News tagged IP at DIGITIMES

NEWS TAGGED IP

Friday 16 October 2026

Qualcomm advances complete AI infrastructure platform as agentic AI reshapes competition

Qualcomm has historically provided standard chips primarily through its Snapdragon product line, serving a broad range of end customers. After officially launching its Dragonfly data...

Monday 12 October 2026

India roundup: AI data center buildout accelerates as semiconductor push continues to broaden

India's technology buildout is deepening across semiconductors and AI infrastructure, with chip IP, packaging and equipment initiatives advancing...

Saturday 10 October 2026

Advanced packaging leads Malaysia's push up the chip value chain as AI reshapes demand, says Yole analyst

Malaysia is moving from traditional semiconductor back-end manufacturing toward higher value-added work, with advanced packaging set to drive growth over the next two to three years,...

Thursday 8 October 2026

Sasken eyes reusable chip IP as India pushes beyond semiconductor design services

India-based engineering firm Sasken Technologies plans to license company-owned semiconductor interconnect intellectual property (IP) to multiple customers, marking an effort to move...

Thursday 8 October 2026

Marvell's custom AI chip upgrade points to a broader fight over peripherals

Marvell's higher long-term target for custom AI chip revenue suggests the market for artificial intelligence hardware is widening beyond accelerators, into management chips, storage,...

Wednesday 7 October 2026

Commentary: Qualcomm patent deal puts spotlight on Huawei's broader IP push

Huawei and Qualcomm announced on Oct. 5 that they had signed a multi-year patent licensing agreement covering technologies including 5G, computing, AI and networking.

Wednesday 7 October 2026

Rapidus adds Malaysian chip designers to its semiconductor network

Japan's Rapidus is widening its semiconductor push with help from four Malaysian IC design firms, a move that could strengthen chip-development support for customers worldwide. The...

Saturday 3 October 2026

Synopsys reshapes EDA, IP business models as AI shifts revenue from seats to customer output

Synopsys is reshaping how it monetizes its two core businesses, electronic design automation (EDA) and semiconductor IP, as AI transforms engineering workflows. Announcements at the...

Friday 2 October 2026

CSPs embrace multi-vendor co-design for custom ASICs, ending single-supplier era

Hyperscale cloud service providers (CSPs) are expanding their custom ASIC partner networks, accelerating a shift toward multi-vendor technology integration. Industry insiders note...

Thursday 1 October 2026

Synopsys and Amazon sign US$1 billion-plus deal to speed custom chip development

Synopsys announced a strategic agreement with Amazon on September 30, a multi-year deal valued at more than US$1 billion that is intended to speed up Amazon's custom silicon work and...

Thursday 1 October 2026

Synopsys raises long-term growth and margin targets, guides fiscal 2027 revenue to US$11.15 billion

Synopsys is betting that custom silicon and AI-driven chip design will lift its growth above the double-digit pace it previously targeted. At its investor day in New York on September...

Wednesday 30 September 2026

VSMC bets on value over cost as Singapore fab builds next-generation R&D and IP capabilities

VisionPower Semiconductor Manufacturing Company (VSMC), the joint venture between Vanguard International Semiconductor (VIS) and NXP Semiconductors, opened its 12-inch wafer fab in...

Tuesday 29 September 2026

GF's MIPS bets on RISC-V physical AI, expands into autos and data centers

MIPS, a GlobalFoundries (GF) unit, said it has completed its integration with the ARC unit acquired from Synopsys earlier this year and is using the move to position RISC-V for physical...

Thursday 24 September 2026

Cadence, Synopsys certify TSMC A14 design flows ahead of 2028 production

Cadence Design Systems and Synopsys have achieved certification for key design flows on TSMC's A14 process, expanding the design ecosystem...

Tuesday 22 September 2026

GUC Announces 2nm 16 Gbps HBM4E IP

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced that its HBM4E PHY and Controller IP is design-ready and has been adopted in customer AI ASICs....

1/45 pages

BIZ FOCUS

Oct 15, 08:00

Samsung Semiconductor Highlights 400+ Layer Flash Powering Agentic AI

MOST-READ
7 DAYS NEWS

Full list