Taiwanese IC design houses reported unprecedentedly active engagement with European customers. Over the past year, visits by European downstream customers...
Monday 16 March 2026
IC design houses push 12-inch chips as 8-inch process price hikes loom
The chip market is facing a wave of price increases, with IDM companies issuing hike notices and foundries preparing to raise prices for the 8-inch wafer process amid current supply-demand...
Monday 16 March 2026
US withdraws draft for rule requiring approval for AI chip exports anywhere in the world
The US revoked a draft rule on March 13 that would have required the country's approval to export US-made AI chips anywhere in the world. The withdrawal marks a reversal of one of...
Monday 16 March 2026
AWS and Cerebras collaborate on faster AI inference for Amazon Bedrock
Amazon Web Services (AWS) and AI chip startup Cerebras Systems said they are working together to bring a high-speed AI inference architecture to Amazon Bedrock, a managed service for...
Monday 16 March 2026
Commentary: Nvidia CEO outlines new AI infrastructure vision ahead of GTC 2026
On March 10, 2026, Nvidia CEO Jensen Huang published an in-depth personal article systematically explaining the development logic behind the AI industry. He argued that AI should not...
Monday 16 March 2026
AI server tracker: AI infrastructure demand lifts Taiwan foundry and ODM/EMS revenues despite seasonal dip
Taiwan's major semiconductor and server supply chain companies posted mixed February 2026 revenue results, with continued strength in artificial intelligence (AI) infrastructure demand...
Monday 16 March 2026
HyperLight, UMC, and Wavetek form foundry partnership for high-volume TFLN chiplet production
HyperLight Corporation, United Microelectronics Corporation (UMC), and Wavetek Microelectronics Corporation, a wholly owned UMC subsidiary, have announced a strategic manufacturing...