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Thursday 28 May 2026
Synopsys sees hyperscaler chip ambitions fueling AI-related demand
Synopsys said growing demand for artificial intelligence chips from semiconductor companies and hyperscale data center operators is driving broader adoption of its electronic design...
Thursday 28 May 2026
Synopsys raises fiscal 2026 outlook after strong second-quarter revenue growth
Synopsys raised its fiscal 2026 revenue target after reporting a 42% year-over-year rise in second-quarter sales, driven by continued demand for AI-related chip design tools and verification...
Thursday 28 May 2026
Samsung foundry targets robotics, auto AI chips with Cadence platform
Samsung Electronics is preparing to expand its foundry push into physical AI semiconductors through a chiplet platform developed with Cadence, targeting chips for robotics, automotive...
Tuesday 26 May 2026
Chiplet boom puts Taiwan's InPsytech and its AI connectivity IPs in the spotlight
As the global semiconductor industry pivots toward chiplet-based designs — where multiple smaller chips are packaged together rather than built as a single monolithic die —...
Tuesday 26 May 2026
Powerchip unveils 3D AI Foundry with 3D WoW DRAM stacking at COMPUTEX 2026
Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices...
Friday 22 May 2026
InPsytech taps former Altera and Intel executive as senior strategy adviser to drive global expansion
InPsytech, the intellectual property unit of Egis Technology Group, announced on May 21 that it hired a former Altera CEO and ex-Intel executive as a senior strategy adviser to support...
Friday 15 May 2026
Malaysia's Arm-backed chip push lifts Oppstar, SkyeChip as startup ambitions expand beyond packaging
Malaysia is accelerating efforts to expand beyond semiconductor assembly and testing into chip design, following a government-backed initiative tied to access to Arm technology.
Thursday 14 May 2026
QBit Semiconductor targets edge AI growth as copier chips turn oligopolistic
IC design firm QBit Semiconductor will list on the Emerging Stock Board on May 15, 2026, and chairman Simon Shen, a former Kinpo executive, said the debut marks a new milestone for...
Tuesday 12 May 2026
Arm's AGI CPU demand surges as supply constraints loom
Arm is preparing to expand beyond its traditional IP licensing business by introducing data center CPUs, positioning itself to compete directly with some of its own customers, including...
Friday 8 May 2026
M31 weathers project delays as royalties and advanced-node demand signal recovery
M31 Technology reported a first-quarter 2026 revenue decline as contract timing disruptions pushed some North American advanced-process projects into the next quarter, but the company...
Tuesday 5 May 2026
DDR6 server memory moves into early development as industry prepares for next-generation AI demand
The development of next-generation server memory DDR6 is reportedly entering early hardware validation, as memory makers and supply chain partners begin pre-development work ahead...
Monday 4 May 2026
China AI chip designer VeriSilicon books US$1.1bn orders, revenue doubles
China-based chip design service provider VeriSilicon Microelectronics (Shanghai) Co. is seeing a sharp acceleration in AI-driven demand, with record orders and surging revenue in the...
Tuesday 28 April 2026
Cadence signals strong start to 2026 as AI drives growth across EDA and IP

Cadence Design Systems reported a robust first quarter for 2026, underscoring how accelerating demand for AI is reshaping semiconductor...

Friday 24 April 2026
M31 and TSMC complete eUSB2V2 tapeout on N2P process
IP provider M31 has announced that its eUSB2V2 interface IP has completed tapeout on TSMC's N2P 2nm process. M31 CEO Scott Chang emphasized that 2nm interface IP must align closely...
Thursday 23 April 2026
GUC Announces 3nm 12 Gbps HBM4 PHY and Controller

Global Unichip Corp. (GUC), the advanced ASIC leader, today announced the successful demonstration of a 12 Gbps HBM4 IP platform implemented on TSMC's 3nm process technology...