The US government has no plans to take equity stakes in major semiconductor companies like TSMC and Micron, despite speculation fueled by recent comments on potential investments...
Nvidia CEO Jensen Huang made an unannounced visit to TSMC on August 22, arriving at Taipei airport early in the morning by private jet. Huang stated that the purpose of this trip...
Nvidia Corporation is set to implement a new advanced packaging technology called Chip-on-Wafer-on-Platform PCB (CoWoP) for its next-generation GR150 AI GPU, expected to launch in...
Samsung Electronics' foundry business plans to leverage its Hyper Cell technology to maintain its competitiveness in the 2nm semiconductor process. By adopting a more flexible chip...
The US International Trade Commission (ITC) has issued a preliminary ruling against China's BOE, banning its OLED panels from the US market for nearly 15 years. The decision opens...
Amid rising geopolitical risks and tightening global supply chains, the strategic value of rare metals has come into sharp focus. Taiwan's Lianyou Metals, leveraging patented smelting...
Taiwan's Minister of Economic Affairs Jyh-huei Kuo met with representatives from Taiwanese small and medium-sized enterprises (SME) on August 18 to discuss the impact of US reciprocal...
Alphabet Inc. has introduced its latest Pixel 10 series smartphones featuring the newly developed Tensor G5 processor, marking the company's most significant upgrade in custom chip...
Samsung Electronics Executive Chairman Lee Jae-yong returned to South Korea this week after more than two weeks in the US, telling reporters at the airport he was "ready for 2026."...
China's semiconductor packaging and testing firm SJ Semiconductor (SJ Semi) has made significant headway with the completion of its third production facility, J2C, in Jiangyin's high-tech...
The South Korean presidential office has dismissed reports that the US government intends to purchase shares of Samsung Electronics Co., stating there is no factual basis for such...
With Moore's Law losing momentum, advanced packaging has become the industry's next significant lever to drive performance gains. At the center of this race is hybrid bonding, widely...
US Secretary of Commerce Howard Lutnick recently stated in interviews that the government should not only offer free subsidies but also acquire non-voting stakes to safeguard American...
GlobalFoundries and Cirrus Logic have announced an expanded collaboration to accelerate the development of advanced semiconductor technologies aimed at powering future consumer and...
