ROHM Co., Ltd. (hereinafter "ROHM") has decided to integrate its own development and manufacturing technologies for GaN power devices with the process technology of TSMC,...

Luna, the health-tech company behind the Luna Ring today announced the launch of LifeOS V1, a foundational upgrade to the Luna Ring that introduces one of the first truly...

Teamsworld Innovation Inc. announced its AI-powered manufacturing matchmaking platform, targeting multinational enterprises seeking to diversify supply chains. The platform...

XTPL (WSE:XTP), a developer of Ultra-Precise Dispensing (UPD) technology for nanomaterial deposition, has entered a strategic partnership with Manz Asia to support the...

Seoul, February 26, 2026 – SK hynix Inc. (or "the company", www.skhynix.com) and Sandisk Corporation held 'HBF Spec. Standardization Consortium Kick-Off' event...

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced it has successfully taped-out industry-leading, Universal Chiplet Interconnect Express. (UCIe.)...

ASUS today announced ASUS Optimized Liquid-Cooling Solutions and a strategic partner framework designed to address the escalating thermal, power, and density challenges...

Tong Hsing Electronic, a global leader in semiconductor assembly and testing services, today announced a strategic collaboration with Singapore-based AI solutions provider...

QuiX Quantum, a leading provider of photonic quantum computing hardware, and Artilux, a developer of advanced semiconductor-based photonic detector technologies, today...

iCatch Technology, a Taiwan leading image processing SoC and solution provider and DXOMARK, the global authority in image quality evaluation as well as provider of imaging...

Entering 2026, the electronics supply chain is defined by strong demand, shifting trade policies, and ongoing geopolitical uncertainty. Customers increasingly seek supply...

Attopsemi, a pioneering provider of innovative One-Time Programmable (OTP) IP solutions, today announced a significant technological leap: its proprietary I-fuse technology...

Tactile sensing is rapidly emerging as a critical foundation for next-generation applications across consumer electronics, robotics, automation, healthcare, manufacturing,...

The Asia FinTech Alliance (AFA) recently announced the results of its latest leadership election, conducted in full accordance with the AFA Bylaws unanimously adopted...

DesignCon, the United States' premier annual gathering for chip, board, and systems design engineers, returns to the Santa Clara Convention Center from February 24-26,...