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    China humanoid robot chips shift focus from raw compute to coordination efficiency
    44min ago
    Russia drives ICE exports as Europe masks NEV transshipment demand
    44min ago
    China tightens grip on LCD panels as TV share nears 80% and monitor share tops 70%
    45min ago
    Samsung’s HBM comeback is only the beginning, exec warns
    45min ago
    Commentary: AMD’s Taalas acquisition signals a shift toward ASIC-based AI inference
    46min ago
    NEWS TAGGED IC DESIGN, DISTRIBUTION
    Friday 14 August 2026
    Samsung chip design embraces AI, but loss of control and hallucinations remain a problem
    The AI wave is sweeping through the chip industry, but hallucinations, loss of control, and cybersecurity risks remain unresolved even as efficiency leaps. Youngsik Kim, head of the...
    Friday 14 August 2026
    PixArt revenue rises on game-console demand as margin pressure grows

    PixArt's latest results signal how shifting demand across consumer electronics and emerging sensor markets can reshape profitability...

    Friday 14 August 2026
    Beyond silicon and copper: OCP APAC looks under the hood of future AI infrastructure
    AI's appetite for compute is growing at such speeds that simply building bigger versions of today's data centers may no longer cut it.
    Thursday 13 August 2026
    China AI chip market nears 90% domestic share in 2026—Huawei on course to eclipse Nvidia

    China's high-end AI chip market could become almost entirely domestic in 2026, with local solutions expected to take nearly 90% of...

    Thursday 13 August 2026
    Taiwan's packaging and integration ecosystem positions it as the backbone of CPO scaling, Ayar Labs says

    The technical feasibility of co-packaged optics (CPO) has been demonstrated repeatedly at major industry conferences in recent years...

    Thursday 13 August 2026
    OCP APAC 2026: Ayar Labs CEO says copper is holding back open compute, sees optical interconnects as way forward
    Speaking at the OCP APAC Summit 2026, Ayar Labs CEO Mark Wade argued that copper interconnects have become one of the biggest obstacles to realizing the vision of open computing.
    Thursday 13 August 2026
    Lightmatter white paper targets fragmented supply chain, barriers to photonic interconnect deployment
    Bijan Nowroozi, Head of Ecosystem Development at Lightmatter, announced at the OCP APAC Summit 2026 that the company has released an infrastructure white paper aimed at building a...
    Thursday 13 August 2026
    Siemens EDA unveils AI-Native Design strategy in South Korea
    Siemens EDA has introduced an AI-Native Design strategy in Seoul, aiming to help chipmakers and system designers manage rising complexity while reducing the risk of AI errors. The...
    Thursday 13 August 2026
    Synopsys pushes into system design as Nvidia, AMD and Broadcom move up the stack
    Nvidia, AMD and Broadcom are moving beyond chip-level design into subsystems and complete systems, a shift that is increasing the need to account for thermal, electrical, mechanical...
    Thursday 13 August 2026
    NXP expands Malaysia factory to bolster global chip supply resilience

    NXP Semiconductors has begun expanding its Petaling Jaya assembly and test site in Malaysia, a move that could support semiconductor...

    Thursday 13 August 2026
    Nvidia's compute financing push signals a new phase for AI spending
    Nvidia's plan to assemble more than US$500 billion in third-party capital for AI infrastructure could reshape how the industry pays for compute. By bringing major Wall Street firms...
    Thursday 13 August 2026
    From lab bench to IPO: How Taiwan's top university aims to turn professors into founders, campus into a unicorn factory

    National Tsing Hua University (NTHU), one of Taiwan's leading research universities, has spent more than a decade cultivating a campus...

    Thursday 13 August 2026
    Progate posts record profit on TSMC, Synopsys ecosystem gains
    Progate Group Corporation posted record second-quarter and first-half 2026 revenue and profit, as stronger operations and deeper ties with the TSMC, Synopsys, and ASE ecosystems boosted...
    Wednesday 12 August 2026
    OCP APAC 2026: AMD sees AI agents pushing CPU-GPU ratio toward 1:1
    AMD expects the shift from chatbots to agentic AI to sharply increase CPU demand alongside GPU acceleration, potentially moving the traditional CPU-to-GPU ratio from roughly 1:4 toward...
    Wednesday 12 August 2026
    OCP APAC 2026: Nvidia SVP Shainer on taking CPO to mass production —'can't release something just because it's cool'

    Nvidia's Spectrum-6 co-packaged optics (CPO) switches are in production and shipping, Gilad Shainer, senior vice president of networking...

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    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
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