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Tuesday 14 July 2026
Commentary: Terafab and DRAM reveal Tan's long-term vision for Intel

US President Donald Trump recently claimed that Taiwan's TSMC will double the size of its Arizona fab project, reviving attention on...

Tuesday 14 July 2026
AI demand lifts entire Taiwan semiconductor supply chain in June, memory revenue nearly quadruples
All 13 tracked sub-sectors of Taiwan's semiconductor supply chain recorded positive year-over-year revenue growth in June 2026, according to monthly revenue filings, pointing to an...
Wednesday 1 July 2026
Industry 4.0 demand keeps TADC on track for double-digit growth in 2H26
Computer-aided engineering (CAE) solutions provider Taiwan Auto Design (TADC) held an earnings call on June 29, stating that, with collaborative product commerce (CPC) personnel now...
Sunday 21 June 2026
Taiwan memory chip designers set for 245% revenue jump on AI storage demand

Taiwan's memory chip designers are heading into a sharply stronger 2026 as rising memory prices and a wave of AI-driven demand push the...

Thursday 18 June 2026
Exclusive: Penang moves up value chain; Galatek flags deep-tech, IP hurdles
Penang has played a critical role in the global semiconductor back-end industry for decades, particularly in assembly, testing, and packaging (ATP). The region has built a highly competitive...
Monday 8 June 2026
Exclusive: Marvell says AI's copper wall is nearing, with custom silicon and optical I/O set to scale
US chipmaker Marvell took a more visible stance at Computex 2026, with CEO Matt Murphy delivering a keynote speech and senior executives visiting Taiwan to lay out the company's outlook...
Friday 5 June 2026
South Korea's only SRAM-CIM IP firm Articron targets edge AI
South Korean semiconductor IP startup Articron is challenging the traditional AI chip design bottleneck by using a memory-centric architecture, with its self-developed SRAM-CIM compute...
Wednesday 3 June 2026
MIPS CEO makes the case for RISC-V in physical AI at Computex forum
Sameer Wasson, CEO of MIPS by GlobalFoundries, spoke at the MIPS Forum at Computex 2026 on June 3 in Taipei, held at the Taipei Courtyard by Marriott Nangang — one day after...
Wednesday 3 June 2026
GlobalFoundries completes acquisition of Synopsys' ARC processor IP business to build physical AI platform
GlobalFoundries (GF) has completed its acquisition of Synopsys' ARC Processor IP Solutions business, the company announced on June 2. The acquisition adds to GF's existing MIPS subsidiary,...
Monday 1 June 2026
MediaTek touts One MediaTek strategy, upbeat on ASIC ASPs
MediaTek held a media event ahead of Computex, with several top executives taking part as the company highlighted progress in AI data centers and its broader "One MediaTek" strategy...
Thursday 28 May 2026
Synopsys sees hyperscaler chip ambitions fueling AI-related demand
Synopsys said growing demand for artificial intelligence chips from semiconductor companies and hyperscale data center operators is driving broader adoption of its electronic design...
Thursday 28 May 2026
Synopsys raises fiscal 2026 outlook after strong second-quarter revenue growth
Synopsys raised its fiscal 2026 revenue target after reporting a 42% year-over-year rise in second-quarter sales, driven by continued demand for AI-related chip design tools and verification...
Thursday 28 May 2026
Samsung foundry targets robotics, auto AI chips with Cadence platform
Samsung Electronics is preparing to expand its foundry push into physical AI semiconductors through a chiplet platform developed with Cadence, targeting chips for robotics, automotive...
Tuesday 26 May 2026
Chiplet boom puts Taiwan's InPsytech and its AI connectivity IPs in the spotlight
As the global semiconductor industry pivots toward chiplet-based designs — where multiple smaller chips are packaged together rather than built as a single monolithic die —...
Tuesday 26 May 2026
Powerchip unveils 3D AI Foundry with 3D WoW DRAM stacking at COMPUTEX 2026
Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices...