Researchers at the Chinese Academy of Sciences (CAS) have developed a solid-state deep ultraviolet (DUV) laser that emits 193nm light in lab conditions—a wavelength critical...
The annual Taipei International Machine Tool Show (TIMTOS) opened on March 3, 2025, showcasing key technologies developed by organizations funded by the Department of Industrial Technology...
To curb China's domestic advancements in semiconductor technology, particularly in photolithography, the US Department of Commerce (DOC) has recently intensified its efforts against...
Megaforce, a Taiwan-based leader in precision plastics molding, laser optics, and biomedical solutions, is ramping up its focus on AI applications. The company now offers system integration,...
Innolux has partnered with equipment manufacturer Contrel and the Industrial Technology Research Institute (ITRI) to establish a through-glass vias (TGV) process verification system...
Atotech, MKS Instruments' globally leading brand in surface-finishing solutions, will participate in one of the most important PCB events, the 25th Taiwan Circuit Industry...
China has made notable progress in lithography technology, but its new machine still lags behind the most advanced global technologies. While this development is significant, it's...
Hubei Jiufengshan Laboratory, with CNY8.2 billion (approx. US$1.12 billion) subsidy from the Chinese government, has integrated a laser light source into a silicon chip, marking a...
Broadcom business development manager for co-packaged optics (CPO) Tzu How Chow introduced and discussed various optical communications technologies during the Power and Opto Semiconductor...
Ams Osram has unveiled its new China Development Center (CDC), a hub for product marketing, system solutions, applications engineering, and supply chain innovation. The CDC is strategically...
As the number of DRAM stacks in high bandwidth memory (HBM) increases, there will be new developments in Through-Silicon Via (TSV) materials, focus rings and debonding technology...
Samsung Electronics and SK Hynix are investing in R&D of new process technologies to prevent warpage in next-generation high-bandwidth memory (HBM). This move is anticipated to...
With photonic integrated circuits, above all silicon photonics, seeing a wave of industry hype owing to their vast potential in the datacom and telecom applications, relevant suppliers...
