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Tuesday 13 October 2026
Samsung's US$9B chip expansion faces funding, supply hurdles
Samsung affiliates plan to invest a combined KRW12.26 trillion (approx. US$9.18 billion) in semiconductor operations across South Korea and Vietnam, but the projects face different...
Tuesday 13 October 2026
AMEC chairman warns of AI bubble risk, sees consolidation ahead for China's chip equipment industry
Advanced Micro-Fabrication Equipment (AMEC) chairman and general manager Gerald Yin has warned of a potential AI investment bubble, cautioning that surging demand for chipmaking equipment...
Tuesday 13 October 2026
Malaysian states team up to back homegrown chip firms
The Selangor state government has committed MYR50 million (US$12.24 million) to the National Strategic Investment Fund, joining Khazanah Nasional Bhd and the Penang government in a...
Tuesday 13 October 2026
Foxconn's Vietnam unit Fukang Technology more than doubles registered capital to US$710.4 million
Fukang Technology, a northern Vietnam subsidiary of Taiwan's Hon Hai Precision Industry (Foxconn), has raised its registered capital by more than 109% to nearly VND17.47 trillion (US$710.4...
Tuesday 13 October 2026
Intel CEO warns AI hardware shortages could last up to 3 years
Intel CEO Lip-Bu Tan warned in Singapore that demand for AI infrastructure continues to outpace supply, with hardware shortages unlikely to ease significantly over the next 2–3...
Tuesday 13 October 2026
Wistron expands Taiwan capacity with NT$8 billion investment
Wistron announced plans to invest roughly NT$8 billion (approx. US$250.67 million) to expand its production capacity in Taiwan. On October 12, the board approved an additional capital...
Tuesday 13 October 2026
Broadcom, Intel CEOs warn capital could become AI's biggest bottleneck
The AI boom could face a new constraint as financing costs and questions over returns threaten to slow infrastructure investment, even as demand for computing hardware remains stro...
Tuesday 13 October 2026
Solidigm adds first dedicated US govt relations exec
Solidigm, the SK Hynix subsidiary, has reportedly created its first senior post dedicated to US government relations, a move that could matter for chip investors, regulators, and customers...
Monday 12 October 2026
Finland orders Google to halt work at two AI data center sites
Finnish authorities ordered Google to suspend parts of construction at planned AI data centers in Muhos and Kajaani after forests were allegedly cleared at the sites before an environmental...
Monday 12 October 2026
Sumitomo Bakelite expands packaging material production across Singapore, China
Sumitomo Bakelite announced that it is expanding production capacity for encapsulation materials used in advanced chip packaging at its facilities in Singapore and Suzhou, China. This...
Monday 12 October 2026
Chinese thermal materials maker SJ Electronics to build US$70 million plant in Penang
PEN SJ Electronics, a subsidiary of China's SJ Electronics, will invest more than US$70 million in an advanced packaging materials and thermal management facility at Batu Kawan Industrial...
Monday 12 October 2026
Nvidia, Reflection AI, the strategic pivot to open-weight ecosystems
The Financial Times recently reported that Nvidia is in early-stage talks to acquire or significantly deepen its investment in the US$25 billion open-weight AI startup Reflection...
Sunday 11 October 2026
Changs Ascending September revenue jumps 92% on semiconductor plant buildouts
Changs Ascending said orders tied to semiconductor customers' new plant construction, equipment arrivals, and project acceptance schedules were gradually fulfilled and recognized as...
Saturday 10 October 2026
JNTC bets US$259 million on glass substrates ahead of 2028 ramp
South Korea's JNTC plans to invest KRW347 billion (approx. US$259 million) in glass substrate manufacturing as it reports a sharp reduction in copper-filling time for thick glass cores,...
Saturday 10 October 2026
Advanced packaging leads Malaysia's push up the chip value chain as AI reshapes demand, says Yole analyst
Malaysia is moving from traditional semiconductor back-end manufacturing toward higher value-added work, with advanced packaging set to drive growth over the next two to three years,...