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Thursday 11 June 2026
Amkor Korea weighs KRW1 trillion Gwangju expansion amid reported TSMC order growth

Amkor Technology Korea is considering investing about KRW1 trillion (approx. US$650 million) to expand its chip packaging and testing...

Thursday 11 June 2026
Applied Materials CEO: AI reshapes semiconductor innovation
Applied Materials said artificial intelligence (AI) is reshaping the global semiconductor industry and could drive years of heavy investment in chipmaking, packaging, and materials...
Thursday 11 June 2026
Applied Materials expands Singapore base as AI supply-chain bottlenecks loom
Applied Materials is expanding manufacturing and research in Singapore as artificial intelligence (AI) drives a wider shift in semiconductor planning, supply chains, and investment...
Thursday 11 June 2026
China red-chip crackdown forces IPO hopefuls to rethink offshore listings

China's tighter scrutiny of foreign capital is forcing more companies to unwind red-chip structures, the offshore ownership model that...

Thursday 11 June 2026
Meta and Reliance expand India partnership with AI data center plan

Meta and Reliance Industries are expanding their partnership with plans for an AI-enabled data center in India. The move could strengthen...

Thursday 11 June 2026
Oracle plans US$70 billion investment to meet 'trillions' in AI demand as margins face short-term pressure
Oracle has detailed a massive expansion of its capital investment program to capitalize on what leadership describes as an unprecedented shift in the technology market. During the...
Thursday 11 June 2026
Taiwan deepens ties with Central and Eastern Europe as Taiwanese firms expand into Czech Republic, Poland
The Czech Republic and other Central and Eastern European countries have gradually become emerging markets for Taiwanese investment and exports. This follows the donation of vaccines...
Wednesday 10 June 2026
OpenAI reportedly nears 10GW Ohio lease with Nvidia backing, sealing its pivot from building to renting compute
OpenAI is in advanced talks to lease a planned 10-gigawatt data center campus on federal land in Ohio, in what would be the company's largest infrastructure commitment to date, The...
Wednesday 10 June 2026
Powerchip taps AI-driven chip boom with US$833 million overseas fundraising push
Powerchip Semiconductor Manufacturing Corp. (PSMC) has priced a cash capital increase tied to an overseas depositary receipt offering, a move that may matter to global investors tracking...
Wednesday 10 June 2026
Samsung weighs Gwangju packaging plant as power strains Seoul-area chip expansion

Samsung Electronics is considering building an advanced semiconductor packaging facility in the southwestern city of Gwangju, a move that...

Wednesday 10 June 2026
GEM Terminals cites AI-driven demand as May 2026 copper sales jump 72%
GEM Terminals reported consolidated revenue of about NT$428 million (US$13.6 million) in May 2026, up 71.83% year-over-year from NT$249 million, saying expanding global investment...
Wednesday 10 June 2026
AI use in PCB manufacturing has gone mainstream, but scaling remains lagging
AI adoption in PCB manufacturing is now widespread, yet fewer than 10% of companies have fully scaled deployments, underscoring a global gap between experimentation and factory-wide...
Tuesday 9 June 2026
Amazon, Corning strike multibillion-dollar deal to expand US fiber optic output
Amazon has reached a multiyear, multibillion-dollar agreement with Corning to supply optical fiber, cable, and connectivity equipment for its US data centers, a move that stands to...
Tuesday 9 June 2026
AMD commits up to GBP2 billion to speed AI research in the UK
AMD said on June 8 it plans to invest up to GBP2 billion (approx. US$2.67 billion) in the UK over the next five years to accelerate AI innovation and research and broaden access to...
Tuesday 9 June 2026
AI chip race lifts semiconductor equipment sales to record US$36.55bn
Global semiconductor equipment sales hit a record first-quarter 2026 high, as the AI buildout lifted investment in leading-edge logic, DRAM and advanced packaging.