Amid a global surge in semiconductor production, worries about excess capacity are on the rise. The recent tightening of US trade sanctions on semiconductor equipment bound for China...
All major DRAM chipmakers have prioritized DDR5 and high-bandwidth memory (HBM) in anticipation of a surge in demand from generative AI, according to industry sources.
Despite odds and challenges amid tightening US restrictions, Huawei Technologies continues to carry on innovation efforts as the company recently announced its 2023...
China's Yangtze Memory Technologies (YMTC) has filed a patent infringement lawsuit with a US court against American chipmaker Micron Technology, marking the first time a Chinese chipmaker...
Amid an attempt by US President Joe Biden to ease the US-China tension in an APEC summit with his Chinese counterpart, Yangtze Memory Technologies Co (YMTC) filed a lawsuit on November...
Micron Technology has announced a 32GB monolithic die-based 128GB DDR5 RDIMM memory with up to 8000 MT/s speed to satisfy today's and future data center applications. These high-capacity,...
The China International Import Expo (CIIE) 2023 kicked off in Shanghai on November 5, and the organizer is seeing more US semiconductor companies joining the event than ever despite...
Micron Technology expects to kick off volume production of HBM3E memory at its factory site in Taiwan, which the memory chipmaker considers a hub for advanced packaging, in the first...
Micron Technology, Inc., today announced the grand opening of its Advanced Assembly and Test Taiwan (AATT) facility at its Taichung site . The landmark, five-level building will enable...
A recent TechInsights analysis indicates that Yangtze Memory has developed advanced 3D NAND memory for consumer devices. The research firm characterizes the device's appearance in...
Micron Technology has announced that production samples of its low-power double data rate 5X (LPDDR5X) memory, which the company claims is the industry's only 1-beta mobile-optimized...
Some predictions suggest that as DRAM technology development is gradually approaching a bottleneck, hybrid bonding technology may be introduced into future DRAM manufacturing processes...