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Saturday 5 September 2026
SiPh, optical lens demand ignite laser race
Silicon photonics (SiPh) is emerging as a core theme at SEMICON Taiwan 2026, and while the sector is still in an early, fast-growing stage, production-line investments are already...
Friday 4 September 2026
CPO high-density optical interconnects drive E&R's submicron 2D FAU breakthrough
To meet next-generation high-speed optical interconnect demand, fiber array units (FAU) are moving from traditional one-dimensional layouts to high-density two-dimensional (2D) architectures,...
Thursday 3 September 2026
TRUMPF targets advanced packaging as AI chip makers chase higher density, better cooling
As AI chips grow more powerful, the race is shifting beyond transistor scaling to packaging, glass substrates, and thermal control. For global readers, that means the next gains in...
Wednesday 2 September 2026
TCL CSOT bets on InP laser chips as supply tightens
Indium phosphide (InP) is emerging as one of the tightest supply constraints in AI data-center optical interconnects. Lumentum CEO Michael Hurlston has said publicly that the supply-demand...
Tuesday 1 September 2026
Trymax lands multi-year AOI order as InP laser capacity race tightens
Applied Optoelectronics (AOI) has placed a multi-year purchase order with Dutch equipment maker Trymax Semiconductor Equipment for plasma ashers and UV curing systems destined for...
Tuesday 1 September 2026
Taiwan's G2C+ Alliance members target global markets
Artificial intelligence (AI) chips are driving a new wave of integration competition among Taiwan semiconductor equipment makers. Taiwan's G2C+ strategic alliance, comprised of C Sun,...
Monday 31 August 2026
Tescan Connects Buried Defect Localization to Nanoscale Analysis at SEMICON

Tescan will participate in SEMICON Taiwan 2026 from September 2 to 4 at Booth R8201, 4F, Taipei Nangang Exhibition Center Hall 2 (TaiNEX 2). Under the theme "Streamlined...

Monday 31 August 2026
Lightel posts record first-half revenue, profit as LEO satellite demand rises
Lightel Technologies reported record first-half results for 2026, with consolidated revenue reaching NT$590 million (US$18.7 million), net profit at NT$107 million, and earnings per...
Monday 31 August 2026
USI advances optical interconnect push with ELSFP laser module
Universal Scientific Industrial (USI), part of ASE Technology Holding, is expanding its optical interconnect footprint for AI data centers. EugenLight Technologies, in which USI holds...
Monday 24 August 2026
CPO hurdles linger as 800G and 1.6T SiPh surge, says analyst
Challenges around co-packaged optics (CPO) remain unresolved, but they have not slowed the rapid rise of 800G and 1.6T silicon photonics, DIGITIMES analyst Kiwi Hsu said on August...
Friday 21 August 2026
Automation Taipei 2026: The invisible joint — why aerospace lightweighting is rewriting how parts are built
The aerospace industry's pursuit of lighter structures has long centered on advanced alloys, composites and additive manufacturing. But as aircraft and spacecraft shed weight, another...
Thursday 20 August 2026
AI robotics opens a bigger prize for Taiwan's precision manufacturing supply chain

Intelligent Asia 2026 opened on August 19 at TaiNEX 1 and TaiNEX 2 in Taipei, with industry and government speakers repeatedly returning...

Tuesday 18 August 2026
LG Electronics lands first OSAT order for chip packaging LDI

LG Electronics has secured its first order for laser direct imaging (LDI) equipment used in semiconductor packaging, marking an early...

Monday 17 August 2026
China's Vertilite commits US$741M to InP laser chips for AI optical interconnects
Chinese optical chipmaker Jiangsu Vertilite Semiconductor Technology is investing CNY5 billion (approx. US$741 million) in a new communications chip and device R&D and manufacturing...
Monday 17 August 2026
WaveSplitter returns to profit as AI optics demand lifts 1H revenue

WaveSplitter posted NT$477 million (US$14.95 million) in consolidated revenue in the first half of 2026, up 47% from a year earlier,...