MediaTek has shown remarkable resilience in the typically slow second quarter, with revenue steady compared to the previous three months. This performance suggests the company has...
Applied Materials introduced the industry's first use of ruthenium in high-volume production, enabling copper chip wiring to scale to the 2nm node and beyond while reducing resistance...
The US government's export ban on Nvidia's high-end AI chips has spurred efforts in China to produce domestic AI chips to meet the burgeoning demand in the country's AI sector.
TSMC recorded its financial performance in line with market expectations, with consolidated revenue in June at NT$207.869 billion, down 9.5% month-on-month but up 32.9% compared to...
Samsung Electronics has announced that it will provide turnkey semiconductor solutions using the 2-nanometer (nm) foundry process and the advanced 2.5D packaging technology Interposer-Cube...
The rapid development of large language models (LLMs) in China has led to various development bottlenecks for AI, including complex computing power management, high training and inference...
Samsung Electronics is reportedly developing a new packaging technology to address the overheating of mobile application processors (APs), which may be applied to its next-generation...
Acer has received positive feedback from channel retailers for its AI PCs and expects its core operations in the second half of the year to outperform the first half. On July 8, the...
Taiwan's major outsourced semiconductor assembly and test (OSAT) service providers, including ASE Group, Powertech Technology, King Yuan Electronics (KYEC), and Sigurd Microelectronics,...
Apple has reportedly increased production orders for its new A18 processor following the debut of Apple Intelligence at the 2024 Worldwide Developers Conference (WWDC24). This move...
The prices for general-purpose DRAM and NAND flash chips have remained flat for four consecutive months, suggesting a slower-than-expected pace of demand recovery.
The depletion of supply chain inventory, originally expected by late 2023, has been delayed to the first half of 2024 due to weak end-market consumption. However, the upcoming launch...
As cooling becomes a key issue for data centers, especially with liquid cooling solutions gaining prominence, in the past few years Taiwan-based IC design firms such as Weltrend and...
According to recent market rumors, major mobile SoC makers Apple, Qualcomm, and MediaTek will all adopt the more advanced N3E process for their flagship mobile SoCs in the second...
