Entering 2026, the electronics supply chain is defined by strong demand, shifting trade policies, and ongoing geopolitical uncertainty. Customers increasingly seek supply...
Attopsemi, a pioneering provider of innovative One-Time Programmable (OTP) IP solutions, today announced a significant technological leap: its proprietary I-fuse technology...
Tactile sensing is rapidly emerging as a critical foundation for next-generation applications across consumer electronics, robotics, automation, healthcare, manufacturing,...
The Asia FinTech Alliance (AFA) recently announced the results of its latest leadership election, conducted in full accordance with the AFA Bylaws unanimously adopted...
DesignCon, the United States' premier annual gathering for chip, board, and systems design engineers, returns to the Santa Clara Convention Center from February 24-26,...
The "From Shenzhen to Global Opportunity: BIWIN Mini SSD Ecosystem Application Seminar", jointly hosted by BIWIN and Intel, was successfully concluded at the Intel Greater...
SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has achieved record financial results in 2025 – 97.1467 trillion won in revenue, 47.2063...
Collaboration combines GUC's ASIC design leadership with Lightmatter's industry-leading 3D CPO platform to redefine AI infrastructure scalability.Lightmatter, the leader...
The Ministry of Economic Affairs (MOEA) officially announced the launch of the 2026 Best AI Awards during a press conference held on January 20, 2026. This prestigious...
iCatch Technology
Trymax Semiconductor B.V. provides plasma-based etching, stripping, and curing process equipment for advanced semiconductor packaging, targeting applications in dry descum,...
AGI Technology, the innovative Taiwanese memory brand, has successfully concluded its showcase at CES 2026. Located at Bellini 2001B in The Venetian Resort, Las Vegas,...
HQ Pack is a global leader in high-tech packaging solutions. The company is expert at designing, producing, (precision) cleaning, and making packaging solutions reusable...
Generative AI is fueling accelerated growth in worldwide computing power requirements, yet the industry encounters significant challenges. Although the product cycle...
