News tagged IP at DIGITIMES

NEWS TAGGED IP

Thursday 5 November 2026

GlobalFoundries secures nearly US$1 billion in custom chip design wins as it expands into physical AI

GlobalFoundries is gaining traction in custom silicon, processor intellectual property (IP) and physical AI applications, as the chipmaker seeks...

Tuesday 3 November 2026

Ceva takes NeuPro NPU into AI data centers, targeting efficiency gaps rather than Nvidia's dominance

US semiconductor intellectual property (IP) provider Ceva has expanded its NeuPro neural processing unit (NPU) portfolio into AI infrastructure for the first time. At a November 2...

Saturday 31 October 2026

DIGITIMES Insight: Arm extends from IP licensing to server CPU products, with strong growth potential in China

Arm is expanding its business model from licensing Neoverse core IP and compute subsystem (CSS) technologies to selling finished server CPUs for artificial general intelligence (AGI)...

Friday 23 October 2026

Nvidia B300 chips reportedly surface on China Telecom-linked network, raising export-control questions

Israeli security firm Lava identified 32 Nvidia Blackwell Ultra B300 GPUs through monitoring endpoints linked to China Telecom, a state-owned carrier. The chips are barred from sale...

Tuesday 20 October 2026

Alibaba's XuanTie tops 6 billion RISC-V chip shipments, expands into AI servers with C950

Cumulative shipments of chips incorporating Alibaba DAMO Academy's RISC-V processor intellectual property (IP), branded XuanTie, have surpassed 6 billion, marking a milestone for the...

Tuesday 20 October 2026

Analysis: China's proposed AI export controls reach beyond chips to design IP, computing infrastructure

China is proposing to extend AI technology export controls to chip design, memory technologies, and large-scale computing clusters, introducing specific technical thresholds for ea...

Friday 16 October 2026

Qualcomm advances complete AI infrastructure platform as agentic AI reshapes competition

Qualcomm has historically provided standard chips primarily through its Snapdragon product line, serving a broad range of end customers. After officially launching its Dragonfly data...

Monday 12 October 2026

India roundup: AI data center buildout accelerates as semiconductor push continues to broaden

India's technology buildout is deepening across semiconductors and AI infrastructure, with chip IP, packaging and equipment initiatives advancing...

Saturday 10 October 2026

Advanced packaging leads Malaysia's push up the chip value chain as AI reshapes demand, says Yole analyst

Malaysia is moving from traditional semiconductor back-end manufacturing toward higher value-added work, with advanced packaging set to drive growth over the next two to three years,...

Thursday 8 October 2026

Sasken eyes reusable chip IP as India pushes beyond semiconductor design services

India-based engineering firm Sasken Technologies plans to license company-owned semiconductor interconnect intellectual property (IP) to multiple customers, marking an effort to move...

Thursday 8 October 2026

Marvell's custom AI chip upgrade points to a broader fight over peripherals

Marvell's higher long-term target for custom AI chip revenue suggests the market for artificial intelligence hardware is widening beyond accelerators, into management chips, storage,...

Wednesday 7 October 2026

Commentary: Qualcomm patent deal puts spotlight on Huawei's broader IP push

Huawei and Qualcomm announced on Oct. 5 that they had signed a multi-year patent licensing agreement covering technologies including 5G, computing, AI and networking.

Wednesday 7 October 2026

Rapidus adds Malaysian chip designers to its semiconductor network

Japan's Rapidus is widening its semiconductor push with help from four Malaysian IC design firms, a move that could strengthen chip-development support for customers worldwide. The...

Saturday 3 October 2026

Synopsys reshapes EDA, IP business models as AI shifts revenue from seats to customer output

Synopsys is reshaping how it monetizes its two core businesses, electronic design automation (EDA) and semiconductor IP, as AI transforms engineering workflows. Announcements at the...

Friday 2 October 2026

CSPs embrace multi-vendor co-design for custom ASICs, ending single-supplier era

Hyperscale cloud service providers (CSPs) are expanding their custom ASIC partner networks, accelerating a shift toward multi-vendor technology integration. Industry insiders note...

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