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NEWS TAGGED KING YUAN ELECTRONICS
Monday 22 November 2021
Major US chipmakers gearing up for 6nm Wi-Fi 7 SoCs
Leading Wi-Fi chipmakers Qualcomm, Broadcom and even Intel are keenly developing Wi-Fi 7 SoCs, and may have their chips manufactured at TSMC using 6N RF process, looking to meet the...
Thursday 28 October 2021
Backend firms gearing up to embrace chip demand boom for 5G Android phones
OSATs and IC test solutions providers are all gearing up for a boom in flip-chip (FC) packaging and high-end testing demand for 5G smartphone application processors (APs) featured...
Monday 25 October 2021
OSATs to see strong backend orders for car-use MCUs in 2022-2023
International IDMs are set to raise quotes for automotive MCUs in 2022, and their backend partners in Taiwan are all expected to sustain robust backend momentum through 2022-2023...
Thursday 30 September 2021
Taiwan OSATs grab huge orders from Renesas
OSATs including Ardentec, ASE Technology, King Yuan Electronics (KYEC) and Powertech Technology (PTI) have landed significant backend orders for automotive MCUs from Japan's Renesas...
Wednesday 29 September 2021
Testing houses expect promising demand for MediaTek Wi-Fi chips
MediaTek has been improving its product mix by putting increased focus on Wi-Fi chip solutions to meet robust demand for networking devices, which will effectively bolster testing...
Wednesday 29 September 2021
Backend firms optimistic about demand for smartphone APs in 1Q22
Backend firms have received engineering samples of next-generation smartphone APs from vendors such as Qualcomm and MediaTek, and expect a particularly strong first-quarter 2022 for...
Monday 27 September 2021
OSATs in Suzhou concerned more about labor shortage than power reduction
Taiwan's OSATs have seen their plants in Suzhou, Jiangsu province little affected by a power supply cut enforced by China under its carbon reduction policy, but they are more concerned...
Tuesday 7 September 2021
ASE steps up recruiting engineers for 5G, networking, automotive chips
OSAT ASE Technology has kicked off its recruitment campaign with plans to hire 2,000 engineers by the end of this year to deepen its backend deployments for the 5G, networking and...
Tuesday 31 August 2021
Quotes for wirebonding packaging to rise in 1H22
Backend houses are expected to raise their quotes for wirebonding packaging in the first half of 2022 to reflect higher material costs, according to industry sources.
Monday 30 August 2021
OSATs to sustain tight testing capacity well into 2022
Taiwan's OSATs are expected to sustain tight capacity supply for chip probing and final test operations through 2022, as the visibility of their orders, particularly from international...
Monday 30 August 2021
Taiwan chip vendors to gain influence in 2022 with major advantages
Taiwan chip vendors including MediaTek will continue to play an influential role in the global high-tech sectors in 2022 with major advantages including strong IC design prowess,...
Tuesday 17 August 2021
Backend houses enjoy strong influx of orders for automotive CIS
Taiwan-based backend houses, including Tong Hsing Electronic Industries, King Yuan Electronics (KYEC), and Xintec, have seen orders from international IDMs continue ramping up for...
Wednesday 4 August 2021
Testing houses to see strong 1Q22
Taiwan-based IC testing houses including King Yuan Electronics (KYEC), Sigurd Microelectronics and Ardentec are all expected to post a particularly strong first quarter of 2022, as...
Wednesday 4 August 2021
Taiwan backend houses bracing for robust China mature-node chips demand
Taiwan-based IC backend houses are gearing up for robust packaging demand for mature-node chips from foundries in China, as the supply of such chips is increasingly short of demand...
Friday 23 July 2021
Automotive IC IDMs in talks with OSATs about demand in 2022
First-tier automotive IC IDMs in the US, Japan and Europe have reportedly approached OSATs including ASE Technology, Powertech Technology (PTI) and Greatek Electronics to book backend...