The US government is considering imposing restrictions as early as August to restrict China's access to crucial High Bandwidth Memory (HBM) chips and related manufacturing equipment...
Samsung Electronics has released its financial report for the second quarter of 2024, revealing that its Mobile Experience (MX) division, despite showing improved revenue compared...
SK Hynix is reportedly considering an initial public offering (IPO) for its solid-state drive (SSD) subsidiary, Solidigm, in the US, following a surge in demand for enterprise SSDs...
As the flagship smartphone AP battleground officially enters the 3nm era in the second half of 2024, MediaTek, Qualcomm, and Apple are all said to be preparing chips with vast performance...
Samsung Electronics' HBM3E memory is in the final stages of its qualification test for a significant client, and shipments are expected to commence as early as August, according to...
Samsung Electronics has implemented the Overall Performance Incentive (OPI) reward system for over 20 years. In response to employee demands and to retain talent, the company is reportedly...
Samsung Electronics announced its financial results for the second quarter of 2024, reporting revenue of KRW74.07 trillion (approximately US$53.3 billion) and an operating profit...
Taiwan Fertilizer Company (TFC) is accelerating its industrial transformation by forging new partnerships with major international firms from Japan and South Korea, focusing on ammonia...
Samsung Electronics is preparing to launch its slimmest high-end foldable smartphone yet, the Galaxy Z Fold6 Slim. According to recent reports, this new model will boast a thickness...
Glass Core Substrate (GCS) is becoming a trend that major players in the semiconductor supply chain are avidly pursuing. LG Innotek is reportedly contacting material, components,...
South Korean media have recently forecasted that the investment strategies of South Korean and Taiwanese semiconductor firms in the United States could shift depending on the outcome...
Samsung Electronics is ramping up investment efforts in AI chip startups to strengthen its competitiveness in new-generation AI semiconductor technologies.
TSMC has made a production roadmap for using high-NA EUV lithography equipment to make 1.4nm chips starting as early as 2028, according to industry sources.
Japan is actively striving to revive its semiconductor industry and develop cutting-edge chips by leveraging its expertise in materials and equipment for back-end processes to venture...
